在半導體製程設備當中，速度是非常重要的考量因素；如何在最短的時間內，生產出最多的產品，一直是所追求的目標。在半導體後段製程當中，晶片往往需要不斷地傳輸運送；因此晶片的取放是相當關鍵的技術，因此晶片快速取放機構也扮演著重要的角色。
目前，III-V族半導體快速植晶設備，仍需仰賴國外的設備，國產設備雖具備部分技術，但由於晶粒快速取放之整合技術仍與美、日、歐有所差距再加上取晶過程中晶粒易破損，以致廠商在競爭力上仍有很大的進步空間。因此，如何針對III-V族半導體晶粒之特性，發展所需高速且穩定性高之晶粒取放技術，是當前刻不容緩的工作，其中最重要的就是晶片在進行取放時機台速度的穩定性與精度的問題。
因此針對植晶機之取放機構利用電腦輔助分析（CAE）的技術：有限元素分析法，模擬植晶機所發展之『晶粒高速取放機構』之靜態、動態及模態模擬等分析，以期能藉此模擬與評估，讓所發展的設備能符合市場需求的性能與規格。

High speed is an important issue in semiconductor equipments, the main goal of an equipment is always to gain the maximum production at the shortest time, the dice need to be transferred frequently during the semiconductor back-end processes, the pick and place mechanism plays an important role in the semiconductor processing equipment.
Most of the Die Bonders of III-V semiconductor industry count on imported facilities, some domestic companies are capable of fabricating the equipment, the quality is still not as good as the imported ones since the dice and so fragile.
The development of high speed dices picking-and-placing mechanism with high stability is the immediate demand of the market. Aim to the mechanism development of Die Bonder’s picking-and-placing function, this thesis applied the technique of CAE, to simulate the characters of “high velocity of picking-and-placing mechanism”, the simulation included static, dynamic and modal analysis, this thesis also did optimization analysis by Taguchi method to design, the mechanism to a close to optimal condition, all these analysis can be used as reference for the design engineers.

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