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研究生： 蔡德昌
Tsai, De-Chang
論文名稱： 球墨及矽晶第二相顆粒對球墨鑄鐵及鋁-矽合金放電加工特性之效應探討
A Study on the Effects of Spheroidal Graphite and Silicon Second Phase Particles on EDM Characteristics of SG Cast Irons and Al-Si Alloys
指導教授： 陳立輝
Chen, Li-Hui
呂傳盛
Lui, Truan-Sheng
學位類別： 博士
Doctor
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2003
畢業學年度： 91
語文別： 中文
論文頁數： 167
中文關鍵詞： 峰點密度 、材料去除率 、放電加工 、第二相顆粒
外文關鍵詞： Materials removal rate, EDM, Second phase particles, Ridge density
相關次數： 點閱：66  下載：1 
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    • 　　本研究之目的在探討第二相對共晶模具材料放電加工特性之效應，實驗材料選擇最具代表性之共晶型兩相材料，一為肥粒體基球墨鑄鐵（2.1wt.%C~4.1wt.%C, 2.0wt.%Si~4.9wt.%Si），另一種為鋁-矽合金（Al-1wt.%Si~29 wt.%Si）。研究方針主要針對放電加工材料去除率之放電加工電學條件以及共晶試料之第二相效應加以釐清，有系統改變之實驗數據包括各試料之化學組成、凝固速率與放電加工條件。

    　　上述兩種共晶型合金試料之物性縱使明顯廻異，但是實驗結果共通性顯示，肥粒體基球墨鑄鐵與鋁-矽合金在銅電極為正極性時有較大的材料去除率，且其材料去除率隨著加工電流增加而增加，而隨著加工面積及加工時間增加而降低。當放電脈衝時間與衝擊係數增加時，兩者試料的放電加工材料去除率皆有隨之先增後降之趨勢。實驗試料的第二相面積率、粒徑以及型態變化對放電加工速率亦具有依存性。

    　　當肥粒體基球墨鑄鐵之球墨平均粒徑細化與顆粒數增加時，材料去除速率顯示增加傾向，而當球墨面積率增加時，材料去除速率也有先增後降之趨勢。根據加工表面之次表面觀察結果，肥粒體基球墨鑄鐵在放電脈衝時間時，由於熔湯與未完全融化之球墨顆粒之間的濕潤性不佳，導致放電加工表面之球墨周圍形成凹點，而遠離球墨處則形成峰點，而且此放電加工表面之峰點密度會隨著球墨粒徑細化與顆粒數增加而增加。

    　　另一方面以鋁-矽合金而言，矽顆粒粒徑及面積率的增加對鋁-矽合金放電加工之材料去除率亦為增加傾向。鋁-矽合金由放電加工面之次表面觀察可知，峰點位置大多會在矽晶顆粒上方形成，且峰點密度隨著初晶矽尺寸及矽顆粒面積率增加而增加。因放電火花會發生在電極及試料表面的峰點上，故峰點密度愈大則放電密度也較大，進而導致材料去除率有增大之傾向。

    　　經由本研究對具第二相之肥粒體基球墨鑄鐵與鋁-矽合金之放電加工特性探討，確認基材中不論軟質的球墨或硬質的矽顆粒對放電加工材料去除率皆具有主導性之要因，並且釐清了第二相對放電加工過程中材料之去除行為機制。

    　　The Electro Discharge Machining (EDM) features of the eutectic molding material with second phase were investigated in this study. Ferritic spheroidal graphite (SG) cast irons (2.1wt.%C~4.1wt.%C, 2.0wt.%Si~4.9wt.%Si) and Al-Si alloys (Al-1Si~29Si) were selected as testing materials. Effects of compositions, solidification rate, and EDM parameters were examined.

    　　Experimental results indicated that the materials removal rate of the ferritic SG cast irons by EDM increased with a smaller graphite size and higher graphite nodule count. As for Al-Si alloys, the second phase, including primary and eutectic silicon particles, had remarkable effects on EDM characteristics. That is, higher primary silicon particles size and higher area fraction of silicon particles would accelerate the removal rate. The EDMed surfaces featured continuous ridges formed by overlapping discharge craters, and the ridge density also tended to increase with a finer graphite nodule size. Owing to the poor wettability between the cast iron melts and semi-molten graphite during solidification process, graphite particles were embedded in the cavities in-between the ridges. The Al-Si alloys EDMed surface feature was similar to that of SG cast irons, showing a wavy ridge pattern. The amount of silicon phase also affected the surface roughness. Notably, silicon particles were located in the ridge regions, not the troughs.

    　　Finally, through this study that concerns the EDM characteristics of SG cast irons and Al-Si alloys, the effects of the heterogeneous second phase can be clearly clarified. This could serve as the practical reference for electro-discharge machining of mold materials with heterogeneous second phase and other engineering materials.

    第一章 緒論 1 第二章 研究背景及文獻回顧 3 　2-1放電加工過程中材料去除研究之基本事項 3 　2-2放電加工材料去除率之研究現況 6 　　2-2-1影響材料去除率之加工電學加工參數要因 6 　　2-2-2鑄鐵放電加工材料去除率微觀組織效應之釐清 7 　　2-2-3鋁合金放電加工材料去除率微觀組織效應之釐清 8 　2-3本研究選擇球墨鑄鐵與鋁-矽合金進行探討之原因 11 　　2-3-1肥粒體基球墨鑄鐵 11 　　2-3-2鋁-矽合金 12 第三章共晶兩相材料微觀組織中之第二相對放電加工特性之效應 19 　3-1前言 19 　3-2實驗方法與步驟 20 　　3-2-1放電加工實驗電學加工參數之探討 20 　　3-2-2 Fe-3.5C-2.8Si 及Al-11Si合金之試料備製與金相 21 　3-3實驗結果 22 　　3-3-1 Fe-3.5C-2.8Si與Al-11Si之材料去除率及電極消耗率之比較 22 　　3-3-2 Fe-3.5C-2.8Si與Al-11Si之放電加工面觀察 24 　3-4討論 25 　　3-4-1材料去除率之放電加工電學參數條件效應 25 　　3-4-2 急速凝固層之形成與放電加工速率之間關係 29 　　3-4-3 電極消耗率與放電脈衝時間之異質第二相效應 31 　3-5結論 32 第四章 球墨對肥粒體基球墨鑄鐵放電加工特性之效應檢討 61 　4-1前言 61 　4-2實驗方法與步驟 61 　4-3實驗結果 63 　　4-3-1球墨顆粒數及粒徑與材料去除率之關係 63 　　4-3-2球墨顆粒數及粒徑與急速凝固層厚度及電極消耗率之關係 63 　　4-3-3球墨面積率及顆粒數與材料去除率之關係 64 　　4-3-4急速凝固層之峰點形成與微觀組織解析 64 　4-4討論 66 　　4-4-1球墨顆粒對材料去除率之效應 66 　　4-4-2急速凝固層之組織解析 69 　4-5結論 69 第五章 矽顆粒對鋁-矽合金放電加工特性之效應檢討 98　 　5-1前言 98 　5-2實驗方法與步驟 98 　5-3實驗結果.100 　　5-3-1放電加工條件之效應 100 　　5-3-2矽顆粒之效應 100 　　5-3-3急速凝固層之峰點 101 　　5-3-4急速凝固層之微觀組織解析 102 　5-4討論 103 　　5-4-1矽顆粒與材料去除率之關係 103 　　5-4-2急速凝固組織 105 　5-5結論 106 第六章 異質相對放電加工材料去除率之促進效應機制探討 131 　6-1前言 131 　6-2肥粒體基球墨鑄鐵與鋁-矽合金基地中異質第二相對材料去除率影響之效應 131 　6-3異質相之促進效應 135 　6-4急速凝固層峰點形成之第二相效應 140 　6-5 結論 141 第七章 總結論 155 第八章 參考文獻 158

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