本論文使用有限元素分析軟體ANSYS-Workbench分析設備製程動作中的瞬態行為，主要是以軟體模擬方式去匹配實際的實驗結果。研究共分為兩階段進行，第一階段使用電子萬能試驗機進行薄型QFN三點彎曲測試的實驗，取得實際產品失效時的最大破壞荷重與變形量，接著將實驗之最大破壞荷重套入ANSYS軟體進行分析，以觀察該變形量與實際的實驗結果是否相符，以此收斂薄型QFN幾何模型的可靠度；第二階段以驗證過的幾何模型加入供料模組分離器系統的邊界條件，模擬現行設備的製程動作，在假設薄型QFN完美以面撞擊限位塊與產生偏擺並上浮以點撞擊限位塊的兩種型態，找出導致不良品產生的問題。本論文以兩個方案進行改善分析，方案1變更限位塊的材質，以提高吸收衝擊能力；方案2減緩薄型QFN撞擊前的移動速度，以降低衝擊力產生。最後改善結果，不良率由每一百萬顆有33顆不良品，最終下降至每一百萬顆僅有5顆不良品左右，可有效的改善了薄型QFN於供料模組分離器系統的品質。

This research employs the finite element analysis software ANSYS to study the behavior in equipment manufacturing process, and mainly focuses on the comparison between the results of ANSYS simulation and actual experimental data. This research contains two parts, the first part is to use the universal testing machine to conduct three-point bending test on the extra thin QFN electronic packages to obtain the data of the ultimate load and deformation. Next, load the related data to ANSYS, set related conditions to proceed the analysis, observe the deformation corresponding to real situation, and adjust the extra thin QFN electronic package geometry model. The second part is to add the boundary conditions of feed module separator and use ANSYS to simulate the current manufacturing process. Next, determine stress distribution of the defective products under the assumption that the extra thin QFN electronic packages hit the limited block with the flat side and with the sharp point. This thesis considers two improvement plans, plan 1 is to change the material of limited block to have better shock absorbency; plan 2 is to slow down the extra thin QFN electronic packages before it hits the limited block to reduce the shock. The final result shows that the defective rate lowers from 33 pieces to 5 pieces defected per million. The quality of the extra thin QFN electronic packages in feed module separator is greatly improved.

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