本研究主要針對銅導線架晶座底層(Bottom paddle)與膠餅(Epoxy molding compound , EMC)間所產生的脫層(Delamination)現象作研究。將實驗分為兩組，一組為只經歷黏晶粒與烘烤製程(Die attachment and epoxy curing);另一組為僅經銲線製程(Wire bonding)，而後進行封裝(Molding)及封裝後烘烤(Post molding cure, PMC)等後續一連串製程；最後藉由掃描式超音波顯微鏡(C-Mode Scanning Acoustic Microscope, C-SAM)及電子掃描顯微鏡(Scanning Electron Microscopy, SEM)等儀器，來輔助判斷是否會發生導線架底座與膠餅間的脫層現象。而結果顯示:
　1.黏晶粒與烘烤製程比較於僅有焊線製程，較易有發生導線架晶座底層脫層的危機。
　2.可得較佳的烘烤製程參數，其溫度範圍約在160 至 190˚C間，如果在低於160或高於190˚C，將可能會發生脫層現象。
　3.烤箱中有或無氮氣的充填，對銀膠的固化有絕對的影響，但不一定會產生導線架晶座底層的脫層。

　　依現行導線架的IC封裝模式製程中，脫層在IC封裝中是一種重大的品質異常現象，且對產品本身的可靠性(Reliability)有絕對關鍵因素。而如何加以防制以預防於未然，俾利良率的提升，實在是刻不容緩需解決的問題。本論文以實驗為主，將脫層現象予以求證，而獲得較佳的製程參數以及探討發生的主因，這些探討對於製程改善及防治脫層的發生，將有正面的實質效益。

　　This thesis were mainly researched to addressed the occurrence of delamination phenomenon between the interface of epoxy molding compound (EMC) and bottom paddle of the lead frame during assembly process.

The said experiment was performed into two parts:
　One was only to performed by dispensing die attached epoxy adhesive on die paddle then performed to next stage by curing epoxy using the conventional oven with/without has an N2 flow rate circulating inside during curing process.
　Secondly, the other experiment was performed by using a bare copper lead frame into the wire bonding machine to simulate if the bottom paddle will absorb some heating oxidation from the heater block with 230 deg C surface temperature during wire bonding process.

　　After the two experiments are done through above procedures and conditions both will carried out to molding process to encapsulate the units and continue process until to form and singulation stage.

　　To check delamination phenomenon between epoxy molding compound and bottom paddle of the lead frame it uses the C-SAM methodology (C-Mode Scanning Acoustic Microscope) to check the delamination performance.

The results were as shown below:
　1. The dispensed die attached adhesive on die pad and epoxy curing process using the conventional oven has a higher occurrence delamination compared to dry running on wire bonding process.
　2. It can obtain to optimize parameters between 160 and 190˚C for epoxy cure processing.
　3. In the conventional oven whether to filled with or without N2 flow rate absolutely can affect the efficient of epoxy curing but uncertain the occurrence of delamination on the bottom paddle.

　　At present, the delamination still is a major concern in terms of quality and reliability for lead frame packaging. How to avoid the cause and promoting yield rate in which to become a very important issue and need to be improve at continuously.

　　This thesis demonstrated by experiment and reappeared deviation for delamination to be verified.

　　Finally, to obtain the optimum parameters and research for determining the root cause and these viewpoints have a positive efficiency for process improvement to control the delamination occurrence.

[1]. B. Wang, X. Sun, Q. S. Fan and Y. Yin, “Numerical simulation of interfacial
delamination in electronic package,” Thermal and Thermomechanical Phenomena in Electronic Systems, Vol.1, pp.404, 2000.

[2]. G. S. Ganesan, G. L. Lewis, T. Anderson, H. M. Berg, “Organic contamination in IC Package Assemble and Its Impact on Interfacial Integrity,” Electronic Components and Technology Conference, pp. 68 – 70, 1996.

[3]. A. Paproth, K. J. Wolter, T. Herzog, T. Zerna, “Influence of Plasma Treatment on the Improvement of Surface Energy,” Electronics Technology Concurrent Engineering in Electronic Packaging, pp.37-41, 2001.

[4]. A.O. Tay, G. L. Tan, “A criterion for predicting delamination in plastic packages,” Reliability Physics Symposium, pp.236-243, 1993.

[5]. B. H. Moon, H. Y. Yoo, K. Sawada, Optimal oxidation control for enhancement of copper lead frame EMC adhesion in packaging process,” Electronic Components and Technology Conference, pp.1148 – 1153, 1998.

[6]. E. Takano, T. Mino, K. Takahashi, K. Sawada, S.Y. Shimizu, H. Y. Yoo, “The Oxidation Control of Copper Lead frame Package for Prevention of Popcorn Cracking,” Electronic Components and Technology Conference, pp.78 – 83, 1997.

[7]. C. T. Chong, Alan Leslie, L. T. Beng, “Investigation on the Effect of Copper Lead frame Oxidation on Package Delamination,” Electronic Components and Technology Conference, pp. 463 – 469, 1995.

[8]. Y. Tomioka, J. Miyake, “Oxide adhesion characteristic of lead frame copper alloys,” Electronic Components and Technology Conference, pp. 714 – 720,1999.

[9]. L. T. Nguyen, M.M. Michael, “Effects of Die pad Anchoring on Package Interfacial Integrity,” Electronic Components and Technology Conference, pp. 930 – 938, 1992.

[10]. S. J. Hwang, , H.H. Lee, C.H. Chuang, and D.Y. Huang, “Effects of Process Parameters on the Mold Adhesion Force in IC Encapsulation Process,” Advanced Packaging Materials, pp. 166-171, 2002.

[11]. M. J. Ko, M.W. Kim, D.S. Shin, Y. G. Park, M. S.Moon, I. H. Lim, “Investigation on the Effect of Molding Compounds on Package Delamination,” Electronic Components and Technology Conference, pp. 1242 – 1247, 1997.

[12]. L. T. Nguyen, “Reactive Flow Simulation in Transfer Molding of IC package,” Electronic Components and Technology Conference, pp. 375-390, 1993.

[13]. NTB Store “Electronic Materials Handbook,” Vol.1, pp.1-1140 (ASM international, 1989.)

[14]. A. Tanaka, T. Asano, S. Oizumi, K. Niwa, T. Nishjoka, “Flow Analysis of Semiconductor Encapsulating Material,” Electronic Components and Technology Conference, pp. 134 – 140, 1994.

[15]. S. Ohizumi, M. Ngasawa, K. Igarashi, M. Kohmoto, S. Ito, “Analytical and Experimental Studies for Designing Molding Compounds for Surface for Designing Molding Compounds for Surface Mount Devices,” Proc. 42nd ECTC Conference pp 632-640 1990.

[16]. G. L. Ang, L.C. Goh, K.W. Heng, and S. K. Lahiri, “Oxidation of Copper Lead Frame,” Physical & Failure Analysis of Integrated Circuits, pp. 218 – 220, 1995.

[17]. ASM Intl, “ASM handbook, Corrosion: Fundamentals, Testing, and Protection, ” Vol. 13A, pp 610-640, 1987.

[18]. S. Altimari, S. Golwalkar, P. Boysan, and R. Foehringer, “Role of Design Factors for Improving Moisture Performance of Plastic Packages,” Electronic Components and Technology Conference, pp. 945-950, 1992.
[19]. J. E. Semmens, S. R. Martell, L. W. Kessler, “Analysis of BGA and Flip Chip Interconnections using Acoustic Micro Imaging,” IAMIS January 29-30, 1996.

[20]. M. C. Chao, Z. Wang, Z. N. Huang, S.Y. Pao, C. S. Lam, “Accurate explicit formulae of the fundamental mode resonant frequencies for FBAR with thick electrodes,” Frequency Control Sympposium and PDA Exhibition Jointly with the 17th European Frequency and Time Forum, pp. 794 - 801, 2003.

[21]. I. Y. Chien, M. N. Nguyen, “Low Stress Polymer Die Attach Adhesive for Plastic Packages,” Electronic Components and Technology Conference, pp. 580 – 584, 1994.

[22]. C. Lee, W. T. Chin, H. Pape, “A new leadframe design solution for improved pop-corn cracking performance,” Electronic Components and Technology Conference, pp. 78-91, 1996.

[23]. S. Omi, K. Fujita, T. Tsuda, T. Maeda, “Causes of Cracks in SMDs and Type-Specific Remedies,” Components, Hybrids, and Manufacturing, vol. 14, pp.818-823, 1991.

[24]. O. Yoshioka, N. Okabe, S. Nagayama, R. Yamagishi, G. Murakami, “Improvements of Moisture Resistance in Plastic Encapsulates MOS-IC by Surface Finishing of Copper Lead Frame,” Electronic Components Conference, pp.464-471, 1989.

[25]. A. Parthasarathi, D. Mahulikar, A. Khan, “Lead Frame Treatments to Prevent Delamination in Plastic Packages,” IEPS Proceedings, 1995