現今對於材料界面的在混合模式下的疲勞裂紋成長的資料缺乏，分析與預測少，因此為了預測相異界面及相關結構的可靠度，減少研發所需成本與時間，建立混合模式下的疲勞裂紋成長模型為一必須的重點，完整的界面脫層物理模型包括著界面破壞力學理論、界面脫層驅動力之分析與界面破壞韌性及疲勞脫層之實驗分析，藉此預測界面脫層的成長。本論文著重於界面疲勞脫層實驗部分，內容包括在不同相位角作用下的混合模式疲勞裂紋成長行為量測，並得到其界面脫層之疲勞特性常數，並發展其所對應之疲勞裂紋成長模型。
本研究使用自製之混合模式拉伸試驗機，此拉伸機台透過兩個音圈馬達對混合模式彎曲樑施加不相等之作用力以構成混合模式彎矩，運用彈性基底之混合模式彎曲樑理論，從實驗數據反推試件的裂紋長度，並透過後處理求得材料界面疲勞脫層疲勞反應，針對鋁與環氧樹脂界面量測所得之疲勞特性曲線，發現隨著相位角相位角遞增，疲勞特性常數會隨著遞減，且裂紋穩定成長區也會跟著右移。

In this research, a novel mixed mode bending setup was applied to study the fatigue growth of interface delamination. In this setup, two voice coil motors are used to apply two dissimilar bending end loads on a split-beam specimen formed by bonding two aluminum strips. The interface considered is the aluminum-epoxy interface on the mid-plane of the split-beam. By using an analytical formula based on the beam on elastic foundation theory, the crack length and the strain energy release rate can be calculated from the opening displacement of beam, which and the applied bending forces were measured throughout the fatigue experiment. The fatigue experiment was conducted under a prescribed loading mode mixity. In the experiment, the control program calculated and adjusted the applied end forces to maintain a constant phase angle at the prescribed value. The relationship between crack growth rate and the applied strain energy release rate were obtained by post-processing the experimental results.

The fatigue growth characteristics of the Al-epoxy interface under various mode mixities were investigated. The steady-state cyclic fatigue delamination growth is found to display a power-law dependence on the applied strain energy release rate range. A phase-angle dependent fatigue crack growth model was constructed from curve fitting the steady-state cyclic fatigue delamination growth responses. The model can further be combined with delamination driving forces obtained for real structures containing the specific interface of interest to estimate the fatigue crack growth behavior and the corresponding structural reliability.

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