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研究生： 朱怡錚
Chu, I-Cheng
論文名稱： Cu添加對Bi-3.5Ag高溫無鉛銲料顯微組織與機械性質之影響
Effect of Cu Addition on the Microstructure and Mechanical Properties of Bi-3.5Ag High-Temperature Pb-free Solder
指導教授： 李驊登
Lee, Hwa-Teng
學位類別： 碩士
Master
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年： 2024
畢業學年度： 112
語文別： 中文
論文頁數： 100
中文關鍵詞： Bi-Ag合金 、高溫無鉛銲料 、剪切測試
外文關鍵詞： High-temperature Pb-free solder, Bi-Ag alloy, Cu addition, microstructure, shear test
相關次數： 點閱：31  下載：0 
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    • 本研究的目的在探討不同Cu添加量(0.5 wt.%、1 wt.%與2 wt.%)，對高溫無鉛銲料Bi-3.5Ag之機械性質與顯微組織結構的影響，並研究其在迴銲過程中與常用基材Cu板之間的介面反應行為。
    研究結果顯示，在Bi中添加2.5 wt.% Ag生成Bi-Ag共晶組織；添加3.5 wt.% Ag時則先生成α-Ag，後再形成Bi-Ag共晶組織，由於金屬澆鑄後採用空冷，為較快的冷卻方式，導致在銲料中有純Bi組織的出現。在Bi-3.5Ag銲料中添加Cu時，Cu於冷卻過程中最先生成，由於Cu和Ag有較佳的親和力，α-Ag傾向在Cu附近生成，這一現象導致隨著Cu含量增加時，α-Ag晶粒的粗大化，且Bi-Ag共晶組織在銲料合金中的比例逐漸減少。
    硬度的量測觀察中，發現添加Cu使銲料整體硬度呈上升的趨勢，其中α-Ag組織與Cu-rich相皆具有散佈強化的效果。在剪切試驗觀察中，發現Bi-3.5Ag-0.5Cu銲料具有最佳的剪切強度。儘管Bi-3.5Ag-1Cu銲料中存在較深的晶界溝槽，但其裂紋完全斷裂於銲球中心，該中心區域多為純Bi與Bi-Ag共晶組織，由於這些結構無法有效抵抗裂紋擴展，最終導致得到最差的剪切強度。銲點破斷面觀察分析中，發現Bi-3.5Ag-2Cu的銲點有部分Cu基板裸露，呈現混合斷裂模式；而Bi-3.5Ag、Bi-3.5Ag-0.5Cu和Bi-3.5Ag-0.5Cu則皆為銲球內部斷裂。
    綜合以上實驗結果，在Bi-3.5Ag銲料中添加Cu，可增加α-Ag組織與富Cu相的占比，提升在合金中的散佈強化效果，進而強化整體銲料硬度；然而，若α-Ag晶粒過於粗大，在迴銲時則會沉積於銲接基板表面，影響熔融銲料與基板間的交互作用，導致較差的介面接合效果。

    This study investigates the effects of different Cu additions (0.5 wt.%, 1 wt.%, and 2 wt.%) on the mechanical properties and microstructure of the high-temperature lead-free solder Bi-3.5Ag.

    The results indicate that the addition of 2.5 wt.% Ag to Bi leads to forming a Bi-Ag eutectic structure, while the addition of 3.5 wt.% Ag first results in the formation of α-Ag, followed by the Bi-Ag eutectic structure. Due to air cooling, a relatively rapid method after metal casting, pure Bi structures appear in the solder. When Cu is added to the Bi-3.5Ag solder, Cu precipitates first during the cooling process. As the Cu content increases, the α-Ag grains coarsen, and the proportion of the Bi-Ag eutectic structure in the solder alloy gradually decreases.

    Hardness measurements reveal that adding Cu increases the solder's overall hardness, with both the α-Ag phase and Cu-rich phase contributing to dispersion strengthening. In shear tests, the Bi-3.5Ag-0.5Cu solder exhibits the highest shear strength. Fracture surface analysis of the solder joints shows that Bi-3.5Ag-2Cu exhibits partial exposure of the Cu substrate, indicating a mixed fracture mode, whereas Bi-3.5Ag, Bi-3.5Ag-0.5Cu, and Bi-3.5Ag-1Cu all exhibit fractures within the solder ball.

    摘 要 I Extended Abstract II 誌 謝 VII 總目錄 VIII 表目錄 XI 圖目錄 XII 第1章 前言 1 1-1 前言 1 1-2 研究動機與目的 3 第2章 文獻回顧 7 2-1 高溫無鉛銲料概論 7 2-1-1 高溫銲料應用 7 2-1-2 高溫無鉛銲料性質要求 8 2-2 高溫無鉛銲料系統發展概況 12 2-2-1 金錫(Au-Sn)系合金 12 2-2-2 鋅錫(Zn-Sn)系合金 13 2-2-3 鋅鋁(Zn-Al)系合金 13 2-2-4 鉍銀(Bi-Ag)系合金 14 2-2-5 錫銻(Sn-Sb)系合金 15 2-3 Bi與Cu基板的介面層反應 20 2-4 銲點接合性質 22 2-4-1 銲點剪切試驗測試 22 2-4-2 銲點破壞模式 22 第3章 實驗步驟與方法 26 3-1 實驗規劃 26 3-2 試件製備 28 3-2-1 高溫無鉛銲料的製備 28 3-2-2 銲球製備 28 3-2-3 銅基板前處理 29 3-2-4 接點試片的製作 29 3-3 實驗內容 38 3-3-1 銲料之微結構觀察與分析 38 3-3-2 銲料之微硬度分析 38 3-3-3 銲點之微結構觀察與分析 38 3-3-4 銲點之剪切試驗 38 3-3-5 破斷面分析 39 第4章 研究結果與討論 43 4-1 Bi-3.5Ag-xCu銲料合金之微結構 43 4-2 Bi-3.5Ag-xCu銲料之微硬度 54 4-3 剪切強度測試 57 4-4 銲點斷口分析 63 4-5 Bi-3.5Ag-xCu銲料與Cu基板銲接界面層微結構分析 68 第5章 綜合討論 75 第6章 結論 77 第7章 未來研究建議與方向 78 參考文獻 79

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