在工業應用上，以散熱鰭片作為散熱方式，已經是相當普遍。熱經由高溫傳到低溫，而散熱鰭片的目的在於增加其表面面積，以增加其散熱效率。然而大部份的散熱鰭片均以自然對流或強制對流的方式作為冷卻，本文嘗試比較不同的散熱方式，使用於同樣的鰭片上，觀察並討論其散熱結果。
本文主要針對同一款散熱鰭片考慮：
(一) 在不同發熱瓦數下，自然對流之穩態散熱效能。
(二) 在不同風速與不同發熱瓦數下，強制氣冷穩態散熱效能。
(三) 在不同流量與不同發熱瓦數下，水冷穩態散熱效能。
實驗結果發現，本文中所使用的散熱鰭片在自然對流情況下，15W穩態散熱時之熱阻值為1.71℃/W，晶片溫度達107.1℃。在強制氣冷情況下，風速2.4m/s，15W穩態散熱時其熱阻值為1.95℃/W，晶片溫度達58.8℃。而以水冷方式在流量為400L/hr，15W穩態散熱下其熱阻值為0.85℃/W，晶片溫度39.4℃；而在流量為100L/hr，15W的穩態散熱下，熱阻值仍為0.99℃/W，晶片溫度43.4℃。實驗証明縱使在較低的流速下，水冷散熱效能仍然比強制氣冷式高出35.5%，且當水冷以輸入功率為80W時，400 L/hr 與100L/hr之熱阻只增加0.075℃/W。因此散熱鰭片若能以水冷方式散熱，即使以低流量便能發揮其優異的散熱效能。

In recent years, the electronic components are continuously developing towards high performance and shrinking it’s size. But also more higher thermal energy also produced. Using heat sink is always the common heat dissipation method as we know. We usually use two kinds of cooling method with heat sink, that is natural convection and forced-air convection. But, among various cooling methods, water cooling system always have the best performance. The real advantage of water cooling system is that it always with low noise but able to handle much greater wattages from CPU than any air-cooler can.
In this article, we try to use water cooling method to compare with these two traditional air cooling methods with the same heat sink. Through the experiments to prove that there will be the same or even more higher heat dissipation rate even when we have a low flowing rate of coolant as we use water cooling method with heat sink. In other words, it’s a new idea if we use heat sink as the internal shape inside a water block . In order to prove this, heat sink had been installed into the water block and carried out an experiments.
The experiments results show that during the natural convection under heat generation rate at 15W from the heater and reach the equilibrium stage , the thermal resistance of the system was 1.71℃/W and the chip temperature was 107.1℃. Under forced-air convection at 15W at equilibrium stage and the wind speed at 2.4m/s , the thermal resistance was 1.95℃/W and the chip temperature was 58.8℃. Under water-cooling system at water flowing rate at 400L/hr and 15W at equilibrium stage, the thermal resistance was 0.85℃/W and chip temperature was 39.4℃. At water flowing rate at 100L/hr and 15W at equilibrium stage, the thermal resistance was 0.99℃/W and chip temperature was 43.4℃. Even when the water flowing rate decrease to 100L/hr at 15W in equilibrium stage , thermal resistance is 0.99/℃W and chip temperature was 43.4℃. It means 35% efficiency is higher than the air-forced convection at 15W equilibrium stage will be obtained.
Nevertheless, the most important result was even when the water flowing rate decrease from 400L/hr to 100L/hr at 80W, thermal resistance only increased 0.075℃/W. It means the flowing rate of water in this water cooling system was inconspicuous.

1.Michael J. Ellsworth, “Chip Power Density and Module Cooling Technology Projections for the Current Decade”, Inter Society Conference on Thermal Phenomena, 2004.
2.張漢忠，“散熱座之熱傳分析”，大同大學機械系90 級專題研究摘要彙編，90年。
3.陳旗正，“個人電腦交換式電源供應器之熱管散熱模組研製”，國立成功大學工程科學研究所碩士論文，93年。
4.H. Y. Zhang, D. Pinjala and P. S. Teo, “Thermal Management of High Power Dissipation Electronic Packages: from Air Cooling to Liquid Cooling”, 2003 Electronics Packaging Technology Conference.
5.鄭昱韋，“晶片用環型水冷器之研究”，國立中山大學機械與機電工程研究所碩士論文，92年。
6.吳德洋，“散熱座應用於水冷系統之效能評估”，大同大學機械工程研究所碩士論文，92年。
7.Tohru Kishimoto and Takaaki Ohsaki, “VLSI Packing Technique Using Liquid-Cooled Channels”, IEEE Transactions on Components Hybrids and Manufacturing Technology, Vol. 9, 1986.
8.http://www.chip.cn/info/showArticle.jsp?article_id=433
9.Herinrich Baumann,“Optimized Cooling Systems for Semiconductor Devices”, IEEE Transactions on Industrial Electronics, Vol.48, No.2, April 2001.
10.Yunus A.Cengel,“Heat Transfer A Practical Approach”,The McGraw-Hill Companies, Inc, 1998.
11.林廣台與李世榮編著，“熱傳遞”，新科技書局，高立圖書有限公司。
12.T. E. Salem, D. Porcshet and S. B. Bayne, “Thermal Performance of Water-Cooled Heat Sinks: A Comparsion of Two Different Designs”, IEEE SEMI-THERM Symposium, Vol.21, 1998.
13.Soule, Christopher A., “Augmented Fin Air-Cooled Heat Sinks Achieve Higher Performance without Significant Rise in Static Pressure,” PCIM Magazine, November, 1997.
14.F.P. Incropera, Ed., “Research needs in electronic cooling,” in Proc. Of Workshop, National Science Foundation and Perdue Univ, 1986.
15.Wataru Nakayama, “Heat-Transfer Engineering in Systems Integration: Outlook for Closer Coupling of Thermal and Electrical Designs of Computers,” IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, VOL.18, NO.4, December 1995.
16.曾平、程光明、劉九龍、楊志剛、鄭麗兵，“集成式計算機芯片水冷系統的研究”，西安交通大學學報，第3卷第11期2005年11月。
17.Narasimhan S, Majdalani J. Characterization of compact heat sink models in natural convection. IEEE Trans Comp Packag Technol 2002
18.Patel CD, Belady C. Modeling and metrology in high performance heat sink design. In: Proceedings of the 47th Electronic Components and Technology Conference, 1997.
19.Nelson, N.D., Sommerfeldt, S. and BarCohm, A., “Thermal performance of an Integrated Immersion Cooled Multichip Module Package,” Ninth JEEE SEMI-THERM Symposium, 1993.
20.Simons, R.E., “Direct Liquid Immersion Cooling for High Power Density Microelectronics,” Electronics Cooling, Vol.2, No. 2, 1996.
21.Simons, R.E. and Chu, R.C., “Cooling Technology for High Performance Computers: Part 1 - Design Applications,” Cooling of Electronic Systems, Proceedings of the NATO Advanced Study Institute, 1994.