在電子構裝製程中，封膠材料在熟化成型過程中會與其他異質材料如模具表面、基板(Substrate)以及導線架(Leadframe)之間產生黏著的現象，稱為黏著效應(Adhesive Effects)，而此黏著效應對於不同材料有不同的效果。對於模具而言，黏著效應會造成產品的黏模，而影響產品的品質。但對於基板或導線架而言，黏著的效應越大，所達到的可靠度就越高。但黏著力的形式分為的正向黏著力與剪向黏著力，因此希望能夠準確的得知此兩種力之大小，進而找出一些方法來改善產品的品質。
　　本研究針對此黏著效應，承接一套由本實驗室學長 林俊宏先生所研發的自動化電子封裝黏著力測試儀器並改善其模具和機台相關設備，使此測試機台更加完善。希望藉由發展此套的黏著力量測設備和技術，能確實量測在封裝過程中所產生的正向及剪向黏著力。

　　In IC packaging, when epoxy molding compound（EMC）is filling the mold cavity and cured in the mold, adhesive effects occur in the interface between mold surface, substrate, leadframe and EMC. Adhesive effects are good for leadframe and substrate, because the larger adhesion causes the better reliability. But, the adhesion between mold and EMC will affect the products quality. Normal and shear adhesion force exist in the IC packaging. So we want to understand the exact value and avoid the problems.
　　This study is focus on adhesion effects. We improve the mold and equipments of the auto IC packaging testing machine which was made by Lin, Jin-hon. We must make it better and hope to measure the exact normal and shear adhesion force during IC packaging process.

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