Zn-25Sn 是有工業應用潛力的高溫無鉛焊錫。但是由於Zn含量較高而導致其抗氧化性較差。針對這種現象，本文研究了Zn-25Sn- XAl(X=0~0.25 wt%) -YPr ( Y=0~ 0.15wt%)高溫無鉛焊錫的相關性能，包括潤濕行為、Al和Pr提高合金潤濕性能的可行性、焊錫與銅基材的潤濕和界面反應、焊錫的微觀組織結構和機械性質。試驗儀器方面包含潤濕天平、掃描電鏡、電子探針微量分析儀、透射電鏡及能譜分析、熱重分析、拉伸試驗。
為了获得在浸沒階段的潤濕時間和初始潤濕行為的關聯，本文對非反應及反應系統的初始階段潤濕行為進行了研究。初始階段潤濕行為又可以細分為三個階段。針對第一階段的液體阻力採用了測量和用Navier-Stokes 方程理論計算兩種方法作為對比。提出了一個有潤濕力、潤濕時間、粘滯力、浮力等多變量的公式用於描述此階段的潤濕行為。在第二階段，粘滯力迅速降低。第三階段，可用傳統的潤濕公式表達。
這三個階段的動態潤濕角也可以進行評估。動態潤濕角在第一階段隨著浸沒深度的增加迅速增加并達到一個穩定值，在第二階段迅速降低，在第三階段緩慢降至楊氏方程描述的關於靜止平衡狀態的平衡角度。
在關於非反應系統方程的基礎上，本文繼續研究了反應系統Zn-25Sn-(0, 0.01, 0.05 wt% ) Pr/Cu的初始潤濕中的第一階段。發現動態潤濕角在此階段會變小，這應該是由於反應系統中焊錫與基材的良好潤濕導致的。並且發現在第一階段，大的潤濕曲線斜率對應著好的潤濕性。
在Zn-25Sn中添加0.01wt% Pr 可以提高合金的潤濕力。Zn-25Sn, 添加微量Pr以及Al含量添加小於0.01wt% 的Zn-25Sn合金在空氣中都會發生去潤濕現象（dewetting），但是在Ar氣氛中則不發生去潤濕現象。另外，添加超過0.05wt% Al的Zn-25Sn合金即使在空氣中也不發生去潤濕的現象。去潤濕現象可以通過採用Ar氣氛保護或者是在合金中添加超過0.05wt% Al兩種方式抑制。
在Zn-25Sn 合金中添加0-0.09 wt% 的Al可以提高合金的潤濕性和潤濕力。界面處的金屬間化合物（IMC）厚度隨著Al含量的增加而增長。
在Zn-25Sn-0.05Al 中添加0.01、0.05 wt% Pr可以提高合金的潤濕性並且抑制金屬間化合物的生長。但是高的Pr添加量，如0.08、0.15 wt% Pr卻出現了隨著Pr含量的增加，合金潤濕性變差、金屬間化合物成長加速的現象。在界面處還新發現PrZn3,Pr3Sn5 和 (Cu,Al)4Zn 等化合物。
熱重分析 (TGA) 表明焊錫的抗氧化順序如下： Zn-25Sn-0.05Al-0.05Pr >
Zn-25Sn-0.05Al> Zn-25Sn-0.01Al> Zn-25Sn> Zn-25Sn-0.01Pr> Zn-25Sn-0.05Pr. 同時添加 0.05 wt% Al 和 0.05 wt% Pr可以很好地提高合金的抗氧化活化能。對Zn-25Sn, Zn-25Sn-0.05Al 以及Zn-25Sn-0.05Al-0.05Pr合金表面氧化層的電子光譜化學分析表明Al和Pr都有聚集在合金表面的特性。高解析的透射電鏡（HRTEM）分析表明在Zn-25Sn-0.05Al表面氧化膜中存在Al2O3晶體和(Al, Zn, Sn)Ox非晶體結構，在Zn-25Sn-0.05Al-0.05Pr合金的表面氧化膜中存在Al2O3 、Pr2O3 以及(Al, Pr)Oy非晶體結構，認為正是這種氧化膜的存在提高了合金的抗氧化性。
在Zn-25Sn-XAl ( X= 0, 0.01, 0.03, 0.05, 0.09 wt% )中添加Al 可以細化晶粒、提高合金的過冷度。0-0.09wt% Al使合金的抗拉強度（UTS）由67.28MPa 提高到78.61MPa（提高16.84%）。屈服強度由42.52MPa提高到52.81MPa (提高24.2%)。延伸率則由39.02% 下降到 32.83% 。

Zn-25Sn based alloys possess great potential as candidates for high temperature lead- free solders. But it exhibits poor oxidation resistance due to the high zinc content. This study investigated various solder related properties of the high temperature Zn-25Sn- XAl (X=0~0.25 wt%) -YPr ( Y=0~ 0.15wt%) Pb-free solders. The aspects investigated include the wetting performance, feasibility of Al and rare earth Pr addition for enhancing the wettability, wetting and interfacial reaction between solder and Cu substrate, oxidation resistance of the solders, microstructure and mechanical properties of the solders. The experimental investigations conducted were wetting balance test, scanning electron microscopy (SEM), electron probe microanalysis (EPMA), energy dispersive spectroscopy (EDS) equipped in transmission electron microscopy (TEM), thermal gravimetric analysis
(TGA) and tensile tests.
For clearifying the relationship between wetting time and the initial performance in dipping process, the initial stages of non-reactive and reactive wetting behaviors were investigated. The initial stage of wetting curve was divided into three stages. The liquid impeding force of the first stage was measured by wetting balance and was theoretically analyzed by Navier-Stokes equation for comparison. An equation in terms of wetting force, wetting time, viscous force, and buoyance force was proposed to describe the wetting curve of this stage. The viscous force was found to decrease quickly in the second stage. The third stage was described by the traditional wetting expressions. The dynamic contact angles of each stage were estimated theoretically. The contact angles of the first stage were found to increase rapidly upon dipping and then reach a steady value. The angles decreased rapidly in the second stage. Finally, the angles decreased gradually to reach the thermodynamic equilibrium contact angle described by the Young’s equation. Based on the equations aforementioned, the initial AB stage of Zn-25Sn-(0, 0.01, 0.05 wt% ) Pr was investigated. The contact angle decreases with time due to the good wetting between solder and Cu substrate. The larger values of slope of the initial stage reflected the better wettability.
The addition of 0.01wt% Pr in Zn-25Sn increased the wetting force. However, dewetting was observed under air atmosphere for the Zn-25Sn, Pr-containing solders, and solders containing 0.01wt% Al. It was also found that the dewetting of Pr-containing solders could be avoided under argon atmosphere as well as with higher Al additions.
The wettability and wetting force were improved upon the increasing addition of Al in the range of 0-0.09 wt% in Zn-25Sn alloy. The thickness of intermetallic compounds layers increased with Al additions. The additions of 0.01, 0.05 wt% Pr in Zn-25Sn-0.05Al enhanced the wettability of solders and depressed the growth of intermetallic compounds. However, the higher additions of 0.08, 0.15 wt% Pr in Zn-25Sn-0.05Al degraded the wettability while enhanced the growth of the intermetallic compound. The phases PrZn3, Pr3Sn5 and (Cu,Al)4Zn were formed at the solder/substrate interface.
The results of thermal gravimetric analysis (TGA) indicate that the corrosion resistance of the various solders decreases in the sequence Zn-25Sn-0.05Al-0.05Pr > Zn-25Sn-0.05Al> Zn-25Sn-0.01Al> Zn-25Sn> Zn-25Sn-0.01Pr> Zn-25Sn-0.05Pr. It was found that the addition of 0.05 wt% Al and 0.05 wt% Pr largely increases the oxidation activation energy. A comparison of the results of electron spectroscopy for chemical analysis on the oxidized specimen Zn-25Sn, Zn-25Sn-0.05Al and Zn-25Sn-0.05Al-0.05Pr indicated that the Al and Pr prominently accumulated at the surface of solder. The investigation by high resolution transmission electron microscopy revealed the existence of Al2O3 and Pr2O3 in the surface oxide films of Zn-25Sn-0.05Al and Zn-25Sn-0.05Al-0.05Pr. The oxide film also consists amorphous (Al, Zn, Sn)Ox and (Al, Pr)Oy. It is believed that the formation of the compact oxide film is responsible for the oxidation resistance of the solders.
The addition of Al in Zn-25Sn-XAl ( X= 0, 0.01, 0.03, 0.05, 0.09 wt% ) tends to refine the grain size and increase the undercooling behavior of the solder. The increasing addition of Al up to 0.09wt% enhanced the ultimate tensile strength (UTS) of the alloy from 67.28 to 78.61MPa (16.84% improved), and the yield strength from 42.52 to 52.81MPa (24.2% improved). The strain of the solder degraded from 39.02% to 32.83% when the addtion of Al increased from 0 to 0.09wt%.

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