本文利用微機電製程技術先設計製作出一款微型壓阻式合金應變計，其尺寸遠小於現有之市售應變計。接著，再將微型合金應變計設計製作在可撓性薄膜底材表面上，希望可以製作出微型可撓性壓阻式合金應變計。
　　
　　在製程的選擇上，底材選用4吋的矽晶圓，並沉積氮化矽薄膜作為絕緣層，在其上利用厚膜光阻AZ P4620即可輕易的定義出應變計的外型，再利用磁控濺鍍法(magnetron sputtering)將感測層材料(銅鎳合金)濺鍍在其上，接著以丙銅沖洗作Lift-Off，再將其切割成適當大小，即完成了微型合金應變計的製作。
　　
　　為了製作出微型可撓性合金應變計，選擇Polyimide9005作為可撓性的基底，欲將微型合金應變計製作在其表面上，卻遭遇到銅鎳合金電阻率過高。本文嘗試各種方法解決此問題，最後發現沉積在Polyimide表面上的銅鎳合金與Polyimide發生反應而氧化的情形，導致其電子傳導的機制改變而影響電阻率，因而使應變計的電阻值過高。最後本文雖然成功的降低應變計的電阻降低，但因其良率過低，不方便應用。
　　
　　將本文自行設計製作出來的微型合金應變計應用在懸臂樑震動實驗，並與商用應變計做比較，觀測到與商用應變計訊號之趨勢完全相同，因此可以確定微型合金應變計的銅鎳合金有壓阻效果，可以應用於量測結構點的應變。
　　
　　利用四點彎矩(four point bending)實驗，再搭配使用商用應變計來校正微型合金應變計，以求出其應變計因數(gauge factor)。再將微型合金應變計應用在簡單的懸臂樑靜態載重實驗中以作為驗證，其所量測的應變值與商用應變計做比較，誤差均在9%以內。
　　
　　最後利用Hopkinson Bar Tester作一維波傳的實驗，將微型合金應變計與商用應變計比較所記錄的應力波波速與大小，並與一維波傳理論及利用商用有限元素軟體LS-DYNA作出的數值模擬分析作比較。實驗結果的應力波波速與應力大小與一維波傳理論比較，其誤差分別均在4%及9%以內。

　In this research, a piezoresistive micro alloy strain gauge that has the size much smaller than commercial strain gauges was designed and manufactured by utilizing Micro Electro Mechanical System (MEMS) followed by developing the micro alloy strain gauge on a flexible thin film as a matrix in order to produce a flexible piezoresistive micro alloy strain gauge.
　　
　During the process of manufacturing, the 4-inch silicon wafer was chosen to be the substrate and then deposited a thin film of silicon-nitride as insulated layer. By applying the photoresistance, AZ P4620, on the photolithography technique, the geometry of the micro strain gauge can easily be defined. A thin layer of sensor material, Cu/Ni alloy, was sputtered on top of the silicon wafer by magnetron sputtering followed by lift-off using acetone. Lastly, cut the silicon wafer into proper size to finalize the production of the micro alloy strain gauge.
　　
　For manufacturing flexible micro alloy strain gauge, Polyimide9005 was chosen as the flexible matrix. However, while trying to manufacture the micro alloy strain gauge on top of the flexible matrix, the problem that encountered the resistance of Cu/Ni alloy was too high was occurred. In this research, there are several methods had been tried to solve this problem and finally found out that the Cu/Ni alloy layer that deposited on top of the Polyimide layer has the situation of oxidization with Polyimide leading to high resistance due to dreadful electronic transmitting. Consequently, the research has successfully reduced the resistance of the flexible strain gauge, the quality of the strain gauge, however, is too low to apply on experiments.
　　
　Applying the micro alloy strain gauge developed in this investigation on vibrating experiment of cantilever beam and comparing with commercial strain gauge, the result shows the same signal trend as the commercial stain gauge, therefore, it is for sure that the Cu/Ni alloy of micro alloy strain gauge has piezoresistive effect and can be utilized on measuring the strain of a structure.
　　
　Four-point-bending experiment was used to calibrate the micro alloy strain gauge with commercial strain gauge to determine the gauge factor of micro alloy strain gauge and examined by applying the micro alloy strain gauge on static loading experiment of cantilever beam. Comparing the result with commercial strain gauge, the percentage error is within 9%.
　
　Finally, Hopkinson Bar Tester was used to do the one-dimensional wave propagation experiment to test the ability of catching the dynamic signal of micro alloy strain gauge. Both micro alloy strain gauges and commercial strain gauge were attached on the Hopkinson Bar Tester and the velocity and intensity of stress wave were recorded then compared with one-dimensional wave propagation theory and the numerical simulation by commercial software LS-DYNA. The percentage error of velocity and stress are within 4% and 9% respectively.

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