中文摘要
微電子廠之振動分析
研 究 生：鍾慶樺
指導教授：蕭樂群

本文的目的在分析高鐵通過南科對台積電晶圓六廠中晶圓平台振動值的影響。透過以有限元素法為基礎之結構動力分析軟體SAP2000，來模擬建構微電子廠房的整體結構。在模型建構過程中，為了降低系統的自由度，將三樓由格子樑簡化成相當之彈性樓板。在歷時分析中使用Ritz向量來計算出節點速度，再利用微振分析換算成振動分貝值。從分析得到在三方向振動波中，以Y方向所造成的振動分貝值最大。隨著結構阻尼值逐漸遞增，晶圓平台處振動值呈現逐漸遞減的現象。提高柱之彈性模數，對於降低三樓之振動量相當有限。

Abstract

Vibration Analysis of Microelectronic Plants

Student；Chin-Hua Chung
Advisor；Le-Chung Shiau

The purpose of this thesis is to study the micro-vibration at the wafer platform of the TSMC 6th plant induced by the high-speed train passing through Tainan Science-based Industrial Park. The finite element model of the microelectronic plant is created by the use of SAP2000 computer code. For order to reduce the huge degree-of-freedom(DOF) contained in the complicated grid floor system, an equivalent plate system is created to replace the gird floor system. Ritz vector modal method is employed to perform the time history analysis. The obtained velocity at each node is then transformed to decibel(dB) value by micro-vibration analysis. Results show that the y-direction ground acceleration caused the largest vibration value. Structure damping value would reduce the wafer platform. Change material strength will slightly reduce the dB value.

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