本研究以雙相流潛熱變化以及蒸汽均勻分佈的特性，探討一個蒸汽腔室對於電腦中央處理器冷卻上的助益。研究方法係以一個長寬高為60*60*5.5mm的平板式蒸汽腔室作為本體，以一模擬中央處理器的加熱器為熱源，並以冷卻水流帶走熱量；實驗方法為測量加熱器的溫度以及環境水溫以獲得熱阻值，並探討其效能；實驗過程中以改變腔室內部水量及腔室底部溝槽結構和冷卻端的冷卻水流量，以探討在此狀況下各種變數對於整體性能熱阻的影響，並做為未來性能改良之依據以及相關發展之參考。分析結果中發現，腔室的液體量在一定的理論值以上，不會有液體回流不足造成熱阻升高的現象。冷卻端之冷卻水流量大小影響熱阻值，尤其是腔室內液體量低於設計理論值時，最大熱傳量有明顯的降低。此外，蒸發端底部設計為溝槽結構，以溝槽提供表面積增加及毛細力可提高熱傳性能。

　　The present study is to discuss the advantages of a vapor chamber on CPU cooling, utilizing its latent heat property in a two-phase flow environment. The vapor chamber is 60*60*5.5mm in dimension. A dummy heater is used to simulate a CPU heat source. The heat is removed by circulated water at the other side of the vapor chamber. Thermal performance of the vapor chamber is judged by the thermal resistance which is determined by the measured heater temperature and circulated cooling water temperature. The variations of chamber liquid volume, base groove structure, and circulated water quantity on the thermal performance are discussed. It is formed that when the chamber liquid volume exceeds certain theoretical value, its thermal resistance can be low at high heat condition. The cooling water quantity also has positive influence on the thermal resistance, especially when the chamber liquid volume is low. Moreover, the groove structure at the chamber base provides larger surface area and enhanced capillary force for better heat exchange.

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