本文主要內容為利用單軸拉伸機構對微小尺寸下之材料進行拉伸測試。再藉由奈米粒子在試件表面產生隨機斑點以配合數位影像相關法(Digital Image Correlation Method)所建立的一套影像分析程式與影像擷取系統量測微小試件之變形量，當我們有其變形量與應力值便可以求得微小尺寸下材料的機械性質，如楊氏係數(Young’s Modulus)、蒲松比(Poisson Ratio)、降伏強度（yield strength）以及破壞強度（fracture strength）。在本次實驗中，待測的微小試件材料有鈹銅(Beryllium Copper)與單晶矽(Single-Crystal Silicon)薄膜。鈹銅材料的尺寸 為 以及 ，矽薄膜材料的尺寸為 ，其單位為微米(μm)。由於微小尺寸下材料的機械性質不能由大尺寸依等比例計算而得，所以經由微小試件的直接測試，以了解其受力下之變形行為即成為一必須的步驟。經由本次實驗的實際測試，驗證了本系統的可行性，並對於數位影像相關法的應用限制、誤差來源、誤差範圍以及與參考文獻值互作比較，其中亦有所討論。

　The main content of thesis is to measure the elastic tensile property (Young’s modulus) of the micro samples by use the single-axial tension mechanism. We apply nano-particle to the surface of micro-specimen to produce random-spots，and use digital-image-correlation method to contribute a package of a soft analyzing program collocating CCD to measure the deformation of the micro samples surface by a photomicroscope. When we have the deformation and stress, we can calculate the tensile property of material, example the Young’s modulus、Poisson Ratio、yield strength and fracture strength. The micro sample’s material are Beryllium Copper and single-crystal silicon, the size of Beryllium Copper are and ，then the size of single-crystal silicon is .The material properties of micro samples can’t be figured out directly by the results of large-scale sizes. So understanding the deforming behaviors by directly testing the micro samples becomes the absolute step. By the measuring results of the experiments we prove the feasibility of our system we set. And we provide some discussions about the limit of the application, the source of error，the error range of digital-image-correlation method and compare the result of experimwnt with the value of references .

1.W.H. Peters and W.F. Ranson, “ Digital Imaging Techniques in Experimental Stress Analysis ”, Opt. Eng., Vol. 21, pp. 427-432, 1982.
2.M.A. Sutton, W.J. Wolters, W.H. Peters, W.F. Ranson, and S.R. McNeil,“ Determination of Displacements Using an Improved Digital Correlation Method ”, Image and Vision Computing, Vol. 1, pp. 133-139, 1983.
3.W.H. Peters, W.F. Ranson, M.A. Sutton, T.C. Chu and J. Anderson,“ Applications of Digital Correlation Methods to Rigid Body Mechanics ”, Opt. Eng., Vol. 22, pp. 738-742, 1983.
4.M.A. Sutton, M. Cheng, W.H. Peters, Y.J. Chao, and S.R. McNeil, “ Application of an Optimized Digital Image Correlation Method to Planar Deformation Analysis ”, Image and Vision Computing, Vol.4, pp. 143-150, 1986.
5.H.A. Bruck, S.R. McNeil, M.A. Sutton and W.H. Peters, “ Digital Image Correlation Using Newton-Raphson Method of Partial Differential Correction ”, Exp. Mech., Vol. 29, pp. 261-267, 1989.
6.W.H. Peters, Z.H. He, M.A. Sutton and W.F. Ranson, “ Two-Dimensional Fluid Velocity Measurements by Use of Digital Speckle Correlation Techniques ”, Exp. Mech., Vol. 24, pp. 117-121, 1984.
7.W. Wu, W.H. Peters and M. Hammer, “ Basic Mechanical Properties of Retina In Simple Elongation ”, Trans. ASME, J. Biomech. Eng., Vol. 109, pp. 65-67, 1987.
8.G. Han, M.A. Sutton and Y.J. Chao, “ Study of Stationary Crack-Tip Deformation Fields in Thin Sheets by Computer Vision ”, Exp. Mech., Vol. 34, pp. 125-140, 1994.
9.D.S. Dawicke and M.A. Sutton, “ CTOA and Crack-Tunneling Measurements in Thin Sheet 2024-T3 Aluminum Alloy ”, Exp. Mech., Vol. 34, pp. 357-368, 1994.
10.G. Han, M.A. Sutton and Y.J. Chao, “A Study of Stable Crack Growth in Thin SEC Specimens of 304 Stainless Steel by Computer Vision ”, Eng. Fract. Mech., Vol. 52, pp. 525-555, 1995.
11.S. Choi and S.P. Shah, “ Measurement of Deformations on Concrete Subjected to Compression Using Image Correlation ”, Exp. Mech., Vol. 37, pp. 307-313, 1997.
12.Z. Sun, J.S. Lyons and S.R. McNeill, “ Measuring Microscopic Deformations with Digital Image Correlation”, Optics and Lasers in Engineering, Vol. 27, pp. 409-428, 1997.
13.G. Vendroux and W.G. Knauss, “ Submicron Deformation Field Measurements: Part 1. Developing a Digital Scanning Tunneling Microscope ”, Exp. Mech., Vol. 38, pp. 18-23, 1998.
14.G. Vendroux and W.G. Knauss, “ Submicron Deformation Field Measurements: Part 2. Improved Digital Image Correlation ”, Exp. Mech., Vol. 38, pp. 85-92, 1998.
15.G. Vendroux, N. Schmidt and W.G. Knauss, “ Submicron Deformation Field Measurements: Part 3. Demonstration of Deformation Determinations ”, Exp. Mech., Vol. 38, pp. 154-160, 1998.
16.W.N. Sharpe, K.T. Turner and R.L. Edwards, “ Tensile Testing of Polysilicon ”, Exp. Mech., Vol. 39, pp. 162-170, 1999.
17.William N. Sharpe,Jr. and Kamili Jackson “ Tensile Testing of MEMS Materials ”, Proceedings of the Micro scale Systems: Mechanics and Measurements Symposium, pp. ix-xiv, June 8, 2000.
18.W.G. Knauss and I. Chasiotis, “ A New Micro tensile Tester for the Study of MEMS Materials with the Aid of Atomic Force Microscopy ”, Exp. Mech., Vol. 42, pp. 51-57, 2002.
19.李國誌,“ 應用數位影像關係法於微試件變形之量測”,國立成功大學機械工程學系碩士論文, 2002.
20.陳天賜,“應用數位影像相關法於微試件之測試”,國立成功大學機械工程學系碩士論文, 2003.
21.R.L. Edwards, G. Coles and W.N.Sharpe, Jr,“Comparison of Tensile and Bulge Tests for Thin-Film Silicon Nitride”, Exp. Mech., Vol. 44, pp. 49-54, 2004.
22.D.S.Gianola and W.N.Sharpe,Jr, “Techniques for Testing Thin Films in Tension”，Experimental Techniques，Vol 28,p23-27,2004.
23.李長昇,“應用數位影像相關法研究波形管之機械行為”,國立成功大學機械工程學系碩士論文, 2003.
24.D.B. Carl, “ Bicubic Spline Interpolation ”, Journal of Mathematics and Physics, Vol. 41, pp. 212-218, 1962.
25.Szu-Han Wu and Dong-Hwang Chen,“Synthesis of high-concentration Cu nanoparticles in aqueous CTAB solution” , Exp. Mech., Vol. 44, NO. 1,February 2004.
26.Po-Chih Hung and A.S.Voloshin，“In-plane Strain Measurement by Digital Image Correlation”，Mech. Sci. & Eng.,Vol. XXV, NO. 3,pp215-221,July-September 2003.