本研究延續本實驗室銀奈米粒子合成之技術，成功製備出在200℃的低溫燒結溫度下即可將保護劑脫附完全、粒徑大小為20.3±4.1 nm的丙酸保護之銀奈米顆粒。同時也製備出以3-diethylamino-1,2-propanediol (DEAPD) 作為錯合劑與甲酸銅產生錯合物之銅前驅物，升溫至160℃後即可將有機物完全燒除且還原成銅。將奈米銀粉、銅前驅物以及溶劑於三滾筒式混料機內進行混合得到一種三元奈米銅銀漿料---Paste PM11。透過調整奈米銀粒與銅前驅物之含量進行電性與剪切強度測試取得一較佳的比例：當銀奈米粒子與銅前驅物比例為68：22時，在200℃的低溫燒結及接合溫度下電阻率為(1.53±0.35) x 10-6 (Ω*m)，剪切強度即可達到26.83 MPa。以此漿料進行接合溫度參數之改變測試，結果顯示隨著溫度的提升，電阻率會逐漸下降、剪切強度也會提升，與微結構、孔隙率所觀察到的結果得以呼應。

According to a previous work, we synthesized silver nanoparticles with an average diameter of approximately 20.3 nm, and the protecting agent could be removed at 210℃. With the addition of silver nanoparticles and a copper precursor, we successfully synthesized a low-temperature sintering copper-silver paste, which could be sintered at 200℃. We optimized the proportion of the silver nanoparticles and copper precursor to obtain the best performance. The PM11-6822 paste was mixed with a ratio of silver nanoparticles and copper precursor of 68 : 22, and after heat treatment at 200℃ for 30 mins under nitrogen, the electrical resistivity was 1.53 ± 0.35 x10-6 (Ω*m). Otherwise, the shear strength could reach 26.83 MPa after thermal compression at 200℃ for 30 mins under nitrogen. Furthermore, after heating or hot-pressing under different temperatures, there were obvious differences in the micro structure images of the PM11-6822 paste, where the porosity was reduced with increases in the temperature. In addition, the electrical resistivity decreased, and the shear strength increased with increases in temperature.

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