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研究生： 余昌和
Yu, Chang-Ho
論文名稱： 錫鋅銀銲錫合金元素在焊錫過程對銅金屬反應影響之研究
Investigations of the Effect of Element in Sn-Zn-Ag Solder with the Reaction of Cu Metal during Soldering
指導教授： 林光隆
Lin, Kwang-Lung
學位類別： 博士
Doctor
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2006
畢業學年度： 94
語文別： 中文
論文頁數： 92
中文關鍵詞： 介金屬化合物 、焊錫 、溶解
外文關鍵詞： Soldering, Intermetallic Compound, Dissolution
相關次數： 點閱：70  下載：5 
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    • 本研究嘗試以純金屬錫為主，分別添加少量的鋅及銀元素，藉以瞭解銲錫合金元素在焊錫接合過程中，對固液界面反應的影響並探討初期界面介金屬化合物的生成行為及底層銅金屬的溶解行為。
    分別添加少量的鋅與銀元素於純金屬錫中，經焊錫接合反應過程後，銲錫對底層銅金屬的體積消耗率，從純金屬錫的64.2 %降至錫鋅合金的19.6 %，以及錫鋅銀合金的14.2 %。在15秒的焊錫反應後，純錫與銅金屬在界面所生成的介金屬化合物，從銅金屬到純錫依序為Cu3Sn及Cu6Sn5等相結構；而錫鋅銀銲錫與銅金屬在界面所生成的介金屬化合物，從銅金屬到錫鋅銀銲錫依序為CuZn、Cu5Zn8、Ag5Zn8及AgZn3等相結構。而此界面介金屬化合物種類的改變，也直接降低了底層銅原子經由界面介金屬化合物擴散至熔融銲錫之間的擴散性，明顯的抑制底層銅原子的擴散。銅金屬與純錫在15秒的焊錫反應過程中，在緊鄰銅金屬表面約70奈米的區域形成非晶質Cu-Sn擴散區及Cu3Sn奈米晶胞分佈的區域；銅金屬與錫鋅銀銲錫在緊鄰銅金屬表面約75奈米的區域，則形成非晶質Cu-Zn擴散區及CuZn奈米晶胞分佈的區域。在初期15秒的焊錫反應過程中，底層銅金屬在熔融銲錫中的溶解行為，隨著銲錫合金元素的添加而有所差異。銅金屬在熔融純錫中溶解行為，使得銅晶體表面呈現如梯田般的溶解型態；然而，銅金屬在熔融錫鋅銀銲錫中溶解行為，反而在銅晶體表面造成如管狀般的溶解型態。

    The purpose of this research is to investigate the effect of Zn and Ag on the reaction mechanism of solid Cu/liquid solder reaction. It also investigated the formation behavior of intermetallic compound and the dissolution behavior of Cu metal.
    The consumption rate of Cu, in terms of thickness reduction, was reduced from 64.2% to 19.6% and finally 14.2%, respectively, of pure Sn, Sn-Zn and Sn-Zn-Ag alloy during soldering. The intermetallic compound formed at the interface is different Cu/Sn and Cu/Sn-9Zn-1Ag reaction after 15 sec soldering. The Cu3Sn and Cu6Sn5 was formed at the interface of Cu/Sn reaction but the CuZn, Cu5Zn8, Ag5Zn8 and AgZn3 formed at the interface of Cu/Sn-9Zn-1Ag reaction. It was found that the innermost region adjacent to the Cu metal, with a thickness of less than 70nm, is consisted of an amorphous element diffusion region and then a nanocrystalline cell dispersed region. These nanocrystalline cells corresponded to CuZn for Cu/Sn-9Zn-1Ag and Cu3Sn for Cu/Sn. A zigzag dissolution model and a channel dissolution model were proposed for the dissolution of Cu, respectively, in Sn and Sn-Zn-containing solder.

    中文摘要........................................I 英文摘要.......................................II 誌謝..........................................III 總目錄.........................................IV 表目錄........................................VII 圖目錄.......................................VIII 中英文對照....................................XII 第壹章 簡介.....................................1 1-1 焊錫接合在微電子工業的應用..................1 1-1-1 傳統錫鉛合金的性質........................1 1-1-2 無鉛議題的因應措施........................2 1-2 銲錫合金與基材的界面反應....................3 1-2-1介金屬化合物的生成.........................4 1-2-1-1 銅錫介金屬化合物........................4 1-2-1-2 銅鋅介金屬化合物........................9 1-3 底層金屬之消耗.............................10 1-3-1 界面介金屬化合物之剝離現象...............14 1-3-2 銲錫合金元素之影響.......................20 1-4 研究動機與目的.............................21 第貳章 實驗方法與步驟..........................22 2-1 實驗構想...................................22 2-2 焊錫接合試片之製備.........................22 2-2-1 銲錫合金之製備...........................24 2-2-2 底層金屬之製備...........................25 2-2-2-1 微影製程...............................25 2-2-2-2 濺鍍製程...............................26 2-2-3 急速冷卻裝置.............................26 2-2-4 迴焊條件.................................26 2-3 焊錫接合試片之分析.........................32 2-3-1 底層金屬消耗體積之量測...................32 2-3-2 介金屬化合物生成體積之量測...............33 2-3-3 掃瞄電子顯微鏡分析.......................35 2-3-4 X光繞射分析.............................35 2-3-5 電子微探針顯微鏡分析.....................35 2-3-6 穿透式電子顯微鏡分析.....................36 第參章 結果與討論..............................37 3-1 銲錫合金元素對銅基材消耗之影響.............37 3-1-1 合金元素對銅基材消耗厚度之影響...........37 3-1-2 合金元素對介金屬化合物生成種類與體積之影響.............................................38 3-1-3 結論.....................................40 3-2 銲錫合金元素對初期界面介金屬化合物生成之影響.............................................44 3-2-1 錫與鋅元素對初期界面介金屬化合物生成之影響.............................................44 3-2-2銀元素對初期界面介金屬化合物生成之影響....46 3-2-3初期界面介金屬化合物之生成行為............62 3-2-4 結論.....................................66 3-3 銲錫合金元素對銅金屬溶解行為之影響.........71 3-3-1 錫元素對銅金屬溶解行為之影響.............71 3-3-2 鋅與銀元素對銅金屬溶解行為之影響.........74 3-3-3 結論.....................................78 第肆章 總結....................................84 第伍章 未來研究方向之建議......................85 參考文獻.......................................86 自述...........................................91

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