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研究生：	陳昱劭 Chen, Yu-Shao
論文名稱：	選擇性雷射燒結304L不鏽鋼加工參數及熱應力之研究 A study of the processing parameters and thermal stress on selective laser sintered 304L stainless steel
指導教授：	林震銘 Lin, Jehnming
學位類別：	碩士 Master
系所名稱：	工學院 - 機械工程學系 Department of Mechanical Engineering
論文出版年：	2016
畢業學年度：	104
語文別：	中文
論文頁數：	123
中文關鍵詞：	雷射燒結、重疊率、孔隙性、熱應力
外文關鍵詞：	Laser sintering, Overlap rate, Porosity, Thermal stress
相關次數：	點閱：100 下載：0
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本研究主要探討選擇性雷射燒結(SLS)，於保護氣體環境及粉末預熱條件下，探討304L不鏽鋼粉末之燒結參數，觀察燒結試件表面微觀組織差異及孔隙率之研究，並進行多層堆疊之燒結實驗，藉由微觀組織及孔隙率之關係，找出最適合堆疊之加工參數。

燒結實驗部分，以波長1064nm之Q-switched Nd-YAG雷射加熱固定比例4:1(不銹鋼:紅銅)配置之金屬粉末，以雷射功率、掃描速度、掃描間距及預置粉末厚度為實驗參數，探討單層燒結時表面微觀組織及孔隙率之關係。並發現在多層堆疊時有翹曲現象產生，因此採取粉末預熱方式減少翹曲現象。於實驗結果顯示，雖然預置粉末越厚、掃描速度越慢、掃描間距越小有助於孔隙率下降，但過慢的掃描速度及過小的掃描間距，會造成堆疊試件發生破裂或分層現象。

數值分析部分，利用有限元素分析軟體ANSYS(APDL)以熱-結構間接耦合方式進行模擬，觀察雷射熱源掃描時於相鄰路徑之溫度變化關係，並討論在不同燒結參數下雷射引發之熱應力、殘留應力及薄板翹曲變形之影響，最後再將數值分析結果與實驗結果做比較討論。

This study focused on selective laser sintering (SLS) at the conditions with preheating and shielding gas. Experimentally with the sintering parameters for 304L stainless steel powder, the specimen surface microstructure and porosity were observed. It is going to find the optimum parameters for multilayer stack.

The sintering experiments were made with Q-switched Nd-YAG laser (a wavelength of 1064nm) in a ratio of 4: 1 (stainless steel to copper). The laser power, scanning speed, scanning space and preset powder thickness were selected as experimental parameters to investigate the relationship between morphology and porosity in laser sintering. It could find the warpage and cracking phenomenon. With the preheating the powder to reduce warpage, the overlap rate is a critical parameter.

Numerical analysis with finite element analysis software –ANSYS(APDL) to simulate the moving heat source in a non-linear transient model based on sequentially coupled thermo-mechanical field analysis, the thermal stress, deformation caused by different scanning parameters were simulated. Finally, the simulation results were compared with experimental results.

摘要 Ⅰ
Abstract Ⅱ
誌謝 VIII
目錄 IX
表目錄 XIV
圖目錄 XVI
符號說明 XXII
	

第一章	緒論 1
1-1 研究背景與目的 1
1-2 文獻回顧 4
1-2.1雷射燒結熱應力探討 4
1-2.2低功率脈衝雷射燒結 7
1-2.3雷射燒結參數探討 8
1-2.4粉末預熱對於燒結之影響 9
1-2.5雷射燒結溫度量測分析 10
1-3 本文架構 12
第二章	相關理論 13
2-1雷射光束之聚焦 13
2-2材料吸收率與反射率 15
2-3 雷射作用引發熱應力 15
2-3.1雷射熱能引發溫度分佈 15
2-3.2雷射照射平板之一維模組 17
2-3.3雷射照射平板之三維模組 19
2-4 燒結原理 22
2-4.1液相燒結原理 23
2-4.2液相燒結過程 24
2-4.3影響液相燒結品質 26
	
第三章	數值模擬 29
3-1 ANSYS軟體簡介 29
3-1.1 ANSYS軟體架構 29
3-2 模型建構與網格劃分 31
3-3 材料參數 32
3-4 邊界條件 34
3-4.1熱源界條件 34
3-4.2熱傳邊界條件 35
3-4.3力學邊界條件 35
3-5 有限元素分析基本假設 36
3-6模擬參數 38
3-7模擬結果與討論 40
3-7.1不同燒結道次於表面之溫度影響 	40
3-7.2不同燒結道次於深度之溫度影響 	40
3-7.3不同燒結道次於表面之熱應力影響 43
3-7.4不同燒結道次於深度之熱應力影響 49
3-7.5不同燒結道次於表面殘留應力之影響 51
3-7.6不同燒結參數於表面殘留應力之影響 51
3-7.7不同燒結參數於薄板翹曲變形之影響 54
     3-7.7.1掃描速度於薄板翹曲變化之影響 55
     3-7.7.2掃描間距於薄板翹曲變化之影響 56
     3-7.7.3粉末預熱於薄板翹曲變化之影響 58
3-8數值模擬總結 59
	
第四章	實驗 62
4-1 實驗前置作業 62
4-1.1雷射功率量測 62
4-1.2金屬粉末配置 64
4-2 量測實驗 66
4-2.1 粉末吸收性量測實驗 66
4-2.2溫度量測實驗 68
      4-2.2.1溫度量測實驗配置 68
      4-2.2.2溫度量測之結果 70
4-2.3孔隙量測實驗 73
      4-2.3.1影像分析法 73
4-3 雷射燒結實驗 75
4-3.1 實驗流程 75
4-3.2實驗設備 77
4-3.3 實驗參數 80
4-3.4預置粉末厚度和掃描速度與燒結試件之關係 81
4-3.5預置粉末厚度和掃描間距與燒結試件之關係 83
4-3.6燒結參數和孔隙率關係 87
4-3.6.1掃描速度和孔隙率關係 87
     4-3.6.2 掃描間距和孔隙率關係 88
4-3.7多層堆疊燒結實驗 90
4-3.7.1堆疊層和掃描間距關係 92
4-3.7.2多層堆疊試件於高溫爐中燒結 94
   4-3.8實驗結果和數值分析比較 97
     4-3.8.1燒結溫度比較 97
     4-3.8.2翹曲變形比較 98
4-4 實驗結論 99
	
第五章	綜合討論與建議 104
5-1 綜合討論 105
5-2 未來發展與建議 108
	
參考文獻 109
	
附錄A複合材料混合定律 111
附錄B孔隙率量測方法介紹 113
附錄C不同參數下單層燒結表面顯微圖 116
                                    

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校內：2026-07-01公開
校外：2026-07-01公開電子論文尚未授權公開，紙本請查館藏目錄

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