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研究生：	韓宜庭 Han, Yi-Ting
論文名稱：	以實驗及有限元素法探討保護層對積層陶瓷電容機械強度之影響 Investigation of the effects of protective layer on the mechanical strength of multilayer ceramic capacitors by using experiment and finite element methods
指導教授：	向性一 Hsiang, Hsing-I
學位類別：	碩士 Master
系所名稱：	工學院 - 資源工程學系 Department of Resources Engineering
論文出版年：	2019
畢業學年度：	107
語文別：	中文
論文頁數：	77
中文關鍵詞：	積層陶瓷電容、殘餘壓應力、抗彎強度、保護層、有限元素法
外文關鍵詞：	MLCC, residual compressive stress, bending strength, protective layers, finite element method
相關次數：	點閱：60 下載：0
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積層陶瓷電容組裝在電路板及使用時，其介電陶瓷材料主要會受到熱機械力等作用力影響，當內部應力超過陶瓷電容本身能夠承受的機械強度，便會發生微破裂，若裂縫穿過內電極層，將會使絕緣阻抗變小，產生漏電流的短路現象，隨後導致產品功能失效。本研究利用維氏硬度計量測積層陶瓷電容之內部應力分布，並利用在上下層料蓋堆疊鎳保護層，藉由在MLCC元件表面產生足夠之殘留壓縮應力，改善產品可靠度及使用壽命。研究發現藉由在上下層料蓋堆疊鎳保護層，可使接近表面層之裂痕往平行於內電極之方向延展。在上下層料蓋堆疊一層鎳保護層，確實可有效改善產品可靠度及使用壽命。此外，本研究亦運用線性與非線性結構力學分析軟體了解改變MLCC保護層的材料、疊層方法及厚度與殘留應力間的關係。

When multilayer ceramic capacitors (MLCC) are assembled on a circuit board, the cracks easily occur due to depaneling of the print circuit board, screw fastening, or shock from a vibration or a drop, which may lead to a short circuit failure. In this study, micro-hardness technology is used to measure the internal stress distribution of MLCC, and the stacking of the nickel protective layers on the upper and bottom of MLCC is used to improve the bending strength by generating sufficient residual compressive stress on the surface of MLCC. It has been found that when a nickel protective layer was stacked on the upper and bottom of MLCC, the bending distance to induce a crack near the surface layer can be effectively extended. In addition, linear and nonlinear structural mechanics analysis software was also used to understand the effects of the material, thickness, and lamination method of the protective layer on the distribution of the residual stress in MLCC.

摘要	I
誌謝	IX
目錄	X
表目錄	XIII
圖目錄	XIV
第一章 緒論	1
1-1 前言	1
1-2 研究目的	2
第二章 文獻回顧	3
2-1 積層陶瓷電容簡介	3
2-2 積層陶瓷電容發生微破裂之原因	6
2-2-1 熱衝擊(Thermal Shock)失效	6
2-2-1 電路板彎曲造成之機械破壞(Board Flex Test)	6
2-3 提升機械強度之方法	8
2-3-1 熱韌化	8
2-3-2 化學強化法	8
2-3-3 利用熱膨脹係數差製造殘留應力	9
2-3-4 利用高硬度陶瓷提升元件強度	10
2-4 殘留應力	10
2-4-1 X-ray繞射測量殘留應力	11
2-4-2 微壓痕測量殘留應力	12
2-5 有限元素法	13
2-5-1 彈性力學之平面問題	13
2-5-2 彈性力學之對稱軸問題	15
2-5-3 平面問題之應變矩陣、應力矩陣	17
2-5-4 熱變形與熱應力計算	21
2-5-5 以有限元素法分析應力於微小元件內部之相關研究	23
第三章 實驗步驟與分析方法	26
3-1 模擬軟體分析	26
3-2 樣品製備	28
3-2-1 粉末製備	28
3-2-2 量測熱膨脹係數之樣品製作	30
3-2-3 薄帶製作	30
3-2-4 MLCC元件製作	30
3-3 性質量測	32
3-3-1 熱膨脹係數量測	32
3-3-2 密度量測	32
3-3-3 顯微結構分析	32
3-3-4 硬度及殘留應力	32
3-3-5 板彎測試	32
3-4 樣品代號	34
3-4-1 BTn-m	34
3-4-2 堆疊添加0.5wt% Ni之BaTiO3薄帶之樣品	34
3-4-3 同向層樣品	34
第四章 ABAQUS模擬結果	36
4-1 不同保護層層數對殘留應力之影響	36
4-2 不同性質之保護層對殘留應力之影響	48
4-3 不同厚度之保護層對殘留應力之影響	50
4-4 改變倒角對應力之影響	51
第五章 實驗結果與討論	54
5-1 不同Ni金屬添加量對BaTiO3材料物理性質之影響	54
5-1-1 熱膨脹係數	54
5-1-2 密度	55
5-1-3 顯微結構	56
5-1-4 硬度及殘留應力(vicker’s)	58
5-2 不同Ni添加量之BaTiO3與BME MLCC生胚共燒之性質影響	60
5-2-1 抗彎強度	60
5-2-1 元件破裂角度	61
5-3 以Ni作為保護層對BME MLCC機械性質之影響	64
5-3-1 硬度及殘留應力	64
5-3-2 抗彎強度	69
5-3-3 元件破裂角度	70
第六章 結論	74
參考文獻	75

                                    

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校內：2023-01-01公開
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