本實驗以Co-Cr-Pt-B磁性合金為材料，研究不同製程條件對於磁性薄膜性質所造成的影響。實驗中利用射頻濺鍍的方式將Co-Cr-Pt-B合金薄膜濺鍍於矽基板上，其中Co-Cr採合金靶方式，而Pt與B採貼片方式。實驗中改變的製程條件如下：Ti 層的施加以及厚度所造成的影響、基板溫度的改變、退火溫度的改變以及退火時間的改變。
當改變Ti 層的厚度時，會直接影響到濺鍍在其上之磁性薄膜的失序層厚度，而失序層厚度的不同也會直接影響到磁性質的表現。在濺鍍過程中使用不同基板溫度只會對薄膜本身晶粒產生改變，當溫度越高晶粒也就越大。對於磁性質則無明顯改善。
退火條件的影響則較為明顯，當退火溫度上升時晶粒大小也會隨之成長。當退火溫度到達700℃時，則開始有第二相CoPt相的析出。在磁性質方面，隨著退火溫度的上升都會有一定的改善情形。至於在退火時間的改變方面，發現當退火時間越長晶粒也會有成長的情形，但在垂直膜面上的矯頑磁力卻產生下降的趨勢。

In this experiment, the Co-Cr-Pt-B magnetic thin film was used as material to find out the effect of different manufacturing processes. The magnetic thin film is deposited on Si substrate by Radio-Frequency Sputtering using composite target.
The different manufacturing processes used in this experiment are as follows: the addition and the thickness of Ti under-layer, different substrate temperature, and post annealing process including annealing temperature and annealing time.
Changing the thickness of Ti under-layer will directly affect the thickness of disordered layer while the thickness of this disordered layer will also affect the magnetic properties of thin film.
The higher the substrate temperature, the bigger grain size is after sputtering. However, the magnetic properties cannot be promoted significantly via rising substrate temperature.
The effect of post-annealing process is more obvious. The grain size grows up as the annealing temperature increases and a second phase (CoPt) begins to precipitate when the annealing temperature reaches 700℃. The magnetic properties of thin film are also enhanced with the increase of annealing temperature. The grain size grows up with annealing time, but the perpendicular coercivity tends to decrease while the annealing time is extended.

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