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研究生: 劉柏良
Liu, Bo-Liang
論文名稱: 鈦酸鋇電阻式記憶體基於並聯式雙盤耦合共振器之電光響應
The Electro-optical Response of the BaTiO3 Resistive Random Access Memory (ReRAM) Based on the Parallel Double Disk Resonators
指導教授: 莊文魁
Chuang, Wen-Kuei
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 微電子工程研究所
Institute of Microelectronics
論文出版年: 2021
畢業學年度: 109
語文別: 中文
論文頁數: 97
中文關鍵詞: 電阻式隨機存取記憶體並聯雙盤耦合諧振器鈮酸鋰(LiNbO3)
外文關鍵詞: Resistive random access memory (ReRAM), parallel double disk-coupled resonator, lithium niobite (LiNbO3)
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  • 由於電阻式記憶體具有非揮發特性、MIM結構簡單、低功耗、製程微縮化能力高等特點,這種獨特的元件具有強大的潛力,成為未來非揮發性存儲器的主要候選者之一。 且其相對簡單的結構也方便地使其能夠與包括光學盤形共振器在內的其他元件整合在一起。並聯式雙盤耦合共振器在波長選擇性和可調諧性方面具有額外的優勢,使其在光子集成電路中得到廣泛討論和實施。
    在Al/BaTiO3/ITO研究中,比較不同鈦酸鋇膜厚的電阻式記憶體特性,在Al/BaTiO3(60nm)/ITO有較多切換次數425次、 SET電壓為-0.69V、RESET電壓為0.475V、開關比為100以及阻態維持時間超過10000秒。
    此論文將Al/BaTiO3(60nm)/ITO低切換電壓和低功耗的電阻式記憶體,整合到並聯式雙盤耦合共振器上。在雙盤間距15 μm時,電阻式記憶體調變雙盤耦合共振器的相位,從光輸出的Through port與Drop port呈現相位反轉。當雙盤間距減少到10 μm與5 μm的一系列量測特性中,也可以看到預期,電阻式記憶體調變共振器,使Through port與Drop port相位反轉,還可以改善原先共振器的效果。

    Due to the non-volatile characteristics, simple MIM structure, low power consumption, and high process miniaturization capabilities of the resistive random access memory (ReRAM), this unique device has a strong potential to emerge as one of the leading candidates for future non-volatile memories. Furthermore, its relatively simple structure also conveniently allows it to be integrated with other device components including optical disk resonators. Parallel double disk-coupled resonators could have additional leverages in terms of wavelength selectivity and tunability when compared with a single disk resonator, making it widely discussed and implemented in photonic integrated circuits.
    With the memory devices based on the Al/BaTiO3 (BTO)/ITO structure fabricated at hand, by cross analyzing the resistive memory characteristics in terms of various barium titanate (BTO) film thicknesses, it is found that the device with 60 nm thick BTO can switch more than 425 times, while the corresponding SET/RESET voltage, the on-off ratio, and the retention time are -0.69V/0.475V, 100, and more than 10000 seconds, respectively.
    The present work focuses on Al/BaTiO3(60nm)/ITO resistive memory having a low switching voltage and a low power consumption integrated with a parallel double disk-coupled resonator. When the double disk separation gap is set at 15 μm, ReRAM-mediated double disk resonators could render a phase reversal between the light outputs coming off from the through-port and drop-port. If the gap is shortened to 10 and 5 μm, the expected phase reversal coupled with an improved performance delivered by the ReRAM-mediated resonators are also witnessed in a series of characterization measurements.

    中文摘要 I 英文摘要 III 誌謝 XIX 目錄 XXI 表目錄 XXV 圖目錄 XXVII 第一章 序論 1 1-1光子積體電路 1 1-2鈮酸鋰基本特性 2 1-3質子交換法 3 1-4熱退火式質子交換 6 1-5研究動機 7 第二章 鈮酸鋰垂直耦合雙環共振器 8 2-1 環形共振器設計 8 2-2 並聯式雙環形耦合共振器 12 第三章 記憶體種類 16 3-1 記憶體簡介 16 3-2 非揮發性記憶體 17 3-3 電阻式記憶體 (Resistive random-access memory,RRAM) 18 3-3-1 電阻式記憶體操作模式 19 3-3-2 電阻式記憶體切換機制 20 3-3-3 元件操作次數 (Cycle) 21 3-3-4 記憶體儲存時間 (Retention Time) 21 3-3-5 電阻開關比 (On/Off ratio) 21 3-4 鈦酸鋇特性 22 第四章 介電薄膜傳導機制 24 4-1 電極限制 (Electrode-limited) 24 4-1-1 穿隧 (Tunneling ) 24 4-1-2 蕭特基發射 (Schottky emission) 27 4-2 本體限制 (Bulk limited) 28 4-2-1 普爾-法蘭克(Poole-Frenkel) 29 4-2-2 歐姆傳導 (Ohmic conduction) 30 4-2-3 空間電荷限制傳導 (Space-charge-limited conduction,SCLC) 31 第五章 元件製作流程 33 5-1 元件製程概述 33 5-2元件製程流程 35 5-2-1 光罩設計 35 5-2-2 鈦酸鋇靶材製作 39 5-2-3 電阻式記憶體製作流程 40 5-2-4 波導整合電阻式記憶體流程 42 5-3製程細節 49 5-3-1 鈮酸鋰基板前處理 49 5-3-2 濕蝕刻參數 49 5-3-3 鍍膜製程 50 5-3-4 黃光室參數極光阻S1813旋塗參數 50 5-3-5 質子交換及退火 51 5-3-6 拋光研磨 52 第六章 元件量測與結果討論 54 6-1 鈦酸鋇粉末XRD分析 54 6-2 電阻式記憶體電性量測 55 6-2-1 不同鈦酸鋇介電薄膜厚度(15nm/30nm/45nm/60nm)之Forming電壓比較 55 6-2-2 不同鈦酸鋇介電薄膜厚度(15nm/30nm/45nm/60nm)之電阻切換 57 6-2-3 鈦酸鋇電阻式記憶體介電薄膜厚度60nm切換特性 61 6-3 探討導電機制 62 6-3-1 SET導電機制Fitting 62 6-3-2 RESET導電機制Fitting 65 6-4光學量測架構 68 6-5並聯式雙環耦合共振器未加偏壓之頻譜 69 6-6並聯式雙盤耦合共振器加偏壓之頻譜 72 6-6-1 雙盤間距15 μm下電阻切換後的頻譜 73 6-6-2 雙盤間距10 μm下電阻切換後的頻譜 76 6-6-3 雙盤間距5 μm下電阻切換後的頻譜 79 6-7 分析 82 第七章 結論與未來工作 89 7-1結論 89 7-2未來工作 93 第八章 參考文獻 94

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