本研究目的在於探討添加1、5、10wt.%In對Sn-Ag-Sb無鉛銲料之熔點、微結構、潤濕性、硬度及界面 IMC層之影響。同時利用單邊搭接試件(Single lap)及高溫熱儲存來評估銲點之剪切強度與抗熱性之影響。
　　實驗結果顯示Sn-Ag-Sb-xIn銲料之熔點隨著In的增加而降低，但固、液相區間卻隨著In的增加而出現擴大的情形。在Sn-Ag-Sb銲料中加入In以後，隨著In含量的增加及熱儲存的影響，析出物中Sn原子逐漸被In原子所替代，故Ag-Sn-In化合物隨著In元素的增加，組成會由Ag3(Sn,In)轉變成Ag2(In,Sn)亦導致基地中β-Sn面積增加。Sn-3Ag-2Sb-xIn銲料與Cu基板銲接後，界面會生成Cu6(Sn,In)5化合物且界面層上方會出現Ag-Sn-In-Cu化合物。化合物會隨著In含量及熱儲存時間的增加而變得粗大。IMC厚度則隨著熱儲存的增加而變厚，含In量越多之銲料，其IMC層成長的幅度越大。
　　潤濕性質方面，隨著In的增加，散佈面積比(Spreading ratio, Sr)會隨之變大且接觸角(Contact angle, θ)也變得越小，因此In的添加有助於改善Sn-Ag-Sb銲料之可銲性。在機械性質表現方面，在As-cast的狀態下，Sn-Ag-Sb-xIn銲料硬度會隨著In添加量的增加而提高。在經過高溫熱儲存後，各銲料均呈現軟化的現象，其中以SAS10In 最為嚴重。此外，銲點之剪切強度也隨著In的添加逐漸提升，添加1、5、10wt%In後，剪切強度分別為62.2、80.2、103.9MPa，而到625小時後強度降為49.1、62.7、85.8 MPa，其中以SAS10In之延性最差。因此，In的添加雖然使銲料強度提高但相對亦會使其延性變差。隨著In與熱儲存的增加，由於界面層厚度的變化，銲點之破壞位置發生銲料內部逐漸減少，進而轉變成混合破壞模式再變成界面層破壞。綜合銲料熔點、金相微結構、銲料潤濕性、銲點剪切強度及界面層之變化，目前研究結果顯示Sn-3Ag-2Sb-5In銲料會有較佳之性質。

關鍵字：無鉛銲料、熔點、Ag2(In,Sn)化合物、潤濕性、硬度、剪切強度

The goal of this research is to evaluate the effects of adding 1, 5, 10wt.% Indium into Sn-Ag-Sb lead-free solders on melting point, microstructure, wettability, microhardness and the interfacial reaction with Cu substrate. Furthermore, the single lap specimens and high temperature storage were used to evaluate the shear strength and heat-resistance of Sn-Ag-Sb-xIn solder joints.
Experimental results show the melting point of Sn-Ag-Sb-xIn solders are decreased with greater indium additions. The gap between solidus and liqiudus temperature (Mushy zone) will expand with the addition of Indium into Sn-Ag-Sb solder
The formation of Ag3(Sn,In) is suppressed by the presence of indium in Sn-rich solder matrix and Ag2(In,Sn) appears in the solder matrix through the substitutional reaction between Sn atoms and In atoms. Moreover, the area of β-Sn in solder matrix also increase.
When Sn-Ag-Sb-xIn solder combine with Cu substrate, Ag-Sn-In-Cu and Cu-Sn-In IMC compounds were observed on the interfacial microstructure. The greater Indium additions and thermal storage time, the coarser of Ag-Sn-In-Cu compounds. After the 150℃ thermal storage, thickness of IMC layer will be raised as the Indium addition increasing.
The spreading ratio (Sr) tend to increase with presence of Indium, contact angle decreases with the greater Indium content. The hardness of Sn-Ag-Sb-xIn solders will increase as the addition of indium and degradation occurred after thermal storage.Shear strength of as-soldered joints is increased with higher Indium additions. The shear strength of whole solder joint decrease distinctly after 150℃ thermal storage.
Fractographic analysis showed that most of the solder joints failure in solder (Solder mode) at the as-soldered condition. The greater additions of Indium and thermal storage time lead to transform the fracture mode to be IMC mode which fracture occurred at IMC layer.
With compare of melting point, microstructure, wettability, shear strength and interfacial behavior of Sn-Ag-Sb-xIn solder. The solder contains 5wt.% Indium has better behaviors.

Keywords : Lead-free solder joint, melting point, Ag2(In,Sn) compounds, wettability, hardness, shear strength.

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