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研究生: 王澤仁
Wang, Tza-Ren
論文名稱: 不同材料介面熱傳之實驗分析與COMSOL模擬
Experimental Analysis and COMSOL Simulation on Interfacial Heat Transfer between Different Materials
指導教授: 趙隆山
Chao, Long-Sun
學位類別: 碩士
Master
系所名稱: 工學院 - 工程科學系
Department of Engineering Science
論文出版年: 2015
畢業學年度: 103
語文別: 中文
論文頁數: 89
中文關鍵詞: 介面熱傳係數接觸熱阻逆運算
外文關鍵詞: inverse numerical method, interfacial heat-transfer coefficient, thermal contact resistance
相關次數: 點閱:142下載:6
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  • 在巨觀的情況下,將不同材料疊合會感覺其為完美接觸,但是在微觀情況下,不同材料接觸並不會形成完美接觸,是因為無論材料互相接觸的表面多光滑,其細看皆是粗糙不平的,一般而言,最簡單的研究方法是假設兩塊材料介面間為完美接觸,即溫度與熱通量在此介面為連續,但此假設與真實情況會有差異,而探討此兩塊材料介面間的微小空隙即為本文研究之重點,本文將利用數值模擬與實驗分析對上述之現象進行分析。
    實驗方面,使用了純銅和純鋁作為實驗模型,並對其施加不同功率與壓力,來量測其內部的溫度變化,在分析方面,使用有限差分法,而在數值模擬方面,則利用COMSOL進行其溫度方面的觀察,觀察溫度變化對於接觸熱阻的影響、所施加的荷重是否會對於接觸熱阻造成影響,最後將數值模擬配合實驗所測量到的數據,利用逆運算法來逆運算無法量測的介面熱傳係數。

    Two different materials are put together. From the macroscopic viewpoint, they intuitively seem to be perfect contact at the interface. However, from the microscopic one, they are not perfect contact because the contact surfaces are microscopically rough regardless of being macroscopically smooth. In general, the easiest assumption for the interface analysis is perfect contact, where the temperature and heat flux are continuous. However, the assumption deviates from the practical condition. To study the imperfect contact interface is the key point of the thesis. In the work, the numerical simulation and the experimental analysis are used to investigate the interfacial phenomenon. In the experimental study, copper and aluminium are used as the testing materials, input power and external pressure are utilized as the working parameters, and temperatures in these two materials are measured for the analyses. In the study, the finite difference is employed to inversely calculate the effective heat transfer coefficients at the interface by using the measured temperature data. COMSOL is used to analyse the temperature distribution after the coefficients are obtained. In the thesis, the effects of working parameters on the effective heat transfer coefficients and the corresponding temperature profiles are studied.

    摘要 I 致謝 VII 目錄 VIII 表目錄 XI 圖目錄 XII 符號說明 XVIII 第一章 緒論 1 1-1 文獻回顧 2 1-2 研究方法與目的 5 第二章 理論模式 6 2-1 物理模型 6 2-1-1頂端邊界 6 2-1-2 隨著時間變化的邊界溫度 7 2-2 基本假設 7 2-3 統御方程式 7 2-4 初始與邊界條件 8 2-5 介面熱傳係數h之逆運算 9 第三章 實驗設備與方法 17 3-1 實驗設備 17 3-1-1 製作材料設備 18 3-1-2 量測壓力設備 19 3-1-3 高低溫控制設備 19 3-1-4 溫度擷取設備 20 3-1-5 熱電偶點焊設備 21 3-2 實驗模組 21 3-3 實驗模型設計 22 3-4實驗步驟與方法 22 3-4-1 量測實驗模型溫度分佈的方法 23 3-5 實驗數據整理與計算 24 第四章 數值分析 36 4-1有限差分法 36 4-1-1 兩塊材料介面為緊密接觸的差分方程式 37 4-1-2 兩塊材料接觸面含有微小空隙的差分方程式 38 4-2數值方法的驗證 40 4-2-1 數值模擬一維之驗證 40 4-3數值方法及研究方法 41 4-3-1 COMSOL Multiphysics軟體 41 4-3-2 有限元素法 43 4-3-3 元素與內插函數 43 4-3-4 研究步驟 44 第五章 結果與討論 47 5-1 實驗結果 47 5-2熱傳分析-利用數值模擬本文之實驗模型 49 5-2-1 介面熱傳係數之逆運算 49 5-2-2 逆運算所得之介面熱傳係數之驗證 50 5-2-3 實驗模型溫度場之模擬 51 第六章 結論 86 參考文獻 88

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