隨著半導體與電力電子設備功率密度的持續攀升，如何有效排除廢熱已成為維持系統穩定性與元件可靠度的核心課題。傳統針狀鰭片散熱器因氣流繞過圓柱後於背風側形成流動滯留區，導致熱量滯留並使散熱效率受限。本研究提出具穿孔及垂直高度位移分流板之針狀鰭片，在等體積約束下，透過分流板引導流場並活化鰭片背風側氣流，以極大化散熱效益。本論文採用商業套裝軟體CFD-ACE+建立三維數值模型，並結合拉凡格氏法（Levenberg-Marquardt Method, LMM）進行幾何參數最佳化，以最小化底板平均溫度與環境溫度之溫差（ΔT）為目標。
本研究以既有之實心針狀鰭片（Solid#1）及最佳穿孔針狀鰭片（Design No.1）為比較基準，並依序提出以下三種創新設計: Design A為具固定分流板之針狀鰭片，以驗證分流板對流場之引導效能; Design B在Design A基礎上導入具垂直位移之分流板，以分流板長度L與垂直位移量S為設計變數，透過LMM最佳化，成功開通鰭片根部流道，改善背風側熱堆積；最後Design C進一步於Design B中加入穿孔結構，以促進氣流穿透鰭片背風側並強化該區域之局部對流換熱能力，本設計以分流板垂直位移量S、分流板長度L、圓柱直徑D及穿孔直徑Dp為設計變數。最佳化結果顯示，Design C散熱器之散熱效果最佳，其ΔT為16.5°C，相較於Design No.1，Design A及Design B散熱器之改善幅度分別達15.8%，26%及17.1%。最後依據設計加工製造Solid#1、Design No.1及Design C散熱器，並實際利用紅外線熱像儀（Avio R300SR）於風洞中進行溫度量測，並與CFD-ACE+模擬結果比較驗證。結果顯示Design C散熱器的確具備最佳散熱能力，因此也驗證了結合分流板垂直位移與穿孔設計對增強散熱之有效性。

As the power density of semiconductor and power electronic devices continues to rise, effective thermal management has become essential for maintaining system stability and reliability. This study proposes pin-fin heat sinks incorporating perforations and vertically displaced splitters to activate leeward-side airflow and maximize heat dissipation under constant volume constraints. Three-dimensional numerical models were constructed using CFD-ACE+, and the Levenberg–Marquardt Method (LMM) was employed to optimize geometric parameters with the objective of minimizing the average base-to-ambient temperature difference (ΔT). Three designs were proposed: Design A with fixed splitters, Design B introducing vertical splitter displacement to open the leeward root channel, and Design C further incorporating perforations to enhance convective heat transfer. Results show that Design C achieved the best thermal performance with ΔT = 16.5°C, representing a 15.8% improvement over the baseline Design No.1. Experimental validation using infrared thermography confirmed the numerical predictions, verifying the effectiveness of the proposed design.

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