| 研究生: |
劉昭廷 Liu, Chao-Ting |
|---|---|
| 論文名稱: |
以表面增強紅外光譜分析含磺酸根之硫醚分子於金表面的電化學鍍銅效應 The Study of Electrochemical Deposition of Copper on Au Surface at the presence of a sulfonate-Thioether by SEIRAS |
| 指導教授: |
李玉郎
Lee, Yuh-Lang |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 化學工程學系 Department of Chemical Engineering |
| 論文出版年: | 2013 |
| 畢業學年度: | 101 |
| 語文別: | 中文 |
| 論文頁數: | 142 |
| 中文關鍵詞: | 自組裝單分子膜 、表面增強紅外光譜 、電化學鍍銅 |
| 外文關鍵詞: | Self-assembly monolayer, Surface-Enhanced Infrared Spectroscopy, electrochemical copper deposition |
| 相關次數: | 點閱:113 下載:1 |
| 分享至: |
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本研究利用表面增強紅外線光譜(Surface-Enhanced Infrared Spectroscopy, SEIRAS)結合循環伏安儀(Cyclic Voltammetry, CV),即時記錄含磺酸根之硫醚分子(3-(dimethylcarbamothioylthio)propane-1-sulfonic acid, DPS)於金表面上隨電位變化之自組裝、分子氧化行為,及其作為電化學鍍銅添加劑時的銅膜成長機制。實驗結果顯示,當電極電位由低至高,DPS的分子吸附位向會由垂直表面趨於平躺。電位高於1.1 V時DPS逐漸氧化,此時DPS的二甲胺基團(-N(CH3)2)會解離,且部分DPS的尾端硫醇基(-SH)氧化為磺酸根(-SO3-)。將電位維持在1.25 V達30分鐘,會有更多的氧化態DPS產生,並藉由磺酸根的親水性游離至電雙層中。此外,DPS分子的氧化伴隨一複合物的生成,推測是由二甲胺基團與硫酸根所組成,此複合物與金載體之間具有較強的吸附能力。
經由SEIRAS圖譜的分析得知,在電化學鍍銅的過程中,DPS會由金基板轉置至銅膜上,並與硫酸根離子共吸附於銅表面之上。隨著DPS氧化程度的提高,其增進鍍銅的能力也隨之提升。當大量的DPS分子氧化並生成二甲胺基團與硫酸根之複合物時,鍍銅之機制則略有不同,複合物與硫酸根會共吸附於銅膜之上,而氧化態DPS則游離至電雙層中,在複合物、硫酸根與氧化態DPS三者與銅離子間的相互作用之下,可使鍍銅量達到最高值。
A surface-enhanced infrared spectroscopy (SEIRAS) equipped with cyclic voltammetry (CV) was utilized to study the self-assembly and molecular oxidation behaviors of 3-(dimethylcarbamothioylthio) propane-1-sulfonic acid (DPS) on Au surface, as well as the effects of DPS on the Cu deposition. The experimental results show that DPS molecules adsorb as lift-up orientation at low potentials, but shift to a lying-down conformation at high potentials. At potentials more positive than 1.1 V, DPS will be oxidized and decomposed, leading to the formation of species containing dimethylamino group (-N(CH3)2). Furthermore, the thiol group (-SH) of DPS is oxidized into sulfonate group (-SO3-). By holding the potential at 1.25 V for 30 minutes, a higher amount of oxidized DPS will be formed which tends to diffuse into the electro-double layer, ascribed to the increasing hydrophilicity due to the formation of sulfonate groups. In addition, the SEIRAS spectra indicate that a new compound was formed in associated with the oxidization. This compound is inferred to be a complex composed of dimethylamino group and sulfate ions. The interaction between this complex and the Au substrate is stronger than that between oxidized DPS and Au.
In the Cu deposition process, the adsorbed DPS will transfer from the Au substrate to the deposited Cu film and co-adsorb with sulfate ions on the surface. The oxidized DPS molecules have an enhance effect to the cupper deposition and this effect is more significant when a larger amount of DPS was oxidized and the dimethylamino-sulfate complex was formed. The SEIRAS spectra reveal that the complex and sulfate co-adsorb on the deposited Cu film, but the oxidized DPS desorbs to the electro-double layer. The synergetic effect of the complex, the oxidized DPS, and sulfate ions, contributes to a higher deposition rate in the Cu deposition.
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