藍寶石(也稱剛玉)是氧化鋁(Al2O3)的單晶型態，結構為六方晶格結構，硬度僅次於鑽石，是一種多用途的單晶體材料，有良好的物理特性，具有耐高溫、抗腐蝕、高硬度、高透光性與熔點高達2045℃等特性，光學穿透帶很寬，在LED相關製程中是重要的基礎材料。由於藍寶石硬度極高，於薄化(由600至90m)製程時需要較高的技術，而薄化後的晶片表面也要有較佳的表面品質外，生產成本也要能有高的CP值(成本低高磨削)。薄化製程就是研磨拋光，主要是將晶圓的表面粗糙度修整，使其全部的厚度分佈在一定的範圍。晶圓加工的薄化研磨拋光大多使用研磨砂輪與樹脂銅盤搭載鑽石研磨液進行單端面磨削，雖然磨削晶片的表面品質好、產品良率高，但磨削效率較差，且銅盤對作業環境要求高(如溫度)，盤面易變形，影響晶片精度。本實驗的目的是找出最佳的作業參數，來降低成本與品質最佳化，為達到此目的，就要採用穩健實驗設計法，即田口實驗法。透過田口L18表一連串的實驗數據，使用Minitab進行分析，找出最佳的S/N比，並重複最佳化驗證，比對其預測值S/N比，來判斷該最佳化參數是穩健可信的。

Sapphire is a single crystal type of alumina with a hexagonal lattice structure and hardness second only to diamond. It is a versatile single crystal material with good physical properties and high temperature resistance. Anti-corrosion, high hardness, high light transmission and melting point up to 2045 ° C and other characteristics, optical penetration tape is very wide, is an important basic material in LED related processes. Due to the extremely high hardness of sapphire, higher technology is required for thinning (from 600 to 90 mm), and the surface of the thinned wafer should have better surface quality, and the production cost should be high. CP value (low cost and high grinding). The thinning process is grinding and polishing, mainly to trim the surface roughness of the wafer so that the entire thickness is distributed within a certain range. Thinning and polishing of wafer processing mostly uses a grinding wheel and a resin copper disk to carry a single-side grinding with a diamond slurry. Although the surface quality of the ground wafer is good, the product yield is high, but the grinding efficiency is poor, and the copper disk is in the working environment. High requirements (such as temperature), the disk surface is easy to deform, affecting the accuracy of the wafer. The purpose of this experiment is to find the best parameters to reduce cost and quality optimization. To achieve this goal, a robust experimental design method, namely the Taguchi experiment method, is used. Through a series of experimental data from the Taguchi L18 table, use Minitab to analyze, find the best S/N ratio, and repeat the optimization verification, compared to the S/N ratio of its predicted value to determine the optimization parameters It is stable and trustworthy.

1. F. W. Preston, 1927, “The Theory and Design of Plate Glass Polishing Machine, Journal of the Society of Glass Technology”, Vol. 11, pp. 214-256.
2. K. Phillips and G. M. Crimes, 1977, “On the Mechanism of Material Removal by Free Abrasive Grinding of Glass and Fused Silica”, Wear, Vol. 41, No. 2, pp. 327-350.
3. L. M. Cook, 1990, “Chemical Processes in Glass Polishing”, Journal of Non-Crystalline Solids, Vol. 120,No. 1-3，pp. 152-171.
4. R. Chauhan, Y. Ahn, 1993, “Role of Indentation Fracture in Free Abrasive Machining of Ceramics” , Wear, Vol.162-164, Part A, pp.246-257.
5. O. G. Chekina, and L. M. Keer, 1998, “Wear-Contact Problems and Modeling of Chemical-Mechanical Polishing”, Journal of Electrochemical Society, Vol. 145, No. 6, pp. 2100-2106.
6. Z. J. Pei, S. R. Billingsley, 1999, “Grinding Induced Subsurface Cracks In Silicon Wafers”, International Journal of Machine Tools & Manufacture, Vol.39, No.7, pp.1103-1106.
7. 陳俊達， 2000， ”銅膜之化學機械研磨製程應力作用對磨潤化學反應速率之影響”， 國立成功大學機械工程學系， 碩士論文。
8. K. Sasaki, T. Miyoshi, K. Saitoh, and S. Okada, 1992, “Development and Construction of Polishing Apparatus”, “Knowledge Acquisition and Automation of Polishing Operation for Injection Mold（3rd Report）”, Vol. 58, No.12, pp.2037-2043.
9. Cynthia R. Evanko, David A. Dzombak, J. W. Novak, 1996 , “Influence of Surfactant Addition on the Stability of Concentrated Alumina Dispersions in Water”, Colloids and Surfaces A：Physicochemical and Engineering Aspects, Vol.110, No.4, pp.219-233.
10. Yu Tat-Kwan, 1994, “A Statistical Polishing Pad Model for Chemical- Mechanical Polishing”, Electron Devices Meeting, 1988. IEDM '88. Technical Digest, International, IEEE.
11. C. W. Liu, B. T. Dai, W. T. Tseng, and C. F. Yeh, 1996, “Modeling of the Wear Mechanism During Chemical-Mechanical Polishing”, Journal of the Electrochemical Society, Vol.143, No.2, pp.716-721.
12. Yongsong Xie, and Bharat Bhushan, 1996, "Effects of Particle Size, Polishing Pad and Contact Pressure in Free Abrasive Polishing”, Wear, Vol. 200, No.1-2, pp.281-295.
13. Y. T. Su and Y. C. Kao, 1999, “An Experimental Study on Machining Rate Distribution of Hydrodynamic Polishing Process”, Wear, Vol.224, No.1, pp.95-105.
14. 劉嘉顯， 2003， ”脆材料硬拋光與軟拋光機制分析及最佳製程參數設計：以99%氧化鋁為例”， 國立高雄第一科技大學機械與自動化工程系， 碩士論文。
15. 黃韋翰， 2003， 新式超精密拋光機之矽晶圓拋光特性研究， 國立中山大學機械與機電工程學系， 碩士論文。
16. 黃培堯， 2005， ”密研磨之材料移除率及研磨溫昇的理論模式與實驗探討”， 國立中正大學機械工程系， 博士論文。
17. 盧逸維， 2012， ”TSV製程之矽銅雙效研磨液薄化製程的研究改善”， 國立成功大學工程科學系， 碩士論文。
18. 林怡妙， 2005， ”應用田口方法於精密研磨工件製程與磨耗特性探討”，國立中興大學機械工程學系， 碩士論文。
19. 吳文傑、方明達、鄭錫勳、劉旭唐、何宗漢， 2014， ”以田口方法在不同的拋光參數下取得最佳玻璃移除率研究”， 工程科技與教育學刊第 11 卷第 2 期第 252-263 頁。
20. 李輝煌，田口方法─品質設計原理與實務第四版
21. 創技工業，www.speedfam.com.tw
22. 凱勒斯科技有限公司，www.galaxies.com.tw
23. 中國砂輪企業有限公司，www.kinik.com.tw