本研究以電泳披覆技術於模擬積層陶瓷電容器結構之指叉電極沈積二氧化矽微米圖案，以期望能應用於製備積層陶瓷電容器內電極絕緣層，提高有效電容面積。實驗先將二氧化矽粉體分散於異丙醇，分析懸浮液性質及不同分散方法對粒子分散性之影響，結果發現；二氧化矽之等電位點約為5，加入酸時二氧化矽粒子帶電量皆不高；添加鹼則能使粒子帶負電，且pH=10.5時具最大zeta電位量值-38 mV；而當pH大於10.5時懸浮液會產生凝聚，降低懸浮液穩定性。另外將二氧化矽懸浮液以振動球磨處理30分鐘後分散性最佳，且由粒徑分析結果可知數量平均粒徑為58 nm，應可使堆積圖案具較高解析度，後續研究以前述結果配製最佳懸浮液供電泳披覆用。研究再以傳統式二電極裝置與三電極裝置進行電泳披覆，結果發現使用三電極式裝置具有較高電泳沉積選擇性，研究並提出使用二電極式裝置選擇性較差之原因之一是來自二氧化矽粒子所受靜電合力方向可能指向不帶電電極。以三電極式裝置進行電泳披覆時，用線寬及線距為20至200 微米的指叉電極做為基材，由實驗結果可得線寬及線距越小者沉積速率越快，且生成圖案所需施加電壓越低，展現此製程具有能製備圖案在更細小電極之潛力。最後經電泳參數調整，以10 伏特電泳披覆20秒後，再以800℃燒結，可得無裂縫之二氧化矽微米圖案，以電性量測儀測得圖案電阻值為7.04×109 ohm，符合一般積層陶瓷電容器所需標準，且由奈米刮痕試驗機分析，圖案經燒結後較初鍍時具更高附著性。根據以上結果，三電極式電泳披覆技術具備快速、高選擇性等優點，極具應用至製備積層陶瓷電容器作為絕緣層之潛力。

Micropattern of silica was fabricated on interdigitated array (IDA) electrode, which is an ideal structure of MLCC (multilayer ceramic capacitor) by EPD (electrophoretic deposition). This technique was applied to fabricate insulated layer of inner electrode of MLCC to increase the effective capacity area. First, silica powder was dispersed with different methods in isopropanol (IPA) and then suspension properties were analyzed. From this analysis, it is found that isoelectic point (IEP) of silica was close to 5, zeta potential of silica reached maximum value of -38 mV at pH=10.5, and the average particle size was estimated to be 58 nm. Then, silica particles were deposited on IDA electrodes using ether two electrodes or three electrodes system by EPD. The three electrodes system produced better deposition selectivity, which may due to electric field distribution. Smaller IDA electrode performed faster deposition rate and need lower voltage to fabricate micropattern. Crack-free micropattern of silica was fabricated under applied voltage of 10 V for 20 s followed sintering at 800˚C. The resistance of micropattern was found to be 7.04×109 ohm measured by electric property analyzer, and the adhesion of micropattern was better after sintering. Base on results, EPD process using three electrodes system was very fast, with high selective and was suitable for fabrication of insulated layer for MLCC.

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