此研究係探討兩大部分，第一部分為氮化鋁粉體於液態環氧樹脂中之流變性探討，第二部分為不同粒徑及粒徑分佈之氮化鋁製成的複合材料，並探討其熱傳導值及流變性質。在氮化鋁粉體於液態環氧樹脂之流動性探討中，主要是將不同粒徑分佈之氮化鋁粉體與液態環氧樹脂混合懸浮液流變性問題，使用兩種方式檢測，第一種為垂流法，觀察懸浮液垂流情形判斷流動程度，第二種為流變儀檢測方式，藉由量測懸浮液之轉存模量（storage modulus）與應力（strain）關係找出線性黏彈性區間（linear viscoelastic region）；此外，亦可判斷不同角頻率（angular frequency）與懸浮液之轉存模量（storage modulus）或損耗模量（loss modulus）關係，判定流動情形。另外，再使用剪切速率與懸浮液黏度測定時，於高剪切速率時，可將團聚打散降低黏度，但若小粉體量過多反而造成黏度之提升。若氮化鋁粉體粒徑單一，則易因缺少小粒徑粉體填補粉體之間的空隙，造成流動性下降，若添加適量小粒徑粉體，填補大粉體間的空隙，使得黏度下降。第二部分則使用粒徑分佈不同之氮化鋁粉體，製作成環氧樹脂複合材料，探討複合材料之熱傳導值及流動性影響，若使用粒徑分佈寬之氮化鋁（sample1）時，則能更好的使氮化鋁/環氧樹脂複合材料有效的填充於模具內，達到97.9%之填充程度，若是小粒徑粉體略多（sample2）將導致樹脂量不足以填補空隙，造成孔隙產生，降低填充程度至96.2%，填充程度之差異可使熱傳導值由4.0W/m/K下降至2.48W/m/K。市售二氧化矽/環氧樹脂複合材料之流動性於80℃下，轉動所需力矩較使用二氧化矽與六方晶氮化硼之複合材料低，由於六方晶氮化硼之形狀，垂直於剪切力之方向轉動力矩，造成流動困難形成阻礙。此外，比較不同粒徑分佈之氮化鋁複合材料，發現若是添加少許小粒徑粉體，可使粒徑分佈較廣，並改善流動性。

This research is divided into two sections. The first section is mainly discussing the flowability of aluminum nitride powder blending in the liquid epoxy. The second section is manufacturing epoxy molding compound using different particle size distribution of aluminum nitride powder to explore the thermal conductivity and rheology. The flowability test of aluminum nitride is mainly discussing how the particle size distribution affects the flowability test. There are two methods to measure the flowability. The first method is the dripping consistency test. By observing the dripping length to distinguish the flowability. The second method is using the rheometer to measure rheology behavior. Using the relation between storage modulus and strain to find the linear viscoelastic region. Besides, rheology behavior can be obtained by the relation between angular frequency and storage modulus or loss modulus. Furthermore, it is useful to observe the rheology behavior through shear rate versus viscosity. When the shear rate is high enough, it can break the agglomeration lowering the viscosity. However, when the small particle is too much for the epoxy to contain, it can enhance the viscosity. If the particle size distribution is narrow, the flowability is decreased due to the vacancy between the particle. This phenomenon can be resolved by adding adequate small aluminum nitride powder to fill the vacancy among particles. The second part is manufacturing composite material by the different particle size distribution of aluminum nitride powder to discuss the thermal conductivity and the rheology behavior under the same filler volume percent addition. If using broad size distribution （sample1） of aluminum nitride to fill the mold, it is observed that the bulk density is higher, hence achieving 97.9% of packing extent. If the small particle is too much （sample2） it could lead to a shortage of epoxy. The voids increase with the shortage of epoxy, which could decrease the packing extent to 96.2%. This packing extent difference could reduce the thermal conductivity from 4.0W/m/K to 2.48 W/m/K. The oscillation torque to shear the silica-based composite material is much less than the composite materials using the combination of h-BN and silica. Since the structure of hexagonal boron nitride could hinder the flow. Especially when the h-BN is vertical to the direction of shear rate. Besides, comparing the result of composite materials using aluminum nitride （sample4, sample8）as filler, the flowability could be improved by adding a little small particle of aluminum nitride to broaden the size distribution.

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