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研究生: 李吟萱
Li, Yin-hsuan
論文名稱: 以派屈網為基礎之半導體工廠生產排程策略
Petri-Net Based Scheduling Strategy for Semiconductor Manufacturing Plants
指導教授: 張珏庭
Chang, Chuei-Tin
學位類別: 碩士
Master
系所名稱: 工學院 - 化學工程學系
Department of Chemical Engineering
論文出版年: 2009
畢業學年度: 97
語文別: 中文
論文頁數: 120
中文關鍵詞: 混整數非線性規劃模式半導體生產排程派屈網
外文關鍵詞: semiconductor, MINLP, scheduling, Petri net
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  • 半導體製造是一個高度資本和技術密集的工業程序,其流程的管理更和生產成本息息相關。在傳統上,我們是以人工方式依經驗來尋找並決定最合適生產路徑與排程,為提昇效率並降低人為失誤的可能性,有必要發展出以電腦輔助的方式來尋找最佳的生產排程策略。在本研究中,我們以派屈網來表示半導體生產流程,並進一步利用批次排程的數學模式來描述派屈網中標記流動的動態行為,並據以求得最佳的排程。最後,我們以半導體工廠中最終測試、再回流製程、光微影蝕刻製程為例,來展示此一方式的有效性。

    Semiconductor manufacturing is a capital- and technology-intensive industrial process. Process flow management is closely related to the production cost. Traditionally, the task of production scheduling is performed manually according to experience. In order to improve the solution efficiency and to reduce the chance of human error, it is necessary to develop a computer-aided strategy for this task. In our studies, the Petri nets are used to model the semiconductor manufacturing processes. The token movements in a Petri net can be represented with the well-established batch scheduling model. The optimal schedule of any given process can then be determined by solving this model. The feasibility and effectiveness of the aforementioned approach has been demonstrated with three examples, i.e., the final test process, the re-entrant flow process, and the photolithography-etching process.

    第一章 緒論.......................................... 1 1-1 研究動機 ......................................... 1 1-2 文獻回顧 ......................................... 1 1-3 研究目的 ......................................... 4 1-4 組織與章節 ....................................... 4 第二章 半導體製程之派屈網模式 ....................... 5 2-1 派屈網模式 ....................................... 5 2-2 半導體製程 ....................................... 8 2-3 範例-最終測試 ................................... 10 2-4 範例-再回流製程結構 ............................ 13 第三章 排程規劃策略 ................................. 21 3-1 批次排程數學模式建立 ............................. 21 3-2 共用設備站區與共用渡閘之限制式 ................... 27 3-3 共用暫存設施之限制式 ............................. 28 3-4 目標函數 ......................................... 30 3-5 範例 ............................................ 30 3-6 線性化 ........................................... 40 第四章 案例討論 ..................................... 43 4-1 半導體工廠之最終測試 ............................. 43 4-2 再回流製程結構 ................................... 60 4-3 光微影蝕刻製程 ................................... 77 4-4 最終測試-線性化 ................................. 105 第五章 結論與展望 ................................... 113 參考文獻 ............................................ 114

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