微衝擊冷卻模式對於微機電系統或高熱流通量之積體電路系統，因微小面積所產生熱點(hot spot)之散熱問題有極高的應用潛力。然而相關研究相當缺乏，且基於矽基材之高熱導係數所造成大量之側向熱傳，將使晶片局部點的熱傳分佈不易求得；詳細之流場結構也無研究資料。因此如何設計與製造實驗用晶片，以及量測與分析微衝擊冷卻熱流現象為本研究之主要目的。

本研究以實驗方法探討微氣體噴流衝擊等熱通量加熱晶片之流場與熱傳現象。微噴流是由具微米矩形噴嘴之小型風洞所提供，加熱面則是由熱晶片提供，其與噴流保持垂直方向並以等熱通量均勻加熱，而另一壁面則保持絕熱。由熱晶片加熱器所設定之加熱量、晶片表面局部點及流體溫度的量測，經牛頓冷卻定律計算，可求得晶片表面局部點熱傳係數分佈。微噴嘴是利用KOH對矽之非等向性濕蝕刻加工方式製作出口：長2000µm、寬各為200µm、100µm及50µm之三組矩形噴嘴。熱晶片則利用晶背之機械研磨及TMAH矽濕蝕刻之加工方式將矽基材厚度減至40µm以降低矽基材所造成之熱損失；加熱器與溫度感測器則以離子佈植技術在複結晶矽材料內添加不同濃度之硼離子，並經乾蝕刻塑型而成。實驗晶片在設計、製作及封裝都有特殊的考量使得晶片的良率可達百分百。

實驗結果發現微噴流在剪流層的不穩定性擾動，無足夠能量生成大尺度渦流結構，此現象亦可由噴流中心線速度、紊流強度、頻譜分析及停滯點熱傳係數的量測結果得到相互印證。當微噴流之層流區衝擊熱晶片時，其衝擊後之壁面流會在晶片表面形成具穩定與結構性之大尺度對稱渦流，可因此提高加熱壁面之熱傳效率。以上所討論之現象於大尺寸衝擊冷卻過程則從未發現。最後本研究成功的將實驗結果針對停滯點、局部點及平均熱傳係數建立經驗關係式，可供微機電系統或CPU散熱設計的參考。

Micro-scale impingement cooling process has a very high potential application in cooling a micro-thermal or a high heat flux IC circuits system due to its capability of removing a large amount of heat over a small micro-area. Large-scale impingement cooling flow and heat transfer process has been studied extensively in the past and has wide application in various thermal systems.

However, in micro-scale system, these kinds of study are relatively few. Due to large axial (parallel to the chip surface) conduction of heat in their chip, the local heat transfer and their analysis along the chip could not be obtained. It is noted that the large conduction of heat in the thermal chip is attributed to large thermal conductivity of the wafer material. In addition, detailed flow structure for the micro-impinging jet was also not observed. It appears that a novel design and fabrication for the thermal chip is necessary. This will allow for measurements and analysis of local heat transfer along the heated chip and observation of the flow process for the impinging jet. The observation of the impinging jet is necessary for the understanding of the micro-scale cooling process along the chip.

Therefore, the first objective of this work is to design and fabricate a heated thermal chip that can be impinged and cooled by a single jet from a micro-slot nozzle. For the current chip, it is necessary to design a chip that can reduce the axial (parallel to the chip surface) conduction along the chip due to the large variation in the temperature distribution in the axial direction. Both three sets of micro-heaters and arrays of micro-temperature sensors that are made of polysilicon doped with different concentrations of Boron are deposited by LPCVD on the same side of a Si(100) wafer. The back side of this wafer is ground first and etched with TMAH later to make a 40µm thick of chip. At the same time, the sensors and the heaters in the front side have to avoid the attack by TMAH. Techniques involved in the fabrication process will be presented and discussed. In this way, the axial conduction of heat in the wafer can be significantly reduced. Once the backside of the chip is well insulated, a uniform wall heat flux condition q can be obtained and the local heat transfer coefficient h can be found from the Newton cooling law, i.e. h = q/(Tw –Tj) based on the temperatures measured with the arrays of sensors on the heated chip and the cooling flow temperatures Tj. The peculiar fabrication procedure presented can reach a chip yield of 100%, and every one of the sensors and heaters on the chip is in good condition. The nozzle is etched on Si wafer with KOH and is made rectangular. It has 2000µm in length. The width of the nozzle has three different sizes, i.e. 200µm, 100µm and 50µm, that can be accurately measured.

From the flow visualization of micro-jet, there are no coherence structures of vortices formation in the shear layer as shown in the large-scale jet. It appears that the instability waves in the shear layer have not enough energy to roll up into ring vortices for the micro-scale jet. This is also confirmed in the experiment for measurements of the center line velocity, turbulent intensity and spectra of the velocity fluctuations for the micro-jet, and the location for the occurrence of maximum stagnation point Nusselt number on the heated wall of micro-impingement cooling process. From the visualization of micro-impinging jet, a peculiar phenomenon of two circulation cells appeared in the impinging wall, they were found to significantly enhance the heat transfer Nusselt numbers along the wall. This phenomenon has also not been found in large-scale impingement cooling process before. Finally, the stagnation point Nusselt number, the average Nusselt number and the local Nusselt number have been successfully measured and discussed. They are well correlated in terms of relevant nondimensional parameters, within the experimental range covered.

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