本論文擬合成1,4-雙對胺苯氧基-2-第三丁基（BATB）及1,4-雙對胺苯氧基-2-萘（BAN）兩種單體，再與3,3’,4,4’-二苯甲酮四羧酸二酐(BTDA)以二階段法合成含苯氧基聚醯亞胺。而本研究所製備含苯氧基聚亞醯胺/黏土奈米複合材料是採用層間插入法( intercalation method )，先將經由改質劑dodecylamine(DOA)及Cetyl pyridium Chloride (CPC)改質過有機黏土，加入含苯氧基聚醯亞胺的前驅物(precursor)–聚醯胺酸 (poly amic acid，PAA)，再將不同比例有機黏土和PAA聚合，經過高溫加熱環化反應後，形成含苯氧基聚醯亞胺/黏土奈米複合材料。我們也針對聚醯亞胺的結構及有機黏土的含量對奈米複合材料的形成所造成的影響做一說明，並使用傅立葉轉換紅外線光譜儀(FTIR) 鑑定聚醯亞胺的結構；X-ray繞射儀(XRD)、穿透式電子顯微鏡（TEM），鑑定有機黏土的層間距離(basal spacing)及分散性；熱重分析儀(TGA)、微差掃描熱卡計（DSC）、熱機械分析（TMA）測定材料的熱性質；使用萬用拉力機測定複合材料的應力與模數；藉由介電分析儀可獲得複合材料的介電常數。比較二種改質劑合成之含苯氧基聚醯亞胺/黏土奈米複合材料，並探討實驗可能影響因素及最佳操作條件。

　　In this thesis, we will synthesis two diamine monomer－ 1,4-Bis(4-aminophenoxy)- 2 -tert - butylbenzene（BATB） and 2,7-Bis(4-aminophenoxy) naphthalene（BAN）.A series of phenoxy-containing polyimides will be synthesized from BATB or BAN and 3,3’,4,4’-Benzophenone tetracarboxylic dianhydride（BTDA）by the typical of two step method. In this study，the phenoxy-containing polyimides/clay nanocomposites have been prepared from intercalation
method. We use two kinds of surfactant agents DOA or CPC to change　the original clay and become the organclay. It is blended and a polycondensation reaction in poly amic acid solution （PAA）by means of the different content and then becomed a new phenoxy-containing polyimides/clay nanocomposites by curing reaction. The effects of polyimide structures and clay contents were studied. The structure of polyimides were identified by FTIR . The dispersion level of clay and the basal spacing were identified by XRD and TEM. The thermal properties will be measured by TGA , DSC ,and TMA. We will also study the mechanical properties by universal instron and get the data from the stress and modulus by means of the nanocomposite. We will get the dielectric constant by the dielectric analysis mechine. We also compare the phenoxy-containing polyimides/clay nanocomposites by two surfactant agents, and confer on the experiment to influence the reasons and the best operation in this conditions.

1.黃銳、王旭、李忠明，納米材料，中國輕工業出版社，2002.1
2.M.K.Ghosh, K.L.Mittal, Polyimides, Fundamentals and
Applications, 1~6,Marcel Dekker,Inc.(1996)。
3.Auman, B. C., Myers, T. L., Higley, D. P., J. Polym. Sci., Part A: Polym. Chem. Vol.35, 2441 (1997)
4. Goff, D., Yuan, E., Polym. Mater. Sci. Eng.Vol.59，186 (1988)。
5.Labadie, J., Hedrick, J. Soc. Adv. Mater. Process Eng. J. Vol.26,19 (1990)。6.F. C. Chang et al., J. Appl. Polym. Sci., 79, 1902 (2000)。
7.Yano et al., U. S. Patent, 5,164,460 (1992)。
8.K. Yano, A. Usuki, A. Okada, T. Kurauchi, and O. Kamigaito, J. Polym. Sci., A, Polym. Chem., 31, p. 2493-2498 (1993)
9.A. Usuki, M. Kawasumi, Y. Kojim, A. Okada, T. Kurauchi, and O. Kamigaito, J. Mater. Res., 8, p. 1174-1178 (1993)
10.A. Okada, A. Usuki, T. Kurauchi, and O. Kamigaito, ACS
Symposium Series, 585, p. 55-65 (1995)。
11.E. G. Ralph, 'Clay mineralogy'. 2nd ed, New York:
McGraw-Hill.p. 77-92 (1968)。
12.H. L. Tyan, Y. C. Liu, and K. H. Wei, Polymer, 40, p. 4877-4886 (1999)
13.R. E. Grim, 'Clay mineralogy'. 2nd ed, New York: McGraw-Hill. (1969)
14.Y. Fukushima and S. Inagaki, J. Incl. Phenom., 5, p. 473-482 (1987)
15.江選雅，聚醯亞胺的合成及其在LCD 上的應用，化工資訊月刊,Vol.13,No.7,43~53(1999)
16.W.M., I.M. Robinson, British Pat. 570858;U.S. Pat.2710853(1955)
17.M.K.Ghosh, K.L.Mittal, Polyimides, Fundamentals and applications, 1~6,Marcel Dekker,Inc.(1996)。
18.林金雀，聚醯亞胺薄膜全球市場及應用現況，化工資訊月刊，
Vol.13,No.7,58~62(1999)。
19.陳立閔，含矽聚醯亞胺之合成研究，國立成功大學化工研究所碩士論文(2000) 。
20.T. T. Serafini, P. Delvigs and W. B. Alston, PMR-15 Polyimides review and update, NASA TM-82821, Washington D.C.(1982)。
21.N.A.Adrova, M.I.Bessonov, L.A.Laius and A.P.Rudakov,
Polyimide：A new class of thermally stable polymers(in Russian),Nauka, Leningrad (1968)。
22.T.Takekoshi, J.E.Kochanowski, US patent 3,833,546, General Electric Co.(1974)。
23.T.Takekoshi, J.E.Kochanowski, US patent 3,905,942, General Electric Co.(1975)。
24.W.F.Gresham, M.A.Naylor, US patent 2,731,447 (1956)。
25.T.T.Serafini, P.Delvigs and G.R.Lightsey, Thermally stable polyimides from solutions of monomeric reactant, NASA Technical Note D-6611 (1972)。
26.T.T.Serafini, P.Delvigs and W.B.Alston, PMR-15 Polyimides review and update, NASA TM-82821, Washington D.C.(1982)。
27.R.A.Meyers, A novel condensation polymerization, AmChem.Soc., Polym. Prepr., Vol.10, No.1, 186~192(1969)
28.W.M.Alvino, L.E.Edelman, Polyimides from diisocyanates,dianhydride and tetracarboxylic acids, J. Appl. Polym. Sci.,Vol.19, No.11, 2961~2980 (1975)。
29.G.D.Khune, Preparation and properties of polyimides fromdiisocyanates, J. Macromol. Sci., Polym. Chem. Ed.,
Vol.18,No.6,1905-1909 (1980)。
30.K. Yano, A. Usuki, and A. Okada, J. Polym. Sci., A, Polym. Chem., 35, p.2289-2294 (1997)。
31.J. Y. Wen and G. L. Wilkes, Chem. Mater. , 8, p. 1667-1681 (1996)。
32.Akelah, A., Moet, A., J. App. Polym. Sci., : App. Polym. Sym.,Vol.55,153 (1994)。
33.Zilg, C., Thomann, R., Miilhaupt, R., Finter, J. Adv. Mater.Vol.11,49 (1999)。
34.LeBaron, P. C., Wang, Z. S., Pinnavaia, T., Appl. Clay Sci.Vol.15,11 (1999)。
35.K. Yano, A. Usuki, A. Okada, T. Kurauchi, and O.Kamigaito, J. Polym.Sci., A, Polym. Chem., 31, p.
2493-2498 (1993)。
36.Lan, T., Kaviratna, P. D., Pinnavaia, T., J. Chem.
Mater., Vol.6,573 (1994)。
37.賴宏仁, 工業材料, 153 期, 94 (1999)。
38.郭俊鑫, 工業技術研究院材料研究所, 1-4 (2000)。
39.Yaw Terng Chern, Chin Min Huang and Shih Chieh Huang, Synthesisand Characterization of new poly(amide-imide)s Containing 4,9’-diamantane moieties in the main chain, Polymer Vol.39,No.13, 2929－2934 (1998)。
40.T. Lan; P. D. Kaviratna; T. J. Pannavaaia， Chemistry of Materials,Vol.6，573 （1994）。
41.Z. K. ZHU; Y. Y. Yang; Journal of Applied Polymer Science，Vol .73，2063-2068（1999）。
42.Wang， F. S. ; Qi，Z. N. In Proceedings of the 1997 Chinese National Symposium on Polymers， Hefei，Oct.，p. f97. （1997）。
43.T. Agag; T. Koga; T. Takeichi，Polymer Vol. 42 ，P 3399-3408（2001）
44. A. GU; S. W. KUO; F. C. CHANG，Journal of Applied Polymer Science，Vol. 79. P 1902-1910 （2001）。
45.Z. M. Liang; J. Yin; H. J. Xu，Polymer Vol. 44，P1391-1399 （2003）。
46. J. H. CHANG; D.K. PARK; K. J. IHN，Journal of Applied Polymer Science，Vol. 84. P 2294-2301 （2002）。
47. 余安平，含萘環聚醯亞胺之合成研究，國立成功大學化工研究所碩士論文 (1990)。