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研究生: 葉祐名
Yeh, Yu-Ming
論文名稱: 三維結構之室溫二氧化鈦氣體感測器製作與研究
A Room Temperature TiO2-based Gas Sensor with Three-Dimensional Structure
指導教授: 張守進
Chang, Shoou–Jinn
學位類別: 博士
Doctor
系所名稱: 電機資訊學院 - 微電子工程研究所
Institute of Microelectronics
論文出版年: 2025
畢業學年度: 113
語文別: 英文
論文頁數: 101
中文關鍵詞: 二氧化鈦三維氣體感測器
外文關鍵詞: TiO2, Three-Dimensional, Gas Sensor
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  • 摘要 I Abstract III Acknowledgement V Contents VI Figure Captions VIII Chapter 1 Introduction 1 1-1 Background and Motivation 1 1-2 Overview of Metal Oxide 3 1-3 Overview of Metal Oxides for Gas Sensing Applications 3 1-4 Overview of Microstructural Engineering Strategies for Enhancing Gas Sensor Performance 5 1-5 Organization of Dissertation 7 Chapter 2 Experimental and Relevant Theory 10 2-1 Using advanced packaging process technologies 10 2-1-1 Through-Silicon Via (TSV) 11 2-1-2 Wafer Thinning 12 2-1-3 ALD Thin Film Deposition 13 2-2 The theory of Gas Sensor 14 2-2-1 Principle of Semiconductor Gas Sensors 14 2-2-2 Enhancing Gas Sensing Properties through Engineering 15 2-3 Gas sensing mechanisms of n- and p-type oxide semiconductors 16 2-3-1 n-Type Gas Sensors 16 2-3-2 p-Type Gas Sensors 17 2-4 Engineering the Electrical Conductivity Type of TiO₂ Thin Films via Atomic Layer Deposition: Growth Mechanisms of n-Type and p-Type Characteristics 18 2-4-1 Origin of Intrinsic n-Type Behavior in TiO₂ 19 2-4-2 Growth Conditions and Optimization for n-Type TiO₂ 19 2-4-3 Strategies for Achieving p-Type TiO₂ 21 Chapter 3 A Room Temperature TiO2-based Ammonia Gas Sensor with Three-Dimensional Through-Silicon-Via Structure 23 3-1 Introduction 23 3-2 Experimental Procedure 24 3-2-1 Sample preparation 24 3-2-2 Instrumentation 25 3-3 Results and Discussion 26 3-4 Summary 30 Chapter 4 A TSV-structured room temperature p-type TiO2 Nitric oxide gas sensor prepared by the Bosch and the ALD process 38 4-1 Introduction 38 4-2 Experimental Procedure 40 4-2-1 Sample Preparation 40 4-2-2 Instrumentation 41 4-3 Results and Discussion 42 4-4 Summary 46 Chapter 5 TiO2-based Nitrogen Dioxide Gas Sensor with Transparent Ordered Micro-Hollow Bump Structure Prepared by 3D Heterogeneous Integration Technology 53 5-1 Introduction 53 5-2 Experimental Procedure 55 5-2-1 Sample preparation 55 5-2-2 Instrumentation 56 5-3 Results and Discussion 57 5-4 Summary 63 Chapter 6 Conclusions and Further Recommendations 72 6-1 Conclusions 72 6-2 Future work 73 References 76

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