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研究生： 吳冠穎
Wu, Guan-Ying
論文名稱： 鍍銦錫光伏銅導帶模組微觀組織特性與通電機制研究
A Study on Characteristics of Microstructure and Electrical Mechanism of In-Sn Coated Photovoltaic Copper Ribbon Modules
指導教授： 洪飛義
Hung, Fei-Yi
呂傳盛
Lui, Truan-Sheng
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2018
畢業學年度： 106
語文別： 中文
論文頁數： 85
中文關鍵詞： 光伏導帶(銲帶) 、銦合金 、銀膠 、通電 、介金屬化合物
外文關鍵詞： Photovoltaic ribbon, In alloy, Ag paste, Intermetallic compound
相關次數： 點閱：112  下載：2 
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    • 本研究為探討矽基板正面銀膠減量的狀況下光伏模組的可行性，並選用金屬純In取代一般常用的銲錫材料做為光伏模組的銲料層，考量到純In價格較昂貴，以靠近In-Sn共晶組成且低熔點(120℃)的In-50Sn合金做為另一研究銲錫材料。
    　　研究結果顯示純In光伏模組與In-50Sn光伏模組經通電實驗後，純In光伏模組的介金屬化合物 (Intermetallic compound, IMC)厚度有上升趨勢，In-50Sn光伏模組的IMCs則穩定無顯著成長且電阻值較純In光伏模組低，因此針對性質較佳的In-50Sn光伏模組做更進一步的長時間七天通電實驗，確認在In-50Sn光伏模組由於Sn層堆積在AgIn2上抑制其成長，使得導電性穩定不下降。
    　　由於光伏模組是以一端回銲在矽基板正面一端在背面的方式串聯起來，研究第二部分為探討光伏導帶回銲在矽基板背面的電性，結果可得背部界面微觀組織與電性變化趨勢皆與正面相仿，唯背面IMCs厚度較正面薄，因此導電性較佳。
    　　In-50Sn光伏模組導電性較純In光伏模組佳，且沒有一般無鉛銲銲錫材料會因界面IMCs成長導致電阻值上升的缺點，使光伏模組不會隨著應用時間越長電性越差，由研究結果認為In-50Sn光伏導帶為具發展與前瞻性的光伏模組應用性。

    This is a study on the applicability of reduced Ag paste of wafer. Reducing Ag paste may lower the wettability and conductivity of photovoltaic modules (P.V. modules), so this study chooses In as solder in P.V. ribbon. However, there is high cost of In. According to the eutectic point of In-Sn phase diagrams, the study also chooses In-50Sn alloy as the other solder material.
    The result showed that the IMCs of In modules will grow after current test, the resistance also become higher because of thick IMCs. But the IMCs of In-50Sn modules remain constant after current test. There are good conductivity and stable IMCs in In-50Sn modules, so the study chose In-50Sn modules to do further experiment, which prolonged the time of current test to 7 days, ensuring that the IMCs of In-50Sn modules do not grow obviously. As the result, this characteristic is true.
    To connect each P.V. modules, P.V. ribbons will be reflowed on front side and reverse side of wafer respectively. The second part of this study is to investigate the conductivity of reverse side of wafer. According to the results, the microstructure and growing tendency of resistance are almost the same as front side of wafer. The thickness of IMCs is thinner than front side of wafer, so the conductivity is better.
    The conductivity of In-50Sn coated modules is better than In coated modules. The common disadvantage in most Pb-free solder modules is over growing of IMCs, which will decay the function of P.V. modules. However, this disadvantage doesn’t exist in In-50Sn modules. In-50Sn alloy may be a potential material as Pb-free solder in P.V. modules.

    中文摘要 I 英文延伸摘要 II 致謝 X 目錄 XI 圖目錄 XIV 表目錄 XVII 第一章 前言 1 第二章 文獻回顧 3 2-1 銲錫合金應用與無鉛化發展 3 2-2 光伏導帶於太陽能電池的應用 3 2-2-1 太陽能電池介紹 3 2-2-2 光伏導帶對太陽能模組的影響 4 2-3 應用於光伏導帶之無鉛銲錫 5 2-3-1 Sn-Ag與Sn-Ag-Cu合金 5 2-3-2 Sn-Cu合金 6 2-3-3 純In 7 2-3-4 In-Sn合金 8 2-4 接合材之界面反應動力學 8 2-4-1 純In與光伏模組界面行為 9 2-4-2 In-Sn合金與光伏模組界面行為 10 2-5 光伏模組剝離力實驗可靠度評估 10 2-6 通電試驗對光伏模組之影響 11 2-7 研究目的 11 第三章 實驗步驟與方法 21 3-1 光伏銅帶模組製備 21 3-1-1 鍍In基光伏銅帶製作 21 3-1-2 光伏模組製作 22 3-2 光伏銅帶模組界面微觀組織分析 22 3-3 光伏銅帶模組剝離力測試 23 3-4 光伏銅帶模組通電測試 23 3-4-1 通電實驗方法 23 3-4-2 體電阻量測 24 3-4-3 通電試片微觀組織分析 24 第四章 實驗結果與討論 31 4-1 熱浸鍍純In光伏銅帶模組 31 4-1-1 光伏模組剝離力測試 31 4-1-2 光伏模組界面微觀組織特性 32 4-1-3 光伏模組體電阻及通電後界面微觀組織演化 33 4-2 熱浸鍍In-50Sn光伏銅帶模組 34 4-2-1 光伏模組剝離力測試 34 4-2-2 光伏模組界面微觀組織特性 35 4-2-3 光伏模組體電阻及通電後界面微觀組織演化 36 4-3 光伏模組背銀機制探討 37 4-3-1 光伏模組剝離力測試 38 4-3-2 光伏模組體電阻及通電後界面微觀組織變化 38 4-4 正背銀與鍍In系銅帶應用 39 4-4-1 鍍In光伏模組與In-50Sn光伏模組電性比較 39 4-4-2 正銀與背銀光伏模組電性比較 41 第五章 結論 79 參考文獻 81

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