近年來許多微奈米薄膜和微機電系統所使用之金屬與介電薄膜以及相關材料等，在微結構之應用領域展現日漸重要的趨勢。然而，這些材料之機械性質與表面物理特性必須要能夠被精確地定義，否則這些高品質材料在應用上便大受限制。奈米壓痕試驗為目前量測奈米表面機械性質的檢測技術之一，其優點為試片不需特別製作，以及量測方法之均一性與簡易性，同時具有量測及掃描表面形貌的功能。然而，此方法的基本實驗資料僅提供了施力與壓痕深度關係，至於如何將這些量測之物理量轉移成機械性質，仍必須仰賴精確的力學模擬。本文以Cheng與Cheng所提之因次分析法為基礎，此方法幫助我們簡化系統之控制變數的數量，同時減少理論推導與實驗進行之複雜度，以更簡單、容易的技巧發展與建立該系統之物理模型。接著利用有限元素法模擬進行軟體實驗，明確地找出各參數與實驗結果間之相依性。根據此分析流程，我們成功地擴展了奈米壓痕技術的應用範圍，分別為殘留應力、潛變與應力鬆弛特性三個力學轉換模型。除了楊氏係數和硬度，我們還可以由奈米壓痕試驗量測材料之殘留應力以及應力指數與潛變活化能。對於黏彈性質較單純的材料，我們同樣也可以由壓痕試驗得到材料之鬆弛時間。此外，由基材效應的研究結果，我們發現一般常用之經驗法則可獲得較保守的材料性質。在壓痕裂縫方面則提供一個簡易評估材料破壞程度的方法，得知裂縫成長之相關重要因素。

　Nanoindentation test is one of the most popular techniques to measure the mechanical properties of the micro- or nano-structures such as the metal or dielectric thin films. This material test scheme is very simple, and it even does not require special processing for specimens. However, the experimental data can only provide the relationship between applied load and penetration depth, and we must transfer those physical quantities to the mechanical properties by appropriate mechanics, in which Oliver and Pharr’s models are considered. However their models are highly ideal and there are still a lot of parameters affecting the experimental results such as residual stress, substrate effect, and indentation cracking. In this thesis, dimensional analyses are firstly used to find the governing parameters and to obtain scaling relationships via subsequent finite element analysis. By such a forward analysis procedure, we have developed three models to convert test data into desired material properties for nanoindentation tests including the effect of residual stress and the viscoelastic properties of creep and stress relaxation, respectively. Those models provide useful tools for extracting specific material properties, such as residual stress, creep exponent and stress relaxation time constant. Finally, the investigation of substrate effect has shown that the traditional rule of thumb in determining the suitable test regime is restricted in the soft film/hard substrate system, and significant error was observed for hard film/soft substrate system. In parallel, the factors of indentation crack growing have also been realized by a simple case study including the loads, crack types, and the fracture toughness. In summary, by integrating the models proposed by this thesis and data from standard tests, it is not only possible to obtain the Young’s modulus and hardness but also the viscoelastic properties or the residual stress for a specific material through nanoindentation characterization. Thus increase the applicability of nanoindentation.

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