本論文藉由奈米壓印及微米柱壓力試驗探討奈米金屬多層膜之黏彈性質，首先 由濺鍍方式製作銅奈米金屬多層膜探討銅膜含“天然”氧化層及濺鍍氧化層的差異，進而了解金屬多層膜的力學性質及變形機制，此外本文量測壓克力(PMMA)、不鏽鋼(304 stainless steel)、環氧樹脂(epoxy)、銅基玻璃基屬(metallic glass)和silicon (100)材料的奈米壓印性質；而另一個探討的主題為在奈米濺鍍金屬薄膜上，使用雙束型聚焦離子束(DB-FIB)來挖取微米柱(micro pillar)，使得金屬薄膜上產生微米柱的結構，運用壓痕試驗研究奈米尺度下的柱效應；第三個主題為不同的材料由奈米壓痕來測驗潛變的效應和微米柱的潛變行為。奈米薄膜與奈米複合材料的主要量測方法為奈米壓痕試驗(nano-indentation test)，奈米壓痕試驗為目前奈米表面力學性質的量測技術之ㄧ，壓痕主要是在奈米尺度下，在固定探針(tip)施加力於薄膜使其破壞的技術，可以即時記錄壓痕負載與壓痕深度，並且進一步的計算出材料的硬度(hardness)、彈性模數(elastic modulus)與黏彈性質(viscoelasticity)等等；壓痕的理論發展主要由Oliver與Pharr兩者根據連體力學所建立的力學模型，藉由負載及壓深的實驗量測材料的硬度與楊氏模數，而固體間彈性接觸力學的理論發展則為Hertz所提出。由奈米壓痕試驗可以發現銅奈米金屬多層膜比塊材銅楊氏模數相當但硬度提升，微米柱的力學性質在相對塊材上面應力明顯提升，銅奈米金屬多層膜銅膜含”天然”氧化層及濺鍍氧化層硬度明顯提升但楊氏模數下降，可以發現單層膜的楊氏模數為150 GPa硬度為2.5 GPa，多層銅的楊氏模數為150 GPa硬度為3 GPa，多層氧化銅的楊氏模數為 50 ~ 60 GPa硬度為 4 ~4.5 GPa，PMMA楊氏模數為5.5 GPa硬度為0.3 GPa，Silicon (100)楊氏模數為200 GPa硬度為14.5 GPa，epoxy楊氏模數為3 ~ 4 GPa硬度為0.1 ~ 0.2 GPa，metallic glass 150 GPa硬度為6 GPa，由奈米壓痕潛變的實驗可以知道PMMA的n值為4.6而單層銅為0.7在停滯力為3 mN下，奈米壓痕潛變實驗多層銅的n值為16.9而單層銅為1.0在停滯力為10 mN下，奈米壓痕潛變實驗多層銅的n值為835.3而單層銅為1.1在停滯力為25 mN下，在微米柱的潛變試驗可以發現在多層氧化銅微米柱的n最小為7.5而最大為154.1；由實驗潛變實驗可以發現每個材料的n值都隨著停滯力量的增加都有顯著的提昇。

The aim of this study is to perform nanoindentation and micro-compression experimental tests to study the mechanical and viscoelastic properties of nano-layered metallic thin films. The nano-layered thin films were prepared with RF magnetron sputtering technique, and consisted of copper (Cu) and “native” copper oxide. For comparisons, single-layer copper and multilayers that contain copper and “deposited” copper oxide were tested. In addition to metallic multilayers, other materials, such as PMMA, 304 stainless steel, epoxy, metallic glass and silicon, are also studied for verification of testing methodology and comparison in their time-dependent mechanical properties. Two testing techniques are adopted. One is the conventional nanoindentation test, established by Oliver and Pharr, and the other is the micro-compression test on micropillars. Micropillars are milled with the focus ion beam (FIB) technique, and are subsequently compressed by nanoindenter with a flat tip for introducing uniform compressive stress. It is found that the nanoindentation hardness of Cu/Cu multilayers is larger than that Cu single layer, as well as the modulus of multilayers. For the indentation modulus and hardness of the tested materials, the Cu single layer (1 micron thick) exhibits a modulus of 150 GPa and hardness of 2.5 GPa, Cu/Cu multilayers shows a modulus of 155 GPa and hardness of 3 GPa, Cu/Cu2O a modulus of 50 ~60 GPa and hardness of 4 ~ 4.5 GPa, PMMA a modulus of 5.5 GPa and hardness of 0.3 GPa, silicon (100) modulus of 200 GPa and hardness of 14.5 GPa, steel a modulus 200 GPa and hardness of 6 GPa, epoxy a modulus 3 ~ 4 GPa and hardness of 0.1 ~ 0.2 GPa, Cu-based metallic glass a modulus of 150 GPa and hardness of 6 GPa. The indentation creep exponent n for Cu/Cu multilayers is to be 4.6, and is 0.7 for Cu single layer at tip load being 3 mN. In addition, the indentation creep exponent for Cu/Cu multilayers is 16.9, and for Cu single layer it is found n is equal to 1.0 at 10 mN tip load. Furthermore, the indentation creep exponent for Cu/Cu multilayers is 835.3 and that of Cu single layer is 1.1 at 25 mN tip load. As for Cu/Cu2O micropillars, their uniaxial compression creep exponent is found to be 7.5 (minimum) and 154.1 (maximum) at 0.01 mN tip load. Overall, it is found that, for all the materials tested, including Cu single layer, Cu/Cu multilayers, Cu/Cu2O multilayers, silicon (100) and PMMA, their creep exponents increase with tip load.

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