本研究的主旨在於開發YAG:Ce散熱螢光陶瓷板，期望未來能採用此一陶瓷材料，直接貼合LED晶片或是固定於晶片上方的新型高功率LED封裝技術，來減少螢光層所產生的熱阻，取代目前白光LED螢光層封裝的方式，進一步增加LED之散熱效率，延長其使用壽命。

而本研究首先參考本實驗室已發展之固態反應法製備Y2.95Al5O12:Ce0.05，包括粉體配製、壓胚與燒結，將壓胚後之螢光陶瓷板進行切割及機械研磨加工，並探討機械研磨加工影響螢光陶瓷板之結晶結構及發光性質。研究結果發現機械研磨後，螢光材料中無雜相與波峰偏移現象，表示機械研磨對於螢光陶瓷板未導致明顯缺陷，然而利用不同粗糙度砂紙研磨後發現，當螢光陶瓷板之出光面，經表面處理後可以提升出光效果。

另一方面，利用CO2雷射將機械研磨後之螢光陶瓷板進行鑽孔，以不同雷射功率、掃描速度及掃描時間探討孔徑、熱影響區域、晶體結構及發光性質。研究結果發現雷射功率90% (45W)、雷射速度20% (180mm/sec)時之孔徑大小為最接近設定參數100um，熱影響區域小及掃描時間較短等之優勢。雷射鑽孔後螢光陶瓷板發光效率會降低，在總面積36mm2，孔洞量為16時，PL積分強度降低率為12%，隨著孔洞量越多PL積分強度降低率越大，但孔洞可以提升螢光陶瓷板之藍光出光效果，可用來調整光學效果。

最後將鑽孔後之螢光進行填補導熱銅膠材料，並探討其填補後之螢光陶瓷板發光與熱傳性質。研究結果發現，螢光陶瓷板填補銅膠材料後，發光性低於雷射鑽孔前後之樣品，在36mm2面積下孔洞量為16時，PL積分強度降低率為30%，然而雷射鑽孔填補後，加熱板及熱電偶直接溫度差異越小，溫差降低率為30.4% 低於雷射鑽孔前樣品，所以表示填補後之樣品熱傳導率會高於鑽孔前之樣品。

This study is to fabricate the YAG:Ce heat dissipation phosphor ceramic plate used for the new LED packaging technology. In order to reduce thermal resistance of the phosphor, the heat dissipation phosphor ceramic plate of YAG:Ce was utilized to be attached to the chips directly or be fixed around the chips. This method can substitute for the current phosphor layer packaging technique and prolong the lifetime of LED by improving the ability of heat dissipation.

At first, this study refer to the solid-state reaction method that has been developed in our laboratory. YAG:Ce phosphors with stoichiometric Y2.95Al5O12:Ce0.05 is prepared by solid state reaction method. Then, using mechanical grinding to polish the YAG:Ce phosphors ceramic and investigate mechanical grinding effects luminescence properties and crystallinity of the phosphor ceramic plate. The results showed that the crystallinity of the phosphor ceramic plate has no impurity phase, no peak shift, so after mechanical grinding YAG ceramic plate has no defects. After the surface textured of the light extraction part of YAG ceramic plate, luminous properties of light extraction increased with the grinding of low abrasive papers number than higher one .

On the other hand, the study uses CO2 laser to drilling the phosphor ceramic plate and investigate CO2 laser power、speed and scanning time effect hole diameter、size of heat affected zone (HAZ), crystal structure and the luminous properties. The results showed that laser power 90% (45W)、speed 20% (180mm/sec) has the advantages of setting hole diameter (100um) , smaller heat affected zone and less scanning time. After laser drilling YAG ceramic plate, the luminous efficiency will be decreased, by drilling 16 holes at the sample area of 36mm2, the integral intensity decrease 12%, as the amount of hole increase, the integral intensity decrease but the hole can enhance the optical properties of the YAG ceramic plate.

Finally, to investigate luminescence properties and thermal conductivity of filling YAG:Ce ceramic plate. The results showed that after filling high thermal conductivity materials in YAG ceramic plate, the PL integral intensity decreased, by filling 16 holes at the sample area of 36mm2, the integral intensity decrease 30%, but the thermal different between heat plate and thermocouple is decrease 30.4% that showed the thermal conductivity increased.

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