IC封裝的注模膠封製程(in-mold cure)中，EMC在模具內僅初凝固成形，在材料各層的熱膨脹係數(coefficient of thermal expansion)不同、EMC未熟化完全、材料在熟化過程產生的收縮(shrinkage)情形等等諸多因素的影響之下，成品會有翹曲(warpage)的現象發生，所以必須經由後熟化製程(post-mold cure)來進行調和。後熟化製程的目的，除了使交連反應更趨近於完整之外，在高溫烘烤之下以重物壓整的過程中也會改善產品的翹曲情況。由於成品中EMC含量所佔比例很高，故其楊氏模數在CAE分析上將會是重要的參考參數。本論文主要研究EMC在整個熟化過程中，其楊氏模數與熟化度、溫度及時間關係的演化，利用DSC熱分析儀與PVTC試驗機所測得實驗結果，分析後建構成數學模型，期望將來能應用於IC封裝製程的分析，以及最佳製程的設計。

　　EMC (epoxy molding compound) is used to encapsulate IC in electronic packaging fields. One critical issue for manufacturing of IC packaging is the warpage induced during the molding process. In order to minimize the warpage, process-dependent material models should be established first. In this paper, a cure-dependent elastic model is established to describe the evolution of material properties during the curing process of a thermosetting polymer. The elastic modulus model is built by way of two experiments. On purpose of finding the relation between temperature, curing time and conversion, a curing kinetic model is constructed from the DSC experiment. Then a new measuring method is adapted to obtain the elastic modulus by using the PVTC tester. Finally, a cure-dependent elastic modulus model is established and all experiment results can be predicted precisely.

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