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研究生: 謝正遠
Hsieh, Cheng-Yuen
論文名稱: 以不同濺鍍功率與退火溫度成長氧化鋅及其螢光光譜研究
Photoluminescence studies on ZnO grown by different sputtering power and annealing temperature
指導教授: 田興龍
Tien, Shien-Long
學位類別: 碩士
Master
系所名稱: 理學院 - 光電科學與工程研究所
Institute of Electro-Optical Science and Engineering
論文出版年: 2007
畢業學年度: 95
語文別: 中文
論文頁數: 29
中文關鍵詞: 濺鍍功率退火溫度
外文關鍵詞: sputtering power, annealing temperature
相關次數: 點閱:49下載:2
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  • 本實驗先利用射頻濺鍍方式在10mtorr的壓力下以不同濺鍍功率

    (150W~210W)成長鋅薄膜,之後在大氣下以不同溫度退火(900°C

    ~1200°C)將鋅薄膜氧化成為氧化鋅薄膜。接著我們對這些樣品作光

    激發螢光光譜(photoluminescence,PL)與掃描式電子顯微鏡

    (scanning electron microscope,SEM)的分析,得知濺鍍功率在

    150W及1000˚C退火時的樣品為最好。

    此外,由此樣品之低溫PL可以得到Varshni equation中,受中性施

    體束縛之束縛態激子之α、β分别為0.9 meV/K、680K;而施體到

    受體之躍遷(donor state to acceptor state transition)之α、

    β分別為0.9 meV/K、645K。

    In this study, ZnO films grown by RF sputtering method are investigated by photoluminescence and scanning electron microscope. ZnO film arises from metal Zn sputtered on substrate at different sputtering sputtering power (150~210W) and then annealed at different temperature (900~1200℃) under 1 atm. We find that the high quality ZnO was obtained at sputtering power and annealing temperature is 150W and 1000℃ respectively. The ZnO grain size increased as the annealing temperature increased. The UV intensity decreased due to radiative defect increases as the annealing temperature is too high.

    摘要……………………………………………………………….Ⅰ 致謝……………………………………………………………….Ⅲ 目錄……………………………………………………………….Ⅳ 圖目錄…………………………………………………………….Ⅵ 表目錄…………………………………………………………….Ⅶ 第一章 前言……………………………………………………..1 第二章 理論分析………………………………………………..3 2-1 光激發螢光光譜(Photoluminescence,PL)……… …3 2-2 聲子(Phonon)……………………………………………4 2-3螢光材料之光學躍遷………………………………….....5 2-4 射頻濺鍍(RF sputtering)原理…………………….....7 第三章 實驗…………………………………………..…………9 3-1 樣品製備…….………………………………………….…9 3-2 變溫PL量測……………………………………….……… 10 3-3 掃描式電子顯微鏡(SEM)……………………...…………12 第四章 實驗結果與討論……………………………………..…13 4-1 退火溫度對樣品的影響………………………..…………13 4-2 濺鍍功率對樣品的影響………………………………..…14 4-3 SEM分析……………………………………………....… 17 4-4 變溫PL光譜分析…………………………………..…..…21 第五章 結論................................................26 參考文獻…………………………………………………………. 27

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