可使用在照相手機的30萬畫素CMOS影像感測器晶片，以覆晶方式接合至玻璃基板。在此研究中提出了3種覆晶接合的設計，差異在於使用不同的金屬接合、不同的黏著膠材、ACF或NCP，及是否有金屬接合環的設計。實驗結果顯示使用ACF的封裝試片比起使用NCP的試片，其具有較佳的TCT可靠度。同時，在NCP試片中所會發生的膠材和玻璃破裂現象，並不見於使用ACF的試片中。此外，金屬接合環的設計有助於提昇金屬接點的TCT可靠度。ANSYS被用來模擬試片中的應力，而且顯示和TCT可靠度試驗一致的結果。DMA和TMA的材料偵測顯示，ACF中的玻璃轉化溫度和模數比NCP低；同時，ACF使用較低的烘烤溫度，其在溫度降低的過程中產生較低的應力，是造成這些結果的原因。

　　A 0.3 million pixels CMOS image sensor chip was assembled to a glass substrate by flip chip techniques. 3 kinds of package designs were proposed in this study. The dissimilarities among the 3 designs were in metal joints, die attach adhesives of anisotropic conductive film (ACF) or nonconductive paste (NCP), and with or without metal sealing. The experiment results revealed the samples with ACF had better reliability in temperature cycling test (TCT) than the samples with NCP. Also, the phenomena of crack at die attach adhesive and glass that occurred in the NCP system did not happen to the ACF system. The metal joints reliability was enhanced by using metal sealing. ANSYS was utilized to simulate the stress in the packages and show consistent results with the TCT reliability test. The DMA and TMA detection indicated the Tg and modulus of ACF was significantly lower than that of NCP. Also, the curing temperature used for ACF was lower compared to NCP. These factors formed lower stress to ACF system during temperature drop and caused these results.

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