本文係採用ANSYS有限元素分析軟體，利用先建立錫球的體積網格以及其上下表面之面積網格，再依序拖曳長出其他元件網格之Mapped mesh方式建立3-D構裝體模型，模擬Perimeter Array PBGA272構裝體承受-40℃到120℃範圍之間溫度循環下的變形行為。並針對最大等效應變量做分析，找出構裝體最容易受到破壞的部分，研究改變材料參數對構裝體應變的影響。再配合田口式品質設計法，考慮印刷電路板的大小、基板的大小、印刷電路板的厚度、基板的厚度、以及晶片、錫球、印刷電路板和基板的熱膨脹係數值共八個因子，配置於直交表進行實驗。計算出各因子對等效應變值的影響，進而找出最佳的參數組合，達到將低應變值的目的，以減少構裝體的受破壞的可能性。

　　We adopt the ANSYS finite element software in this thesis. At first we construct the solder ball’s volume mesh and the area mesh above and blow the surface，and than dragging mapped mesh of the other component step by step to establish 3-D assembly model and to simulate the Perimeter Array PBGA272 assembly’s deform behavior under thermal cycles in supporting the range of -40℃ to 120℃. At the same time we must consider analysis the maximum equivalent strain in order to find the weakness part of assembly，and we will understand the influence on strain by changing material properties. We can fit the Taguchi method and consider Size of PCB、Size of Substrate、Thickness of PCB、Thickness of Substrate、Coefficient of Chip、Solder Ball、PCB and Substrate eight factor to experiment in orthogonal arrays. We can calculate the effect of equivalent strain and find the best combination to achieve the target of decreasing the strain and the probability of destruction of assembly.

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