氧化銦錫靶材之表面在長時間濺鍍後，容易生成結瘤。研究顯示氧化錫添加量超過7 at.%超過固溶極限，必定在靶材中析出二次相(In4Sn3O12)，二次相之電阻率為主相之兩倍，若氧化錫分散不均勻，必然造成局部高電阻值，且團聚之粒子在燒結後會產生較大之孔洞，同樣會形成電荷積聚，而在長時間濺鍍後形成表面結瘤，並在濺鍍時產生電弧以及大顆粒噴濺，使濺鍍薄膜表面受損，影響產能。
研究結果顯示奈米粒子分散後，以檸檬酸二銨獲得最小之平均液動直徑，有效減緩奈米粒子之沉降速度，提高氧化錫之摻雜均勻性，乾燥後使粒子之堆積密度增加，燒結成陶瓷使陶瓷之密度提升，內部孔隙缺陷減少，並形成較均勻之晶相組織。旋塗薄膜之電性受氧空缺以及氧化錫之摻雜均勻性所影響，在相同之退火氛圍下，氧化錫摻雜均勻性成為影響電阻率及載子濃度之主要條件，平均液動直徑越小、消光比越高之漿料，薄膜之電阻率越低。檸檬酸二銨製備之陶瓷，其表面孔洞較少，磨除之銅無法鑲嵌在陶瓷表面與對磨件銅珠產生潤滑作用，銅珠與陶瓷表面之接觸面積隨磨耗距離增加而變大，摩擦係數大幅上升。旋塗薄膜較均勻且不易移除，銅珠與玻璃基板間之氧化銦錫粒子數量較分散性差之薄膜細小且數量較多，因此在銅珠表面留下較大面積之磨損。

The surface of the indium tin oxide target is prone to nodules after a long time sputtering. Studies have shown that if the amount of tin oxide added exceeds 7 at.% and exceeds the solid solution limit, the secondary phase (In4Sn3O12) must be precipitated in the target. The resistivity of the secondary phase is twice that of the main phase. If the tin oxide is not uniformly dispersed, it must be Causes local high resistance value, and the agglomerated particles will produce larger holes after sintering, and will also form charge accumulation, and form surface nodules, and generate arcs and large particles spray during sputtering, So that the surface of the sputtered film is damaged, affecting productivity.
The research results show that after the nanoparticles are dispersed, diammonium citrate(DAC) is used to obtain the smallest average hydrodynamic diameter, which effectively slows down the sedimentation speed of the nanoparticles, improves the uniformity of the doping of tin oxide, and increases the bulk density of the particles after drying. Forming ceramics increases the density of ceramics, reduces internal pore defects, and forms a more uniform crystal structure. The electrical properties of spin-coated films are affected by oxygen vacancies and the uniformity of tin oxide doping. Under the same annealing atmosphere, the uniformity of tin oxide doping becomes the main condition that affects the resistivity and carrier concentration. The average hydrodynamic diameter is A paste with a smaller and higher extinction ratio has a lower resistivity of the film. The ceramics prepared by DAC have fewer surface holes, and the polished copper cannot be embedded on the ceramic surface and lubricate the copper beads of the grinding parts. The contact area between the copper beads and the ceramic surface increases with the increase in the wear distance, and the friction The coefficient has risen sharply. The spin-coated film is more uniform and difficult to remove. The number of indium tin oxide particles between the copper beads and the glass substrate is smaller and larger than the poorly dispersed film, so a larger area of wear is left on the surface of the copper beads.

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