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研究生： 張哲豪
Chang, Che-Hao
論文名稱： 鍍金鈀層精細銅導線氯化及通電破壞機制研究
A Study on Chlorination and Electrical Current Induced Failure Mechanism of Fine Au/Pd-Coated Cu wires
指導教授： 洪飛義
Hung, Fei-Yi
呂傳盛
Lui, Truan-Sheng
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2020
畢業學年度： 108
語文別： 中文
論文頁數： 101
中文關鍵詞： 銅導線 、鍍層 、打線接合 、氯化 、通電循環
外文關鍵詞： copper wire, coating, wire bonding, power cycling
相關次數： 點閱：131  下載：0 
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    • 近年來，在金價持續上漲的影響下，電子封裝產業逐漸以銅基與銀基導線作為替代金導線的材料。銀線易與環境中的氧、硫、氯反應，造成濕氣腐蝕。此外，銀線易在界面形成過厚且硬脆的Ag2Al與Ag3Al等介金屬化合物，除了增加阻抗外，硬脆性也會造成接合可靠度下降。同時，銀線經過長時間使用會有嚴重的電遷移問題，導致電阻提高與機械性質劣化，甚至斷裂。本研究以銅基導線為主要材料，並將鍍鈀銅線表面電鍍一層厚度約10 nm的金薄層，製成18 μm電鍍金鈀層銅導線 (Au/Pd-Coated Cu wires, APCC wire)以有效增加銅線抗腐蝕性及改善銅線易氧化缺點，並藉由氯化與通電循環試驗，探討線材在實際應用中的可靠度問題，同時以三種不同晶粒徑之線材，探討晶粒尺寸在試驗中之效應，並分析其劣化機制。
    氯化試驗方面，APCC導線會在長時間氯化後於表面生成細微孔洞，機械性質方面，由於表面孔洞會造成拉伸強度與延性下降，最終導致線材發生脆性破裂；電性方面，則因氯化僅於表面生成細小孔洞，故對電子之主要通路影響不大，並無明顯電阻上升。在銲點部份，第一銲點在較短的氯化時間便會從接合面處剝落，主要機制是氯離子侵蝕鋁墊，並露出底部矽基板。
    通電循環試驗部份，在不同循環次數下，導線表面會產生氧化銅丘；隨著次數增加，氧化銅丘會成長為氧化銅層，並全面性包覆銅線材；最終氧化銅層上會長出奈米銅線並與線材剝離。同時，導線晶粒受通電所誘發之焦耳熱效應影響，隨著循環次數增加而逐漸上升，線徑也因銅原子擴散至表面產生氧化而逐漸縮小。當晶粒成長至線徑大小時，由於該位置強度較低，造成線材因通電循環所產生的疲勞效應而斷裂失效。APCC導線由於鍍層作用，確能有效提高線材的抗氯化能力，並針對線材與銲點進行解析，了解其氯化後之劣化機制；通電循環部份則解析不同循環次數下，微觀組織的演變與失效機制，相關成果可提供線材封裝應用製程參考。

    In this research, gold and palladium layers are electroplated on the surface of copper wire as Au/Pd-coated wires (APCC wire) to improve corrosion resistance and to enhance oxidation resistance. Chlorination test and power cycling test are conducted to discuss the difficulties in practical application and to reveal their deterioration mechanism. At the same time, three kinds of APCC wires with different grain sizes are used to explore the effect of grain size in the experiment.
    In chlorination test, both tensile strength and elongation decrease since chloride ions attack the surface of wires. However, if comparing APCC wires to those of Pd-coated and pure copper, the coating layer still has a significant impact on the improvement of corrosion resistance.
    In power cycling test, voids appear on the interface of Pd layer and copper matrix. As the number of cycle increases, grain growth are induced by Joule’s heat, which is produced by high current density. Besides, repeated thermal expansion effect results in fatigue which makes the whole system fail.

    中文摘要................................................ I Extended Abstract.................................... . III 誌謝................................................... XVI 目錄................................................... XIX 表目錄............................................... XXIII 圖目錄................................................ XXIV 第一章 前言............................................. 1 第二章 文獻回顧......................................... 3 2-1 打線接合製程...................................... 3 2-1-1 接合工具...................................... 4 2-1-2 接合技術...................................... 5 2-2 放電結球製程...................................... 6 2-2-1 成球外觀與線材微觀組織......................... 7 2-3 影響接合強度之因素................................. 8 2-4 接合導線材料...................................... 9 2-4-1 鋁線.........................................10 2-4-2 金線.........................................11 2-4-3 銀基導線......................................11 2-4-4 銅基導線......................................12 2-4-5 電鍍金鈀雙層銅導線.............................13 2-5 氯化試驗..........................................14 2-6 通電試驗..........................................14 2-7 研究目的..........................................15 第三章 實驗步驟與方法....................................21 3-1 放電結球與打線接合.................................21 3-2 表面形貌與微觀組織觀察.............................22 3-3 I-V曲線電性量測...................................22 3-3-1 線材I-V曲線電性量測...........................22 3-3-2 接合I-V曲線電性量測...........................23 3-3-3 通電拉伸試驗..................................23 3-4 拉伸試驗..........................................24 3-4-1 線材拉伸試驗..................................24 3-4-2 頸部拉伸試驗..................................24 3-4-3 第一銲點拉伸試驗..............................25 3-5 氯化試驗..........................................25 3-5-1 線材氯化試驗..................................25 3-5-2 第一銲點氯化試驗..............................26 3-6 通電循環試驗......................................26 3-6-1 線材通電循環試驗..............................26 3-6-2 第一銲點通電循環試驗...........................27 第四章 結果與討論.......................................34 4-1 鍍金鈀層銅導線微觀組織特性.........................34 4-2 氯化對鍍金鈀層銅導線之影響.........................34 4-2-1 氯化後線材拉伸性質調查.........................34 4-2-2 氯化後線材拉伸破斷形貌特徵.....................35 4-2-3 氯化後線材I-V曲線量測..........................36 4-2-4 氯化後第一銲點之接合界面解析....................36 4-3 通電對鍍金鈀層銅導線組織與拉伸性質之影響.............37 4-3-1 不同通電循環次數下表面形貌與微觀組織比較.........38 4-3-2 通電拉伸後線材表面形貌與微觀組織分析............40 4-4 放電結球特性分析..................................41 4-4-1 結球外觀與微觀組織.............................41 4-4-2 鍍金鈀層銅導線球部元素分佈.....................41 4-4-3 鍍金鈀層銅導線接合強度分析.....................42 4-5 通電循環對鍍金鈀層銅導線打線接合性質探討.............42 4-5-1 第一銲點經不同通電參數之通電循環試驗後I-V曲線量測43 4-5-2 第一銲點通電循環試驗後I-V曲線量.................44 4-5-3 第二銲點通電循環試驗後I-V曲線量測...............46 4-6 綜合討論..........................................47 4-6-1 氯化機制......................................47 4-6-2 通電循環機制..................................47 4-6-3 通電拉伸機制..................................48 4-6-4 通電循環後之電性變化...........................48 第五章 結論.............................................93 參考文獻................................................95  

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