本研究以不同Ag含量(3Ag及4Ag，為重量百分比)與球徑(0.30mm及0.76mm)之錫球迴銲後去探討推剪力與微觀組織，再選成份3Ag球徑0.76mm之錫球進行不同迴銲製程變化，去看其推剪力與微觀組織之變化，並將以上推剪力做韋伯分析。
實驗結果顯示Sn-xAg-0.5Cu (x=3、4) 不同球徑之錫球經迴銲溫度245℃迴銲一次後，當球徑越大時，因其破壞路徑增加，推剪力也隨之增加，同一球徑不同Ag含量比較時，雖組織有變化，但推剪力變化不大﹕從推斷後組織觀察，發現破壞發生於球體內，而非界面處，可知錫球與基板經迴銲後已確實接合，也因此知推剪力變化與界面組織無明顯關係，並藉由界面層厚度觀察證實。韋伯分析顯示其m值皆大於1，破壞型態皆為磨耗破壞，從可靠度比較知0.30mm球徑的4Ag可靠度高於3Ag，而球徑0.76mm時，3Ag則大於4Ag，但推剪力大時則相差不大。在此0.30mm球徑的4Ag錫球之最小壽命大於使用標準，其餘則小於使用規範，在規範下已有破壞發生，雖所有條件之實驗值皆大於使用標準。
Sn-3Ag-0.5Cu球徑0.76mm之錫球經245℃改變迴銲次數後，結果得知當迴銲次數到達10次後，其推剪力有明顯下降，甚至低於0.76mm錫球的使用規範，但微觀組織看不出明顯差異。韋伯分析顯示迴銲10次後，數據分佈變廣，破壞型態趨近於破壞率一定型，可靠度明顯低於其他條件。經韋伯分析知R2與R3之最小壽命大於規範，相較於R1、R5及R10最小壽命小於規範，在應用上表現較佳。
改變迴銲溫度235℃~255℃迴銲一次之後，溫度235℃之推剪力數據分佈較廣，而迴銲溫度245℃及255℃之可靠度與破壞率則易集中於一推剪力範圍急速下降與上昇，最小壽命皆較規範小。
錫球經245℃迴銲一次後熱處理，推剪力分佈顯示各熱處理條件之推剪力相差不大，而破壞型態及分佈情形於各條件也相差不多，就可靠度來說，除105℃加熱8小時的條件外，其他差異不大。此實驗條件下，最小壽命皆小於使用規範，於規範下已有破壞發生、破壞率大於0及可靠度小於1的現象。

This study investigated the shear forces and microstructures between the Sn-xAg-0.5Cu (x=3、4) solder balls with different diameters (0.30mm and 0.76mm) and Cu/Ni/Au substrates after reflow soldering. And choose Sn-3Ag-0.5Cu with a diameter of 0.76mm to watch the changes of shear forces and microstructures after different reflow processes. Then the shear forces of solder ball joints had been discussed by Weibull analysis.
The experimental results show that the shear forces of Sn-xAg-0.5Cu (x=3、4) solder balls with different diameters after reflow at 245℃ for one time increase with bigger diameter. The reason of increasing shear forces is that routes of fracture increase in the ball shear test when the ball size is bigger. And compare the shear forces and microstructures of different Ag contents in the same ball size. Although the microstructures were changed, the shear forces weren’t obviously changed. Observing the cross-sectional views of the fracture surfaces after shear test shows that fracture always occurred in the bulk solder. The results of ball shear test indicated that the shear forces of the solder joints couldn’t be significantly related to the thickness of IMCs formed at the interfaces. The results of Weibull analysis here show that the Weubull modului were all wear-out failure modes. The shear forces of Sn-3Ag-0.5Cu with a diameter of 0.30mm had better reliability than Sn-4Ag-0.5Cu with the same diameter. When the diameter is 0.76mm, the result is opposite. The minimum life of Sn-4Ag-0.5Cu with a diameter of 0.30mm is above the using standard in application. Others are below the using standard. They had been broken below the standard although the shear forces were all above standard.
The shear forces of Sn-3Ag-0.5Cu solder balls with a diameter of 0.76 (3Ag76) after reflow at 245℃ for different times wouldn’t obviously descend until ten times. But the changes of microstructures were not obvious. The results of Weibull analysis here show that the distribution of the shear forces of solder balls after reflow at 245℃ for ten times is wider. It is constant failure rate and has worse reliability than others. The results also show that minimum life of the solder balls after reflow for two and three times is above the using standard.
After reflow at 235℃ for one time, the distribution of the shear forces of the 3Ag76 is wider. The failure rate and reliability of the solder balls after reflow at 245℃~255℃ for one time descend and increase rapidly in a small range. The minimum life of the solder balls after reflow at 235℃~245℃ is all above the standard.
The Weibull analyses of the shear forces of 3Ag76 after aging at 105℃ for 0~8hrs show that the failure types of the solder balls and distributions of the shear forces are similar to each other. The shear forces of 3Ag76 after aging at 105℃ for 8hrs has worse reliability. The minimum life is all below the standard.

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