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研究生: 陳泰成
Chen, Tai-Cheng
論文名稱: 微組裝系統影像伺服建模與測試
Modeling and Testing of Image-Servo Micro-Assembly System
指導教授: 張仁宗
Chang, Ren-Jung
學位類別: 碩士
Master
系所名稱: 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年: 2002
畢業學年度: 90
語文別: 中文
論文頁數: 81
中文關鍵詞: 特徵圖案圖案搜尋方式反向器動態視移影基結構微撓性夾持器間隙比
外文關鍵詞: Clearance ratio, Invertor, Dynamic Image-Based Look-and-Move structure, Pattern matching method, Micro-compliant gripper, Feature patterns
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  •   本文在微撓性夾持器尺寸上作了突破,由原尺寸2mm×1.3mm×0.2mm縮小一半約為0.87mm×0.68mm×0.2mm;在驅動器安裝上亦作了簡化,可避免反向器安裝困擾外更有助於夾持器更進一步微小化,所採用的物件尺寸長1.6mm、直徑為38μm、組裝孔內徑49μm,間隙比為0.22;製造上使用PS2000型準分子雷射加工機採用複合式加工;在置物平台上重新設計以便於承載微細物件;接著對新型微夾持器進行建模、輸入輸出模擬與測試。
      影像系統部份針對成像過程及攝影機對焦建模並對系統進行校準,並運用圖案搜尋方式抽取特徵圖案,由影像處理求特徵圖案之形心座標及幾何邊緣作為組裝資訊,並對完整組裝流程進行分析與測試,在影像伺服與馬達控制上定出基本目標功能並予以實現,並對動態視移影基結構對系統之影響作模擬。

      In this thesis, the size of a new micro-compliant gripper has been reduced from original 2mm×1.3mm×0.2mm to 0.87mm×0.68mm×0.2mm. The gripper system assembly is simplified and assembled to avoid using an invertor. The size of the assembly object is 1.6mm in length, 38μm in diameter, and the assembly hole is 49μm in diameter. The clearance ratio is 0.22. Utilizing the PS2000 excimer laser machine, the micro-compliant gripper is fabricated by synthetic modes. The object-carrying platform is also redesigned to bear the tiny object. The model of input-output displacement of the new micro-compliant gripper is constructed, simulated and tested.
      In image acquisition system, the imaging and focusing processes are modeled and calibrated. The feature patterns of image are acquired by the pattern matching method. The geometric edges and center of the object are extracted by image process and used for peg-in-hole assembly process. Analysis and test are given for the full assembly process. The objective function of the image-servo motion control is established and realized. The effect of the Dynamic Image-Based Look-and-Move structure on the micro assembly process is simulated.

    中文摘要 I ABSTRACT II 目  錄 III 圖 目 錄 VI 表 目 錄 X 表 目 錄 X 符號說明 XI 致 謝 XIII 第一章 緒論 1   1-1 引言 1   1-2 文獻回顧 2     1-2-1 微端效器 5     1-2-2 驅動器 6     1-2-3 視覺伺服 6   1-3 研究目標 8   1-4 研究方法 8   1-5 本文架構 8 第二章 微組裝系統簡介 10   2-1 微組裝系統結構 10   2-2 微組裝形式 13   2-3 物件承載基座 14   2-4 座標系統 15   2-5 夾持器簡化設計 16   2-6 微夾持器之製造與安裝流程 18 第三章 微夾持器建模、模擬及測試 21   3-1 微夾持器靜態模型 21   3-2 握持力分析 24   3-3 端校器動態建模 27     3-3-1閉合過程 27     3-3-2夾持接觸過程 31   3-4 輸入輸出之模擬與實驗 34 第四章 微組裝流程建模測試 36   4-1 微組裝目標設定 36   4-2 微組裝流程 36   4-3 微組裝流程所需之資訊量 37   4-4 微組裝流程與測試 41 第五章 影像系統模型 48   5-1 成像模型及影像系統校正 48   5-2 對焦模型模擬及測試 52   5-3 影像處理 56   5-4 圖案比對 58 第六章 影像伺服與馬達控制測試 61   6-1 影像伺服結構 61   6-2 馬達定位校準 62   6-3 功能目標 63   6-4 影像伺服與馬達控制測試流程 65   6-5 影像伺服對系統之影響 67 第七章 結論與建議 72   7-1 討論 72   7-2 未來展望與建議 73 參考文獻 74 附錄 77 自 述 81

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