本研究探討添加0-10wt%的Sb對Sn3.5Ag無鉛銲料微結構的影響，以及其與Au/Ni-P/Cu金屬層銲接後的界面微結構變化；同時利用單邊搭接(Single Lap)試件及高溫儲存來評估Sb添加量對銲點剪切強度與抗熱性的影響。
將自行熔煉之Sn-Ag-xSb銲料製成直徑約1.7mm的錫球。在銅片上面分別利用離子濺鍍與無電電鍍鍍上Au與Ni-P層，再將錫球與Au/Ni-P/Cu UBM做成單邊搭接的剪切試件，之後再進行150°C的高溫儲存處理。實驗結果顯示Sn3.5Ag銲料添加Sb低於3.85%時，Sb固溶在b-Sn中，微結構仍為Ag3Sn與b-Sn所構成的環狀結構。當Sb添加量高於3.85%時，則產生層狀的SbSn化合物；而當Sb添加至10.05%，又會再生成立方體的SbSn化合物。Sn-Ag-xSb銲料與Au/Ni-P/Cu金屬層接合後，Au會溶進銲料中使得Sn與Ni反應生成Ni3Sn4層，多餘的P原子會被往底層排形成色澤較黑的富磷(P-rich)層。界面Ni3Sn4層與富磷層厚度隨著儲存時間的增長而增厚。深腐蝕後發現剛銲接後的Ni3Sn4層形貌呈現針狀(Needle-like)或迴旋標狀(Boomerang-shape)，高溫儲存後則趨向多邊形。經高溫儲存後在界面上可發現粗大的(Cu,Ni)6Sn5以及(Ni,Cu)3Sn4之三元化合物，同時在富磷層中可發現明顯的Kirkendall Voids。Ag3Sn在經高溫儲存後會成長粗大，藉由添加Sb可以減緩Ag3Sn粗大化的現象，但添加至10.05％時，Sb原子取代Ag3Sn中的Sn原子會形成較粗大的Ag3(Sn,Sb)，故添加10.05％Sb對減緩Ag3Sn粗大是沒有助益的，反而有負面效果。
剪切測試顯示Sn3.5Ag未儲存之剪切強度為34.7MPa，添加1.73、3.85、5.12、10.05wt%Sb的剪切強度則分別為40.7、55.6、58.5、72.5MPa，剪切強度隨Sb添加量的增加而升高。高溫儲存後，所有銲點的強度隨儲存時間的增加而有顯著的下降。625小時後Sn3.5Ag強度為24.1MPa，添加1.73、3.85、5.12、10.05%則分別為29.0、42.4、42.9、51.0MPa。未經儲存之銲點破斷位置在銲料內發生；隨儲存時間增加則傾向在界面發生；此外，隨Sb添加量的提高亦容易導致破斷位置發生在界面上。而就銲點剪切強度、抗熱性與延展性而言，添加3.85% Sb則具有較佳的性質表現。

This research is to discuss the effects of the microstructure by adding 0-10wt% Sb into Sn3.5Ag lead-free solder as well as the interfacial microstructure variations of Sn-Ag-xSb solder combining with Au/Ni-P/Cu UBM. The Single Lap specimens and high temperature storage evaluate the influences of different Sb addition for the shear strength of solder joint and thermal resistance.
Sn-Ag-xSb solders that melted by us are fabricated solder ball whose diameter is 1.7mm. Au layer and Ni-P layer are coating on copper substrate individually using ion sputter and electroless plating. Solder balls and Au/Ni-P/Cu UBM are fabricated to Single Lap shear specimens and then carry out high temperature storage at 150°C. The experimental results show that Sb solved into b-Sn matrix when Sb addition into Sn3.5Ag solder is lower 3.85%. The microstructures are composed of Ag3Sn and b-Sn to form circular structure. When Sb addition is more than 3.85%, the laminal SbSn compounds are discovered. However, the cubic SbSn compounds can be found when the Sb addition exceeds 10.05%. After Sn-Ag-xSb solder are combined with Au/Ni-P/Cu UBM, Au layer would solve into solder and Sn atoms react with Ni atoms to form Ni3Sn4 intermatllic compound. Thus remainder P atoms are exhausted toward Ni-P layer to produce dark P-rich layer. The thickness of interfacial Ni3Sn4 and P-rich layer raised with thermal storage time increasing. The morphology of Ni3Sn4 compound at as-soldered appear needle-like or boomerang-shape by deep etching and the morphology transform to polygonal after high temperature storage. The coarse (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 ternary compounds are detected in the interfacial surface after high temperature storage and Kirkendall Voids are discovered apparently in the P-rich layer. Although Ag3Sn compounds coarsen after high temperature storage the Sb addition can reduce coarseness of the Ag3Sn compounds. But Sb addition reach 10.05%, Sb atoms can substitute for Sn atoms in Ag3Sn compound to form coarse Ag3(Sn,Sb) compound. Therefore, the levels of 10.05%Sb addition are harmful to reducing the coarseness of the Ag3Sn compounds.
The shear strength results show that the average shear strength of as-soldering Sn3.5Ag solder joint is 34.7MPa. The shear strength can be raised with the Sb addition increasing. The strength of 1.73, 3.85, 5.12, 10.05wt%Sb are 40.7, 55.6, 58.5, 72.5MPa respectively. The shear strength of the whole solder joint decrease distinctly after 150℃ thermal storage. After 625 hours storage the Strength of Sn3.5Ag solder is 24.1MPa. The strength of adding 1.73, 3.85, 5.12, 10.05wt%Sb are 29.0, 42.4, 42.9, 51.0MPa. The fracture position of solder joints at as-soldered occurred at the inside of solder. However, the fracture position tended to occur at the interfacial surface with storage time increasing. Furthermore, the fracture position tended to occur at the interfacial surface with the Sb addition increasing. According to the shear strength and thermal resistance and ductility, the solder adding 3.85% Sb has better behaviors.

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