在電子IC封裝製程中，封膠材料(EMC；Epoxy Molding Compound)在熟化成型過程中會與IC封裝模具表面產生黏著的現象，稱為黏著效應(Adhesion Effects)，而此黏著效應會造成IC成品在脫模過程的黏模現象，影響產品的品質與可靠度，甚至可能會破壞產品，導致封膠失敗、生產良率降低等結果。所以如何在不影響現有模具設計的前題下，能夠藉由適當的表面處理以及鍍膜選擇，來有效降低黏著效應的影響，而改善封裝生產線產能，是目前產業界及研究單位所重視的主題。
本研究將利用本實驗室所發展完成的黏著強度量測技術與黏模力檢測設備，配合一組最佳製程條件，以黏著力作為設計參數，針對九種不同的模具表面鍍層進行一系列的正向與剪向黏模力測試，找出最有效的鍍層，並得知黏模力的大小，且進行確認實驗以比較其結果，檢測實驗結果的重現性與準確性，看看若以黏著力作為設計參數對封裝模具而言是否可行。
同時，本論文也將利用此組最佳製程參數進行幾百模次的長時效連續實驗，觀察黏模力的變化趨勢，並找出最適當的清模時機，以及了解造成黏模力增大的原因，才能確實掌握清模時機，縮短清模次數與清模時間，進而增加產能，減少因黏著效應所產生的不良影響。
本論文的研究重點還有探討封膠材料EMC在不同的退冰回溫時間下對黏模力產生的影響，希望能了解EMC受到溫濕度影響的程度與黏模力變化趨勢之間的關聯性，因此針對EMC易受溫溼度影響的特性，以不同回溫時間的EMC作為控制因子去進行黏模力的測試，觀察黏模力的變化趨勢，並定義出EMC最佳的使用時間。

In integrated circuit (IC) packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occurs in the interface between EMC and mold surface. Adhesion effects can cause many problems. For example, too large an adhesion force may damage an IC during ejection and causes the package to fail and thus lower the yield rate and reliability. To get rid of the mold adhesion problems, improving the mold design and applying suitable surface treatments such as mold surface coating are the common approaches. Applying suitable surface coating approach is a more popular and practical approach. How to reduce the mold adhesion force and improve products yield rate are the main issues for packaging.
This research uses a semi-automatic EMC adhesion force test instrument that had been developed and fabricated to measure normal and shear adhesion force between the mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. One will use this instrument to measure the magnitude of adhesion force between EMC and nine kinds of various mold surface coating. And determine the most effectiveness of mold coating. This paper also discuss the issue of successive normal force test. One will use the most effectiveness of mold coating to execute the continuous normal adhesion experiment. The variation of normal force during successive molding test can be used to predict the time for mold cleaning. By wanting the total number of shots when the normal force begins to rise, one can accurately predict the number of shots for a specific kind of mold surface coating to be cleaned.
This paper also describes that effects of defrosting period on mold adhesion force of EMC. Defrosting is a process to increase the frozen EMC temperature to room temperature and stay at room temperature for some time period before molding. It is found by molding engineers that increased defrosting time period will increase the frequency of mold cleaning. But there has been no quantitative description on how much mold adhesion force increase during the defrosting process. One can use a semi-automatic EMC adhesion force test instrument to evaluate the effects of defrosting period on mold adhesion force of EMC. By measuring the adhesion force, one can quantify how much adhesion force exists between EMC and the mold surface under different defrosting periods. The influence of moisture during defrosting on the adhesion force is also discussed. Finally, one can determine the best defrosting period of EMC.

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