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研究生：	鄭仲豪 Zheng, Zhong-Hao
論文名稱：	應用相位移陰影疊紋量測高溫下晶圓的變形 Use of Phase-Shifting Shadow Moire Method to Measure the Deformation of Wafer at Elevated Temperature
指導教授：	陳元方 Chan, Terry Yuan-Fang
學位類別：	碩士 Master
系所名稱：	工學院 - 機械工程學系 Department of Mechanical Engineering
論文出版年：	2002
畢業學年度：	90
語文別：	中文
論文頁數：	71
中文關鍵詞：	相位移法、晶圓、翹曲、陰影疊紋法
外文關鍵詞：	phase-stepping, wafer, warpage, shadow-moire
相關次數：	點閱：122 下載：13
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　　陰影疊紋法為一非接觸性、非破壞性的檢測方法，可用來量測物體的面外位移，其具有全場性且架設簡單，解析度可藉由改變光柵的疏密度來調整，因此很適合於量測物體的面外變形。
　　晶圓在應用時，常需要在其上鍍上一層薄膜，鍍膜時需在高溫下進行，由於晶圓與薄膜的熱應力性質不同，當晶圓回復到常溫時會產生一翹曲量，此翹曲量對晶圓來說是一種缺陷，利用陰影疊紋法可量測出此翹曲量以便分析來改善。
　　本文設計出一相位移陰影疊紋法系統，將陰影疊紋法配合上相位移法及相位展開技術，以方便分析及增進其解析度來量測。我們利用實驗來測出此系統的誤差及偏移量，並將此系統應用於量測晶圓在不同溫度時其翹曲量的變化，可發現應用相位移陰影疊紋法非常方便用於量測晶圓翹曲量。

　Shadow moiré is a noncontact and nondestructive detecting method for measuring out-of-plane displacements, and it is also full-field and simple to setup. Changing the grating’s pitch can adjust the resolution of the method for suitable using to measure the obiect’s out-of-plane displacements.
　It usually coated a thin film on wafers for application. To coat the film must in a high temperature environment. Because the difference of thermal property between membrane and wafer, wafer produces warpage when cooling to the room temperature. It is a disadvantage. Using the shadow moiré method can measure the warpage of wafers for analysis and improve.
　This paper design a phase-stepping shadow moiré system, using phase-stepping method and phase-unwrapping technique for convenient to analysis and improve the resolution. We measure the error and bias of the system experimentally and using this system to measure the warpage change of wafers in different temperature. Application of phase-stepping shadow moiré method on measuring the warpage of wafers is very convenient.

摘要……………………………………………………………………Ⅰ
英文摘要………………………………………………………………Ⅱ
目錄……………………………………………………………………Ⅲ
圖目錄…………………………………………………………………Ⅴ
表目錄…………………………………………………………………Ⅷ
符號說明………………………………………………………………Ⅸ

第一章　緒論…………………………………………………………1
　1-1 研究背景及目的………………………………………………1
　1-2 文獻回顧………………………………………………………2
　1-3 本文架構………………………………………………………5

第二章　陰影疊紋法原理……………………………………………7
　2-1 陰影疊紋法之基本概念………………………………………7
　2-2 陰影疊紋法之原理……………………………………………9

第三章　相位移法及相位重建技術…………………………………13
　3-1 相位移法基本概念……………………………………………13
　3-2 三步相位移法基本原理………………………………………14
　3-3 Macy相位展開法基本概念……………………………………19
　3-4 Macy相位展開法基本原理……………………………………21
      
第四章　實驗設置與方法……………………………………………24
　4-1 實驗系統之組成………………………………………………24
　　4-1-1 光源照射系統……………………………………………24
　　4-1-2 數位影像系統……………………………………………24
　　4-1-3 昇溫系統…………………………………………………25
　　4-1-4 相位移陰影疊紋系統……………………………………26
　4-2 陰影疊紋法實驗設置…………………………………………27
　4-3 相位移與光柵移動距離的關係………………………………28
　4-4 試件與光柵間的平行校正……………………………………30
　4-5 相位圖雜訊濾波………………………………………………31

第五章　實驗步驟與系統實驗測試…………………………………35
　5-1 實驗步驟………………………………………………………35
　5-2 系統的精確度與偏移量的修正………………………………36

第六章　晶圓昇溫變形實驗與討論…………………………………55
　6-1 晶圓昇溫變形實驗試件………………………………………55
　6-2 晶圓昇溫變形實驗結果與討論………………………………55

第七章　結論與建議…………………………………………………65
　7-1 結論……………………………………………………………65
　7-2 建議……………………………………………………………66

參考文獻………………………………………………………………67
                                    

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校內：2004-07-22公開
校外：2004-07-22公開

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