本文依Valanis之內涵時間黏塑性理論、Lee之「決定『內涵時間塑性理論』中材料函數之一有系統方法」以及60Sn/40Pb銲錫其循環應力-應變實驗曲線，決定60Sn/40Pb銲錫內涵時間循環黏塑性本構模式，並將溫度與應變率對材料行為之影響整合在本構模式的材料參數與材料函數中，使本模式能夠進行在變動負荷及溫度條件下材料應力-應變反應之計算。

為驗證本模式之能力，本文選擇Sasaki等人之實驗為對象，分別對60Sn/40Pb銲錫在(1)定應變振幅之循環單軸負荷實驗、(2) 拉伸快/壓縮慢之定應變振幅循環負荷實驗、(3) 慢-快-慢之定應變振幅循環負荷實驗、(4) 拉伸應力保持之循環應變實驗下的材料行為進行模擬，由(1)、(2)及(3)之結果證明本模式對60Sn/40Pb銲錫循環應力-應變整體行為具有理想的描述能力，並對循環塑性應變範圍與應力範圍之值有準確的預估。對(4)而言，本文結合內涵時間黏塑性理論與Valanis及Lee之潛變動力學進行模擬，證實在合適的材料參數下此法可獲致良好的模擬結果，未來更能配合應變範圍分割法之應用預測60Sn/40Pb銲錫的疲勞壽命。

On the basis of theory of Endochronic cyclic viscoplasticity and “A systematic Method of Determining Material Function in the Endochronic Plasticity” proposed by Lee, this thesis provides a Endochronic cyclic viscoplastic constitutive model for 60Sn/40Pb solder material. All material parameters and the material function are determined from the cyclic stress-strain curve of 60Sn/40Pb solder material. By incorporating the temperature effect and rate effect into material parameters and the material function, this model can account for the cyclic stress-strain response of 60Sn/40Pb solder material under thermal cycle test.

The applicability of this constitutive model is evaluated with the simulations of material tests conducted by Sasaki et al., includes (1)Uniaxially constant strain amplitude cyclic test, (2)Fast in tension/Slow in compression constant strain amplitude cyclic test, (3)Slow-fast-slow constant strain amplitude cyclic test, (4)Cyclic strain with tensile hold time test. Simulations based on this constitutive model have a good agreement with (1), (2) and (3), proofs that it can describe the cyclic stress-strain behavior of 60Sn/40Pb solder very well. To Simulate (4), this thesis provides a method which integrates theory of Endochronic cyclic viscoplasticity with creep deformation kinetics proposed by Valanis and Lee, and shows it can account for the response of material well with suitable material parameters. In the future, it could be a great aid to the application of Strain Range Partitioning method(SRP) in predicting the fatigue life of 60Sn/40Pb solder material.

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