為了滿足近年來虛擬實境 (Virtual Reality ; VR) 、虛擬貨幣挖礦 (Mining)、自動駕駛汽車、人工智慧 (Artificial Intelligence ; AI)、5G通訊(5th Generation Mobile Networks)等需求大量高速資料運算晶片(Chip)的相關市場，在不增加產品體積又必須達成高速運算的前提之下，客戶端需求在固定的積體電路 (Integrated Circuit ; IC)空間內堆疊更多的晶片以達成高密度封裝。因此客戶所需求的晶圓(Wafer)研磨厚度也愈來愈薄，研磨後的超薄晶圓非常的脆弱，對後續封裝製程高良率的維持形成一大挑戰。
本研究主要探討晶圓研磨薄化中的去膜製程 (De-taping)。去膜製程的主要任務是將晶圓晶背研磨前，於上膜 (Taping) 製程中在晶面貼上的晶背研磨保護膠膜 (Back Grinding Tape ; BG Tape) 撕除。由於晶圓研磨薄化後的厚度低於保護膠膜的厚度，且因不同產品的晶面電路佈線設計不同，導致上膜後膠膜附著於晶面的黏著度不同。上述問題造成去膜機的去膜手臂 (Peeling Arm) 時常於去膜初期將晶圓前端拉起或將晶圓拖曳位移，進而導致去膜平台真空吸附值低於警戒設定值觸發機台機故，嚴重狀況甚至造成晶圓受損報廢。在設備機台方面，影響去膜成功與否的參數因子水準眾多。因此本研究利用特性要因圖，找出機台中可能導致去膜失敗的因子，接著利用DOE (Design of Experiement )，執行部分因子實驗設計，記錄應變數之數值，並執行二階段反應曲面設計實驗，找出去膜最適參數組合以減少去膜失敗次數，以改善去膜製程良率。實驗結果發現機故率由原本平均40%大幅下降至15%，過往該產品平均作業20片會有8片晶圓於去膜時被手臂拉起。透過最佳參數組合，執行20次驗證實驗，發現僅有3片在做作業時被拉起，作業平台前端真空平均值也由77.6千帕提升至80.32千帕，最佳化參數實驗結果相較於原作業狀況改善許多。

This research investigates the tape peeling process in wafer grinding and thinning. The task of the tape peeling process is to remove the wafer back grinding protective tape attached to the wafer surface during the tape process before the wafer back grinding. Since the thickness of the thinned wafer after grinding is lower than the thickness of the back grinding protective tape, and the circuit wiring design of the wafer of different products is different, the adhesion of the adhesive tape to the wafer after the tape is applied is different. The above-mentioned problems cause the peeling arm of the tape remover to frequently pull up the front of the wafer or drag the wafer to displace during the initial stage of tape removal, which causes the vacuum suction value of the peeling table to be lower than the warning setting value and triggers the machine failure. The serious condition even caused the wafer to be damaged and scrapped. In terms of equipment and machines, numerous parameter factors that affect the success of the tape removal. Therefore, this study adopts the fishbone diagram to find out the factors that may cause the de-taping failure in the machine, perform part of the factorial experiment design with DOE, record the value of the strain number, and perform a two-stage reaction surface design experiment to find the most adequate parameters for the tape remover to reduce the number of failures, and improve the yield of the tape peeling process.

The experimental results found that the probability of failure has significantly dropped to 15% from the original average of 40%. In the past, 8 wafers were pulled up by the arm during the removal of the tape on the average of 20 wafers of this product. Through the optimal combination of the parameters, 20 verification experiments were performed, and found that only 3 pieces were pulled up during the operation. The average vacuum at the front end of the peeling table also increased from 77.6 kPa to 80.32 kPa. The experimental results of the optimal parameters are much dramatically improved compared to the original operating conditions.

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