本研究開發二極體雷射加工系統應用於聚合物材料微鑽孔，並分析雷射斜角入射加工時，光束分佈特徵與成形孔輪廓之對應關係，藉此建立二極體雷射加工系統於三維成形之應用基礎。
利用繞射理論分析二極體雷射光之分佈特性，並以特定角度入射基材，改變雷射光能量分佈及孔形輪廓。數值計算時考慮斜面吸收率之效應，分析不同傾斜角度下PVC及PS材料之移除輪廓，並使用Fluent軟體模擬基材受熱後自由表面之流場變化。
實驗部分由光束分析儀觀察發現雷射光斑寬度在傾斜方向上隨角度增加而逐漸增加及功率密度分佈之趨勢。在PVC及PS鑽孔結果部分，發現鑽孔深度及寬度隨入射角變化之現象。實驗結果顯示不論在光束分析或是鑽孔成形輪廓，改變雷射光入射角度而產生的孔形輪廓變化趨勢與數值計算結果相符。

This research aims to develop a diode laser micro-drilling system and analyze the laser drilling process on polymer with inclination angles. It is going to investigate the relationships between the beam intensity and drilling-hole contour. The proposed laser system could be adopted in the three-dimensional machining applications in the near future.

Based on the diffraction theory, the intensity profile of the laser beam was analyzed on an inclined surface. Considering the variations of the laser absorption with incident angles, the drilling profile for PVC and PS substrates were calculated. Furthermore the free surface contours and flow fields of the laser drilling were simulated by FLUENT software.

The experimental results show the tendency of the laser intensity profile observed by the beam profiler with various inclination angles. In the drilling of PVC and PS substrate, the drilling depth and width gradually change with the inclination angles. In both experimental approaches of the beam profile and drilling-hole contour, the tendencies with inclination angle were consistent with the numerical results.

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