在電子IC封裝製程中，封膠材料(Epoxy Molding Compound, EMC)在熟化(Curing)成型的過程中與封裝模具表面產生黏著的現象，稱之為黏著效應(Adhesion effects)。而此黏著效應過大時，則會影響IC成品在脫模作業過程中產生表面破壞，進而導致封膠失敗、生產效率降低與可靠度(Reliability)不佳等結果，因此如何利用特殊的表面處理(Surface treatment)、鍍層(Coating)以及熱處理(Heat treatment)的選擇來有效的降低因黏著效應在模具表面及試片表面所產生的黏模力(Adhesion force)是目前產業界及研究單位所重視的主題。
本研究室利用本實驗室自行研究完成的自動化電子封裝黏模力檢測設備與量測技術，在過往本實驗室的研究中，量測試片的表面鍍層皆未經由預氧化處理(Pre-Oxidation treatment)，在本研究中將試片做完鍍層之後，會經由預氧化處理在不同溫度時所產生的表面氧化物以及在試片增加模穴設計後對於封膠材料黏著效應影響。本研究也將會在不同的封裝模具進行放電加工(Electrical discharge machining, EDM)與噴砂(Sandblasting)處理二種不同的表面處理配合不一樣的鍍層中再經預氧化處理後是否產生不一樣的表面氧化物以減少黏著效的的產生，進行一系列的黏模力測試。
最後，本論文也針對不同溫度的預氧化處理進行四百模次的長效性連續實驗，觀察黏模力的變化趨勢，透過線性迴歸分析(Linear regression)將實驗數據擬合出一條黏模力特性曲線(Characteristic curve)，分別將每組實驗所擬合出的特性曲線進行比對，了解在不同溫度下的預氧化處理所產生的表面氧化物對於封膠材料的黏著影響程度，用以判斷出最佳的清模時機，以及是否減少因黏著效應所產生的不良影響。

During the process of electronic IC packaging, epoxy molding compound (EMC, hereafter) in the curing process will produce the adhesive phenomenon on the surface of packaging molds called adhesion effects. If the degree of adhesion effect is too high, it will destroy the surface of IC products which are during the stripping operations and further lead to the failure of molding, low efficiency of production and low reliability of the result etc..
Therefore, the current issues that industrial fields and researchers concern about are how to utilize the special surface treatment, coating and heat treatment to effectively reduce adhesion force resulted from adhesion effects on the surface of molds and of specimens. This research uses the testing equipment of adhesion force on automatically electronic packaging and measuring technology both created by our laboratory. Based on the previous studies, the coating surface of tested specimens has not been under pre-oxidation treatment. Therefore, this research will add pre-oxidation treatment to the plated specimens to investigate the oxide created at different temperatures. Additionally, it is going to find out the effects of adhesion effects on the tested specimens with corner design. Furthermore, this study will conduct electrical discharge machining and sandblasting on different packaging molds and then to see whether these two types of coating surface produce different oxides. Besides, it will execute the series testing of adhesion force to view the oxide which will reduce adhesion effects. In the end, this research also carries out the continuous experiments on pre-oxidation treatment for 400 shots to observe the changing trend of adhesion force. Through the analysis of linear regression, the experimental data will result in a characteristic curve of adhesion force and then the researcher will compare the characteristic curve of each experiment to understand the degree to which the oxide produced by pre-oxidation treatment affects the adhesion on molding materials. Therefore, the results are able to judge the best mold clean time and to see whether the influence caused by adhesion effects was reduced or not.

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