本研究探討鈦元素的添加對於Zn-25Sn銲錫合金微觀結構、熱性質、抗氧化性以及與銅基材間潤濕性質及界面反應之影響。
微觀結構觀察顯示，鈦的添加(>0.05 wt%)在合金緩慢冷卻過程中會於晶界處形成Ti3Sn2Zn6三元化合物;熱差分析結果顯示，鈦的添加會降低Zn-25Sn合金過冷度; 熱重分析及氧化後合金表面元素分析結果顯示，鈦元素的添加在高溫氧化過程中會於合金表面生成緻密鈦氧化層，抑制合金進一步氧化，並降低其氧化速率而提升合金抗氧化能力;由潤濕天平實驗中發現具有界面化學反應之潤濕行為皆起始於潤濕反應孕育期，後續潤濕反應受潤濕反應孕育期影響;潤濕性質量測結果顯示Zn-25Sn-0.02Ti於本實驗中與銅基材間具有最佳潤濕性質;界面反應微觀結構觀察結果顯示，Zn-25Sn-xTi與銅基材間會生成Cu5Zn8及CuZn5兩種不同介金屬化合物，且鈦原子傾向聚集於銲錫與CuZn5界面，當鈦含量為0.02 wt%時，界面介金屬化合物總厚度出現極大值，隨著鈦含量增加，CuZn5厚度明顯降低而造成介金屬化合物總厚度降低;時效熱處理實驗結果顯示，添加鈦元素會降低介金屬化合物成長速率，長時間時效後界面只生成單一種介金屬化合物Cu5Zn8。

The microstructure, thermal properties, oxidation resistance and interfacial wetting behaviors of Zn-25Sn-xTi(x = 0,0.02,0.05,0.1 and 0.15) were investigated in this study. Microstructure observation of the solder alloys shows that Ti3Sn2Zn6 was formed at the grain boundary as Ti addition exceeded 0.05 wt%. The results of DSC (Differential Scanning Calorimetry) show that Ti addition reduces the undercooling of the Zn-25Sn solder. The oxidation tests indicate that the addition of Ti lowers the oxidation rate and improves the oxidation resistance by forming a dense Ti-oxide layer at the surface of the alloy during oxidation reaction. The result of wetting balance tests show that the reactive wetting of soldering exhibits an incubation period in the early stage of wetting and all the wetting reaction initiates in the incubation period. Zn-25Sn-0.02Ti shows the best wettability with Cu. Interfacial microstructure shows that CuZn5 and Cu5Zn8 were formed and Ti tended to accumulate at the Cu/solder interface then reduce the thickness of CuZn5 as Ti content exceeds 0.02 wt%. The addition of Ti supresses the growth rate of IMC during thermal aging tests. After aging, only Cu5Zn8 was observed at the interface.

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